105results about "Overvoltage circuit protection" patented technology

The invention discloses an anti-static circuit board and a production process thereof, and belongs to the technical field of circuit boards, and the production process comprises the following steps: 1, obtaining polyaniline-based graphene composite powder through amidation and polymerization reaction; step 2, taking AgNO3 as a silver source, loading silver particles on the surface of the Fe3O4 nanowire, and then carrying out surface modification by using a KH-560 silane coupling agent to obtain a modified conductive Fe3O4 nanowire; 3, the polyaniline-based graphene composite powder, the modified conductive Fe3O4 nanowires and other auxiliary materials are subjected to ultrasonic mixing, and anti-static liquid is obtained; 4, etching an inner layer circuit, spraying an anti-static liquid on an outer layer base material, laminating, drilling, performing copper deposition, etching the circuit and performing resistance welding treatment to obtain an anti-static circuit board; according to the anti-static circuit board and the production process thereof, the anti-static performance, the efficient heat conduction performance and the electromagnetic shielding performance are achieved.

The application discloses a manufacturing method of a ground performance metal-based circuit board for an intelligent networked automobile. According to design data, a substrate is manufactured, first drilling is performed, and carbon oil is filled, then first baking and curing are performed, a filling hole is formed, and a filling plate is formed on the whole plate; then polishing is performed, a ground circuit pattern is manufactured on the surface copper layer, and a metal-based circuit board is formed on the whole plate through subsequent processing; through the manufacturing method, the problem of hole wall cracking and separation caused by the thermal expansion and cold shrinkage difference of multi-layer materials of the substrate is effectively avoided in the method for forming a ground circuit by adopting an electroplating hole in the prior art; meanwhile, the complex processes such as copper deposition and copper plating required in electroplating are omitted, the processing flow is simplified, the carbon oil material cost is lower than that of silver paste and copper paste in the prior art, the material matching of the carbon oil with the circuit board body is better, the electrical connection between the ground circuit and the metal-based layer can be stably realized, and good ground performance is ensured.

A printed circuit board (PCB) assembly for electrostatic discharge (ESD) protection is disclosed. The assembly includes a top layer comprising at least one signal track and configured to support at least a portion of a plurality of electronic components mounted thereon. A middle layer disposed beneath the top layer. The middle layer comprises at least one ground tack configured to receive electrostatic discharge currents from adjacent layers. A bottom layer disposed beneath the middle layer. The bottom layer comprising at least one power track and configured to support another portion of the plurality of electronic components. A plurality of metal discharge elements disposed on at least one of the top layer or the bottom layer. Each of the metal discharge element is electrically connected to the at least ground track of the middle layer.

A segmented bottom-emitting OLED device compromising an array of multiple OLED segments arranged on a common transparent substrate, where the array forms an emitting area where each segment is separated by a non-emitting gap; wherein each OLED segment is defined by a transparent bottom electrode segment, organic layers for light emission, and a top electrode; wherein between the bottom electrode and the substrate in at least one OLED segment, there is a transparent insulating layer that is closer to the bottom electrode segment and a transparent conductive layer that is closer to the substrate.

The present invention relates to a solid-state relay based on a printed circuit board. A bidirectional solid-state switch includes: a first bus bar; a second bus bar; a first solid-state switch implemented on a first printed circuit board (PCB), which includes a first control terminal, a first terminal electrically connected to the first bus bar, and a second terminal; and a second solid-state switch implemented on a second PCB, which includes a second control terminal; a third terminal electrically connected to the second terminal of the first solid-state switch, and a fourth terminal electrically connected to the second bus bar.

A display device includes: a substrate including a display area in which a plurality of pixels are located and a non-display area in contact with the display area; an outer wiring in the non-display area on the substrate; a 1-1 substrate pad in the non-display area on the substrate and connected to the outer wiring; a first chip-on film attached to one side of the substrate and including a 1-1 output pad connected to the 1-1 substrate pad and a 1-1 input pad connected to the 1-1 output pad through a 1-1 line; and a circuit board attached to one side of the first chip-on film and including a 1-1 circuit board pad connected to the 1-1 input pad and a 1-1 test pad connected to the 1-1 circuit board pad through a 1-1 test line.

