235results about "Overvoltage circuit protection" patented technology

A display module includes a display panel and a peripheral region. The peripheral region includes a bendable fan-out region including a panel bonding portion and a driving chip; a flexible circuit board, including a first and a second conductive layers, and a substrate. The first conductive layer includes a first and a second bonding portions, and a connection portion; the second conductive layer is located on a side of the first conductive layer and at least partially overlaps with the first bonding portion; the first and the second conductive layers are connected through a via hole penetrating through the substrate; an end of the flexible circuit board is bonded to the panel bonding portion through the first bonding portion, and the second bonding portion is bonded to a control circuit board; and a conductive protection layer, covering the driving chip and connected to the second conductive layer.

To provide a circuit board unit that suitably prevents unnecessary radiation noise resulting from a current flowing in a connector unit.SOLUTION: A circuit board unit 60 comprises: a first circuit board 61; a second circuit board 62; a connector unit 70 that has a first connector 71 attached to the first circuit board 61 and a second connector 72 attached to the second circuit board 62; and a metal member 80 that connects the first circuit board 61 and the second circuit board 62 to each other. The metal member 80 has a first connection part 85a that is electrically connected to a first ground layer 61g, a second connection part 85b that is electrically connected to a second ground layer 62g, and a cover part 80a that covers at least part of the connector unit 70. The cover part 80a has an opposite wall part 61. The opposite wall part 81 overlaps the first circuit board 61 when seen in a direction orthogonal to a plate surface of the first circuit board 61, and overlaps the second circuit board 62 when seen in a direction orthogonal to a plate surface of the second circuit board 62.SELECTED DRAWING: Figure 2

The invention relates to the technical field of solid state disks, in particular to a bonding pad assembly, a circuit board, a memory card, a card seat and a starting judgment device. The bonding pad assembly is distributed on a substrate of the memory card; the bonding pad assembly comprises a plurality of rows of bonding pads; the plurality of rows of bonding pads comprise a first row of bonding pads; the first row of bonding pads comprise a first grounding bonding pad; the width of the first grounding bonding pad is greater than that of any bonding pad in the first row of bonding pads; the length of the first grounding bonding pad is greater than or equal to the length of any bonding pad of the first row of bonding pads; the distance from the central point of the first grounding bonding pad to a preset reference line on the substrate is smaller than the distance from the central point of any bonding pad in the first row of bonding pads to the reference line; wherein the linear direction parallel to the reference line is the width direction of each component of the bonding pad component. The bonding pad assembly is small in size and can support hot plug.

The invention discloses an anti-static circuit board and a production process thereof, and belongs to the technical field of circuit boards, and the production process comprises the following steps: 1, obtaining polyaniline-based graphene composite powder through amidation and polymerization reaction; step 2, taking AgNO3 as a silver source, loading silver particles on the surface of the Fe3O4 nanowire, and then carrying out surface modification by using a KH-560 silane coupling agent to obtain a modified conductive Fe3O4 nanowire; 3, the polyaniline-based graphene composite powder, the modified conductive Fe3O4 nanowires and other auxiliary materials are subjected to ultrasonic mixing, and anti-static liquid is obtained; 4, etching an inner layer circuit, spraying an anti-static liquid on an outer layer base material, laminating, drilling, performing copper deposition, etching the circuit and performing resistance welding treatment to obtain an anti-static circuit board; according to the anti-static circuit board and the production process thereof, the anti-static performance, the efficient heat conduction performance and the electromagnetic shielding performance are achieved.

The application discloses a manufacturing method of a ground performance metal-based circuit board for an intelligent networked automobile. According to design data, a substrate is manufactured, first drilling is performed, and carbon oil is filled, then first baking and curing are performed, a filling hole is formed, and a filling plate is formed on the whole plate; then polishing is performed, a ground circuit pattern is manufactured on the surface copper layer, and a metal-based circuit board is formed on the whole plate through subsequent processing; through the manufacturing method, the problem of hole wall cracking and separation caused by the thermal expansion and cold shrinkage difference of multi-layer materials of the substrate is effectively avoided in the method for forming a ground circuit by adopting an electroplating hole in the prior art; meanwhile, the complex processes such as copper deposition and copper plating required in electroplating are omitted, the processing flow is simplified, the carbon oil material cost is lower than that of silver paste and copper paste in the prior art, the material matching of the carbon oil with the circuit board body is better, the electrical connection between the ground circuit and the metal-based layer can be stably realized, and good ground performance is ensured.

