This invention discloses an ultrasonic
coupling cleaning process for
printed circuit board substrates, belonging to the field of printed circuit
manufacturing technology. The process includes cleaning solution preparation, pretreatment, ultrasonic
coupling cleaning, gradient temperature field stabilization, microbubble-enhanced separation, post-treatment, and
drying steps. The cleaning solution is free of
hydrogen peroxide and stabilizers, employing a low-alkali
system combined with
frequency conversion ultrasound to achieve efficient removal of adhering substances. A gradient temperature field promotes the full
diffusion of impurities between fibers, followed by in-situ adsorption and flotation via micro-nano bubbles to complete three-phase separation. This invention significantly improves the cleanliness of
glass fiber electronic cloth, with a residual
impurity index (LOI) ≤0.08% and a tensile strength
retention rate ≥95%. The entire process involves no high-temperature
calcination or damage from strong oxidants, resulting in low
energy consumption, easily treatable
wastewater, and strong process adaptability. It is suitable for efficient and
green cleaning of high-end electronic reinforcing substrates such as printed circuit boards and
electronic packaging materials, meeting the needs of large-scale production.