Semiconductor package and fabrication method thereof
A manufacturing method and packaging technology, which are applied in semiconductor/solid-state device manufacturing, semiconductor device, semiconductor/solid-state device components and other directions, can solve problems such as short circuit of electrical contact pads 100, and achieve the effect of avoiding short circuit
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[0046] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
[0047] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those skilled in the art to understand and read, and are not used to limit the implementation of the present invention. condition, so it has no technical substantive meaning, and any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of the present invention without affecting the effect and purpose of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "top", "upper", "one" and "lower" quoted in this specif...
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