A segmented bottom emission OLED device comprising an array of a plurality of OLED segments arranged on a common transparent substrate, where the array forms an emission area, where each segment is separated by a non-emission gap; wherein each OLED segment is defined by a transparent bottom electrode segment, an organic layer for light emission, and a top electrode; wherein a transparent insulating layer closer to the bottom electrode section and a transparent conductive layer closer to the substrate exist between the bottom electrode and the substrate in at least one OLED section.

The present invention relates to an LED module comprising: at least two LEDs connected in series and arranged on a printed circuit board (PCB), the printed circuit board comprising two terminals for electrical supply from a driver to the LEDs; a surge current protection structure, the surge current protection structure comprising: a first metal surface disposed on the PCB and connected to anode potential energy of the LEDs connected in series; and a second metal surface arranged on the PCB and connected to the cathode potential energy of the LEDs connected in series, furthermore, the first metal surface and the second metal surface are respectively connected in a thermally conductive manner with each LED of the LEDs of the first group of LEDs at the anode potential energy side of the LEDs connected in series, and the first metal surface and the second metal surface are respectively connected in a thermally conductive manner with each of the LEDs of the second group of LEDs at the anode potential energy side of the LEDs connected in series. And each LED in the second group of LEDs at the cathode potential energy side of the LEDs connected in series is connected in a thermally conductive manner.

A printed circuit board (PCB) assembly for electrostatic discharge (ESD) protection is disclosed. The assembly includes a top layer comprising at least one signal track and configured to support at least a portion of a plurality of electronic components mounted thereon. A middle layer disposed beneath the top layer. The middle layer comprises at least one ground tack configured to receive electrostatic discharge currents from adjacent layers. A bottom layer disposed beneath the middle layer. The bottom layer comprising at least one power track and configured to support another portion of the plurality of electronic components. A plurality of metal discharge elements disposed on at least one of the top layer or the bottom layer. Each of the metal discharge element is electrically connected to the at least ground track of the middle layer.

A segmented bottom-emitting OLED device compromising an array of multiple OLED segments arranged on a common transparent substrate, where the array forms an emitting area where each segment is separated by a non-emitting gap; wherein each OLED segment is defined by a transparent bottom electrode segment, organic layers for light emission, and a top electrode; wherein between the bottom electrode and the substrate in at least one OLED segment, there is a transparent insulating layer that is closer to the bottom electrode segment and a transparent conductive layer that is closer to the substrate.

The present application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate of the present application includes an insulating layer, and electronic components and conductive connectors embedded inside the insulating layer. The conductive connectors are electrically connected to the electronic components; the conductive connectors include at least one fuse unit, and the fuse unit includes a fusible structure and two electrical connection ends. The fusible structure is connected between the two electrical connection ends along the electrical path direction of the conductive connector. The fusible structure is configured to fuse when the passing current exceeds a preset current threshold to disconnect the electrical connection between the electronic component and the external connection end. The present application has lower maintenance and replacement costs when preventing current burnout, and at the same time has a relatively compact volume.

The present invention relates to a solid-state relay based on a printed circuit board. A bidirectional solid-state switch includes: a first bus bar; a second bus bar; a first solid-state switch implemented on a first printed circuit board (PCB), which includes a first control terminal, a first terminal electrically connected to the first bus bar, and a second terminal; and a second solid-state switch implemented on a second PCB, which includes a second control terminal; a third terminal electrically connected to the second terminal of the first solid-state switch, and a fourth terminal electrically connected to the second bus bar.

A display device includes: a substrate including a display area in which a plurality of pixels are located and a non-display area in contact with the display area; an outer wiring in the non-display area on the substrate; a 1-1 substrate pad in the non-display area on the substrate and connected to the outer wiring; a first chip-on film attached to one side of the substrate and including a 1-1 output pad connected to the 1-1 substrate pad and a 1-1 input pad connected to the 1-1 output pad through a 1-1 line; and a circuit board attached to one side of the first chip-on film and including a 1-1 circuit board pad connected to the 1-1 input pad and a 1-1 test pad connected to the 1-1 circuit board pad through a 1-1 test line.

