Welding grease for electronic industry

A technology for electronic industry and solder paste, applied in the field of solder paste for electronic industry, can solve the problem of poor storage stability of solder paste, and achieve excellent wettability, excellent storage stability, excellent wettability and storage stability. Effect

Active Publication Date: 2006-09-13
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the score of 89Sn8Zn3Bi is only 2.2 (out of 30). The reason is that the active metal Zn in the alloy solder powder reacts with the flux, which makes the preservation stability of the solder paste extremely poor.

Method used

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  • Welding grease for electronic industry
  • Welding grease for electronic industry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] In this embodiment, the solder alloy powder is Sn63-Pb37, its content is 90% (mass percentage), and the content of flux is 10% (mass percentage).

[0020] The components of the flux and the content of each component are as follows:

[0021] Resin Hydrogenated rosin 35% of flux mass

[0022] Premium Rosin 19% of flux mass

[0023] Solvent Isopropanol 17% by mass of flux

[0024] Terpineol 25.6% by mass of flux

[0025] Rheology modifier Modified hydrogenated castor oil 2.95% by mass of flux

[0026] Activator Perfluorooctanoic acid 0.25% by mass of flux

[0027] Perfluoroglutaric acid 0.15% by mass of flux

[0028] Stabilizer p-tert-butyl cup [4] 0.05% of flux mass

[0029] Thoroughly mix the above alloy solder powder and flux evenly to prepare solder paste. The product should be kept refrigerated below 5°C.

Embodiment 2

[0031] In this embodiment, the alloy solder powder is Sn95.5-Ag3.8-Cu0.7, its content is 85% (mass percentage), and the content of solder is 15% (mass percentage).

[0032] The components of the flux and the content of each component are as follows:

[0033] Resin polyacrylate 20% of flux mass

[0034] Polyurethane 25% by mass of flux

[0035] Solvent diethylene glycol ether 40% of flux mass

[0036] Rheology modifier Hydrogenated castor oil 5% of flux mass

[0037] Activator tert-butyl perfluoroglutarate 4% by mass of flux

[0038] Perfluoroadipic acid 4% by mass of flux

[0039] Stabilizer p-tert-butyl cup [6] 2% of flux mass

[0040] Thoroughly mix the above alloy solder powder and flux evenly to prepare solder paste. The product should be kept refrigerated below 5°C.

Embodiment 3

[0042] In this embodiment, the solder alloy powder is Sn91.8-3.4Ag-4.8Bi, its content is 94% (mass percentage), and the content of solder is 6% (mass percentage).

[0043] The components of the flux and the content of each component are as follows:

[0044] Resin Polymerized rosin 45% of flux mass

[0045] Solvent methyl cellosolve 38.5% of flux mass

[0046] Rheology modifier Hydrogenated castor oil 8% by mass of flux

[0047] Activator Perfluoroglutaric acid 1.5% by mass of flux

[0048] tert-butyl perfluoroadipate 3% by mass of flux

[0049] Stabilizer p-phenyl cup [4] 3.95% of flux mass

[0050] Fluorosurfactant Perfluorobetaine 0.05% of flux mass

[0051] Thoroughly mix the above alloy solder powder and flux evenly to prepare solder paste. The product should be kept refrigerated below 5°C.

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Abstract

The invention is an electron industry solder paste made up of alloy solder powder and solder agent. The weight percentage of alloy solder powder is 85-94%^, the weight percentage of solder agent is 6-15%. The solder agent includes resin, solvent, fluid deformation regulator, activator, stabilizer, the content of resin accounts for 40-60% of solder agent, the content of solvent is 30-50% of solder agent weight, the content of fluid deformation regulator is 1-10%, and the content of activator is 0.2-15% of the solder agent, the content of stabilizer is 0.01-10% of solder agent. In order to upgrade the humidity of the solder paste, the activator uses fluorin carboxylic acid or organic compound containing fluorin carboxylic acid ester. In order to upgrade the stability of the solder paste, the stabilizer uses trophy arene compound. Additionally, the solder agent also can be added in fluorin surface activator, in order to upgrade the stability of the solder paste.

Description

technical field [0001] The invention relates to a solder paste for the electronic industry, in particular to a solder paste for installing electronic components, the alloy solder powder of which is a Sn-Pb alloy or a lead-free alloy. Background technique [0002] The solder paste consists of ultra-fine (20-75 micron) spherical alloy solder powder and flux. Flux is used as a suspension carrier for solder powder, so that the solder paste has certain properties such as activity, viscoelasticity, and thixotropy. The flux contains resins, solvents, activators, rheology modifiers, stabilizers and other compounds. The activators are generally hydrohalide salts of organic amines or perhydrogen organic monobasic or dibasic carboxylic acids, and the stabilizers are generally phenols. compound or ascorbic acid. [0003] Solder paste has a tendency to harden or solidify over time during storage (it will harden or solidify whether it is used or not), so i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/24B23K35/362
Inventor 黄艳谢明贵李龙章蒋青
Owner 深圳市唯特偶新材料股份有限公司
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