Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

7results about How to "Achieve continuous supply" patented technology

Device for prolonging hole blowing time of bottled oxygen in submerged arc furnace

The utility model discloses a device for prolonging the hole blowing time of bottled oxygen in a submerged arc furnace. The air inlet pipes are arranged at the air inlet end of the steam pocket; the gas conveying pipe is arranged at the gas conveying end of the steam pocket and is connected with a gas supply pipeline of the submerged arc furnace; and oxygen bottles are mounted at the inlet ends of the plurality of gas inlet pipes.
Owner:JIAYUGUAN HONG DIAN IRON ALLOY CO LTD

Press-fit device for aluminum-plastic bottle cap

ActiveCN224258221UAchieve batchachieve continuous supplyFlanged caps applicationConveyor partsBottle capPlastic bottle
The utility model relates to the technical field of bottle cap pressing, in particular to a pressing device for an aluminum-plastic bottle cap. Comprising a bottom plate, a pressing assembly used for pressing bottle caps and bottle bodies is installed on the bottom plate, a conveying assembly used for conveying the bottle bodies and the bottle caps is installed on the bottom plate, and a limiting mechanism used for fixing the bottle bodies is installed on the bottom plate. A positioning assembly used for positioning the bottle body and the bottle cap is installed on the bottom plate. Through the arrangement of the conveying assembly and the positioning assembly, the conveying assembly drives bottle bodies and bottle caps to be continuously conveyed, meanwhile, the rotating mechanism drives the first electric push rod and the vacuum suction cup to achieve multi-angle rotation, the telescopic function of the electric push rod is combined, the bottle caps can be accurately sucked and adjusted to the position over the bottle bodies, manual one-by-one feeding is not needed, and the production efficiency is improved. Batch and continuous supply of bottle bodies and bottle caps can be achieved, the labor cost is reduced, and the production efficiency is improved.
Owner:HUBEI LIKANG MEDICAL MATERIALS CO LTD

High-temperature material continuous potting equipment and method

The application discloses a kind of high-temperature material continuous equipment and method of loading bowl, belong to battery material sintering forming technical field, including rack, feeding assembly and loading assembly, the loading assembly is arranged on the rack, the feeding assembly is arranged on the loading assembly, the loading assembly includes feeding bin, replacement bin and conveying roller, the feeding bin is arranged below the feeding assembly, the feeding bin is communicated with the replacement bin, the conveying roller passes through the feeding bin and the replacement bin for conveying box, can be transported and continuously loaded bowl to high-temperature material, omit the step of material reheating temperature rise, reduce the energy consumption of fired material, inert gas is used for protection when conveying material, ensure the quality of material firing.
Owner:GUANGDONG KEDA NEW ENERGY EQUIP CO LTD

An automated packaging machine for finished wire products

ActiveCN121913175Bachieve continuous supplyAdapt to the needs of large-volume continuous operationsConveyor wrappingWrapper twisting/gatheringWire rodHeat sealer
This invention provides an automated packaging machine for finished wire products, relating to the field of wire packaging technology. It includes: an outer machine with an open top section; an inner lining frame fixedly installed inside the opening; a lower support fixedly installed on the front side of the inner lining frame; a lower support cylinder fixedly installed in the middle of the lower support; and a lower support plate fixedly installed at the telescopic end of the lower support cylinder; a lifting control frame fixedly installed on the front top section of the outer machine. This invention is adaptable to the overall packaging needs of various specifications of wire. Through the coordinated operation of the rolled plastic packaging film, the double heat-sealing strip of the heat sealer, and the cutting blade, the packaging film is precisely cut, and the first basic heat seal is completed simultaneously. This provides a complete packaging function for the wire throughout the entire process, ensuring a tight fit between the packaging film and the wire roller, and achieving continuous supply of packaging film without frequent individual packaging, facilitating subsequent sealing processes, and adapting to the needs of large-scale continuous operation.
Owner:SHANDONG JINTAILONG WELDING MATERIALS CO LTD

SMT (Surface Mount Technology) positioning patch device for circuit board processing

ActiveCN224249929Uachieve continuous supplyImprove placement accuracyPrinted circuit assemblingElectrical componentsComputer hardwareSurface mounting
The utility model discloses an SMT positioning and mounting device for circuit board processing. The SMT positioning and mounting device comprises a rack, a tray feeding mechanism, a variable-pitch conveying mechanism, a double-shaft moving mechanism, a moving seat, a lifting module, a mounting head, a CCD module and a discharging and collecting mechanism, the tray feeding mechanism is used for feeding and conveying a loading tray loaded with electronic elements, and the variable-pitch conveying mechanism is used for conveying a circuit board to be subjected to surface mounting; the chip mounting head is used for mounting the electronic elements on the material carrying disc onto a circuit board, the CCD module is arranged at the side end of the chip mounting head, and the discharging and collecting mechanism is used for collecting the circuit board subjected to chip mounting. According to the utility model, continuous supply of electronic components can be realized through the charging tray feeding mechanism, the variable-pitch conveying mechanism can adapt to circuit boards of different specifications, the double-shaft moving mechanism is matched with the lifting module, the mounting precision of the chip mounting head can be improved, the CCD module can improve the identification precision of the chip mounting head, the blanking collecting mechanism can rapidly collect finished circuit boards, and the whole structure is convenient to assemble and disassemble. And the chip mounting production efficiency of the circuit board is effectively improved.
Owner:HUAGUAN TECH (HEYUAN) CO LTD