Disclosed is a display device (1) in which a capping layer (CL) surrounding an open area (OA) and including a metal material is disposed on an intermediate area (MA) between a display area (AA) and the open area (OA), thereby preventing moisture penetration from a position on top of an insulating layer through the insulating layer near the open area (OA).

The present invention relates to the field of radio frequency circuits, in particular to a radio frequency device which comprises a plurality of dielectric plates; functional modules are respectively arranged on the dielectric plates; the functional modules comprise integrated circuits and electronic components; the dielectric plates are sequentially stacked; the dielectric plates at middle layers are partially hollowed out to form closed spaces, the closed spaces being used for placing the integrated circuits and electronic components. The design of the present invention can improve the isolation degree while maintaining the advantages of high integration level and small size of systems on chip.

A protection circuit arrangement includes a substrate having a first surface and a second surface; a connector on the first surface and electrically connected to a battery cell; an overvoltage protection element on the second surface and electrically connected to the connector; and a fuse on the first surface and electrically connected to the overvoltage protection element.

To suppress an increase in mode conversion loss due to component variations.SOLUTION: A signal transmission system includes first signal wiring 6 and second signal wiring 7 each constituting differential wiring, a first capacitive load mechanism portion 18 P arranged in a first region over the first signal wiring 6 and having a first capacitance value, and a second capacitive load mechanism portion 18N arranged in a second region extending from the second signal wiring to the ground potential wiring and having a capacitance value asymmetrical to the first capacitance value.SELECTED DRAWING: Figure 1

A printed circuit board (PCB) assembly for electrostatic discharge (ESD) protection is disclosed. The assembly includes a top layer comprising at least one signal track and configured to support at least a portion of a plurality of electronic components mounted thereon. A middle layer disposed beneath the top layer. The middle layer comprises at least one ground track configured to receive electrostatic discharge currents from adjacent layers. A bottom layer disposed beneath the middle layer. The bottom layer comprises at least one power track 108a and configured to support another portion of the plurality of electronic components. A plurality of metal discharge elements disposed on at least one of the top layer or the bottom layer. Each of the metal discharge element is electrically connected to the at least ground track of the middle layer.

To provide a display device preventing moisture penetration from a position on top of an insulating layer through the insulating layer near the open area.SOLUTION: A display device according to an embodiment of the present disclosure comprises: a substrate including a display area, an open area positioned in the display area, and an intermediate area positioned between the display area and the open area; and a capping layer disposed in the intermediate area and extending in a closed loop surrounding the open area. The capping layer contains a metal material and is connected to the ground or to a power source having a given voltage.SELECTED DRAWING: Figure 10

The invention provides a flexible circuit board, a display module and a display device. The two ends of the flexible circuit board are connected with a display driving chip and a mainboard respectively, the mainboard is provided with a power management circuit, the power management circuit is used for providing multiple paths of voltage signals for the display driving chip, and the flexible circuit board comprises a voltage signal transmission line, a voltage signal receiving circuit and a voltage signal transmitting circuit, the voltage signal transmission lines comprise effective voltage signal transmission lines and redundant voltage signal transmission lines, one effective voltage signal transmission line is used for transmitting one path of voltage signals to the display driving chip, and the redundant voltage signal transmission lines have no signal transmission; and a static elimination unit, wherein the redundant voltage signal transmission line is electrically connected with the static elimination unit. According to the display module, the redundant voltage signal transmission line is electrically connected with the static elimination unit, so that charge accumulation on the redundant voltage signal transmission line is reduced, the antenna effect of the redundant voltage signal transmission line is weakened, and the anti-interference capability of the display module is improved.

[Solution] A laminate is provided with a first resin layer, a first conductive layer, an insulating layer, a second conductive layer, and a second resin layer in this order, the first resin layer having a housing part, and the first conductive layer being disposed in the housing part of the first resin layer. The conductive laminate is provided with a first conductive layer, an insulating layer, and a second conductive layer in this order. The conductive laminate is provided with adhesive layers between the first conductive layer and the insulating layer and between the insulating layer and the second conductive layer.

