5results about "Circuit electrostatic discharge protection" patented technology

Printed circuit board (10) for a light module (100) of a vehicle, comprising an electrical circuit (20) with a consumer (30) and at least one short-circuit section (40) connected in parallel to the consumer (30), wherein the circuit (20) has a fuse device (50) connected in series with the consumer (30) and the short-circuit section (40) for disconnecting the electrical circuit (20), and wherein the short-circuit section (40) has a first conductor surface (42) and a second conductor surface (44) separated from the first conductor surface (42) by a short-circuit gap (46), wherein the short-circuit section (40) is formed by the two adjacent conductor surfaces (42, 44).

To prevent static electricity from entering a ground region on which a connector is mounted.SOLUTION: A front layer of a printed circuit board 100 includes: frame ground regions 102a, 102b on which connectors 202, 203 to be connected with external apparatuses or communication cables are mounted and which are connected with a ground; a signal ground region 101 which is separated from the frame ground regions 102a, 102b at the front layer, on which electronic devices 200, 201 configured to receive signals from the connectors 202, 203 are mounted, and which is connected with the ground; and a static electricity removal ground region 103 separated from the frame ground regions 102a, 102b and the signal ground region 101 at the front layer, situated outside the frame ground regions 102a, 102b, and connected with the ground.SELECTED DRAWING: Figure 3

To provide a display device preventing moisture penetration from a position on top of an insulating layer through the insulating layer near the open area.SOLUTION: A display device according to an embodiment of the present disclosure comprises: a substrate including a display area, an open area positioned in the display area, and an intermediate area positioned between the display area and the open area; and a capping layer disposed in the intermediate area and extending in a closed loop surrounding the open area. The capping layer contains a metal material and is connected to the ground or to a power source having a given voltage.SELECTED DRAWING: Figure 10

A semiconductor module includes a board including a chip area and a tab area sequentially arranged in a first direction, a semiconductor chip provided on the chip area, a plurality of signal tabs provided on the tab area, and at least one anti-static portion having conductivity, provided in the tab area, and spaced apart from the plurality of signal tabs, where the plurality of signal tabs and the at least one anti-static portion are sequentially arranged in the first direction and the at least one anti-static portion is disposed on a line extending from at least one of the plurality of signal tabs in the first direction.