The present invention relates to the field of circuit technology, and provides a pinless integrated semiconductor circuit, which includes: an electric control board, on which two rows of antenna connection parts are arranged, each row of antenna connection parts includes a plurality of antennas, and the antennas include protruding heads and slots formed by the protruding heads being recessed inward; a circuit board, on which a plurality of antenna mounting holes corresponding to the plurality of antenna connection parts and a plurality of fins respectively located in the plurality of antenna mounting holes are arranged, and the circuit board is installed in the plurality of slots through the plurality of fins. The pinless integrated semiconductor circuit in the present invention realizes the integration of the circuit board and the electric control board by means of a pinless setting, which not only avoids the stress generated by the pin welding tolerance during the plastic sealing when connecting two circuit modules through pins, resulting in the delamination of the insulating layer at the pin welding place, but also avoids the influence of human body static electricity on the internal chip, reduces its production cost, and improves production efficiency.

The invention relates to an electronic protection device (201) for protecting an electrical and / or electronic system against overvoltage. Reduced space requirements can be achieved by the following features: having a plurality of diode pairs (203) connected in parallel, each diode pair (203) consisting of a unidirectional suppressor diode (204) and a bidirectional suppressor diode (205) connected in series; the invention relates to a circuit board (206) having two mounting surfaces (207, 208) facing away from each other and provided with conductor tracks (217, 218), all unidirectional suppression diodes (204) being arranged on one mounting surface (207) and all bidirectional suppression diodes (205) being arranged on the other mounting surface (208).

A sensing device is disclosed. The sensing device comprising a printed circuit board (PCB), a conductive port coupled to the PCB via a conductive adhesive and defining an orifice filled with a protective gel. Further, the sensing device comprises a sensing element disposed on the PCB within the conductive port and encased by the protective gel, and a conductive member disposed at least over the protective gel. The conductive member is configured to discharge static charges accumulated over the protective gel to the PCB via at least the conductive adhesive.

The present disclosure provides a display substrate, including: a display area and a bonding area positioned on a side of the display area, the bonding area includes a plurality of bonding sub-areas arranged at intervals, the bonding sub-areas are arranged along a direction in which an edge of the display area extends and configured for bonding a chip-on-film, where a first antistatic layer is further arranged on the bonding area, at least a part of the first antistatic layer is positioned between adjacent ones of the bonding sub-areas, and the first antistatic layer is electrically coupled to a reference signal terminal. The present disclosure further provides a display device.

A connecting device for selectively connecting at least one component (2) with at least one substrate (3) is proposed, comprising at least one first electrically non-conductive material (4) and a plurality of particles (5) of a second electrically conductive material embedded in the first material (4), wherein the first material (4) has a coefficient of thermal expansion such that when a temperature threshold is exceeded, an electrically conductive connection between the component (2) and the substrate (3) is interrupted.

A testing system may include a printed-circuit board coil embedded on a printed circuit board. The testing system may further include a test circuit electrically connected to the printed-circuit board coil, the test circuit configured to: receive a signal from the printed-circuit board coil, analyze the signal from the printed-circuit board coil, and determine a fault based on the signal from the printed circuit board coil.

A segmented bottom-emitting OLED device compromising an array of multiple OLED segments arranged on a common transparent substrate, where the array forms an emitting area where each segment is separated by a non-emitting gap; wherein each OLED segment is defined by a transparent bottom electrode segment, organic layers for light emission, and a top electrode; wherein between the bottom electrode and the substrate in at least one OLED segment, there is a transparent insulating layer that is closer to the bottom electrode segment and a transparent conductive layer that is closer to the substrate.

A printed circuit board, PCB, (100) may include a main body (110) having an edge (110E) and a first surface (110S) on which a semiconductor chip (10) is provided, a first pin (121) including a first tab (121TAB) extending in a first direction (D1) that is perpendicular to the edge of the main body (110) and configured to receive a first signal corresponding to communication between the outside and the semiconductor chip (10) and a first tie-bar (121TB) protruding from an end of the first tab (121TAB) toward the edge (110E) of the main body (110), the first tie-bar having a first length, and a second pin (122) including a second tab (122TAB) extending in the first direction (D1) and configured to receive a ground voltage of a ground, and a second tie-bar (122TB) protruding from an end of the second tab (122TAB) toward the edge (110E) of the main body (110), the second tie-bar (122TB) having a second length that is greater than the first length.

An aerosol provision device for generating an aerosol from aerosol-generating material is described. The device comprises a heating assembly (140) and an electrically conductive housing part (121) arranged to at least partially receive the heating assembly. The device comprises an electronics module (150) and a contact member (155). The at least one contact member is in electrical contact between the housing part and the electronics module to provide an electrostatic discharge pathway.