Disclosed is a display device (1) in which a capping layer (CL) surrounding an open area (OA) and including a metal material is disposed on an intermediate area (MA) between a display area (AA) and the open area (OA), thereby preventing moisture penetration from a position on top of an insulating layer through the insulating layer near the open area (OA).

The present invention relates to the field of radio frequency circuits, in particular to a radio frequency device which comprises a plurality of dielectric plates; functional modules are respectively arranged on the dielectric plates; the functional modules comprise integrated circuits and electronic components; the dielectric plates are sequentially stacked; the dielectric plates at middle layers are partially hollowed out to form closed spaces, the closed spaces being used for placing the integrated circuits and electronic components. The design of the present invention can improve the isolation degree while maintaining the advantages of high integration level and small size of systems on chip.

A protection circuit arrangement includes a substrate having a first surface and a second surface; a connector on the first surface and electrically connected to a battery cell; an overvoltage protection element on the second surface and electrically connected to the connector; and a fuse on the first surface and electrically connected to the overvoltage protection element.

A printed circuit board (PCB) assembly for electrostatic discharge (ESD) protection is disclosed. The assembly includes a top layer comprising at least one signal track and configured to support at least a portion of a plurality of electronic components mounted thereon. A middle layer disposed beneath the top layer. The middle layer comprises at least one ground track configured to receive electrostatic discharge currents from adjacent layers. A bottom layer disposed beneath the middle layer. The bottom layer comprises at least one power track 108a and configured to support another portion of the plurality of electronic components. A plurality of metal discharge elements disposed on at least one of the top layer or the bottom layer. Each of the metal discharge element is electrically connected to the at least ground track of the middle layer.

To provide a display device preventing moisture penetration from a position on top of an insulating layer through the insulating layer near the open area.SOLUTION: A display device according to an embodiment of the present disclosure comprises: a substrate including a display area, an open area positioned in the display area, and an intermediate area positioned between the display area and the open area; and a capping layer disposed in the intermediate area and extending in a closed loop surrounding the open area. The capping layer contains a metal material and is connected to the ground or to a power source having a given voltage.SELECTED DRAWING: Figure 10

The invention relates to an electronic protection device (201) for protecting an electrical and / or electronic system against overvoltage. Reduced space requirements can be achieved by the following features: having a plurality of diode pairs (203) connected in parallel, each diode pair (203) consisting of a unidirectional suppressor diode (204) and a bidirectional suppressor diode (205) connected in series; the invention relates to a circuit board (206) having two mounting surfaces (207, 208) facing away from each other and provided with conductor tracks (217, 218), all unidirectional suppression diodes (204) being arranged on one mounting surface (207) and all bidirectional suppression diodes (205) being arranged on the other mounting surface (208).

A sensing device is disclosed. The sensing device comprising a printed circuit board (PCB), a conductive port coupled to the PCB via a conductive adhesive and defining an orifice filled with a protective gel. Further, the sensing device comprises a sensing element disposed on the PCB within the conductive port and encased by the protective gel, and a conductive member disposed at least over the protective gel. The conductive member is configured to discharge static charges accumulated over the protective gel to the PCB via at least the conductive adhesive.

The present disclosure provides a display substrate, including: a display area and a bonding area positioned on a side of the display area, the bonding area includes a plurality of bonding sub-areas arranged at intervals, the bonding sub-areas are arranged along a direction in which an edge of the display area extends and configured for bonding a chip-on-film, where a first antistatic layer is further arranged on the bonding area, at least a part of the first antistatic layer is positioned between adjacent ones of the bonding sub-areas, and the first antistatic layer is electrically coupled to a reference signal terminal. The present disclosure further provides a display device.

A testing system may include a printed-circuit board coil embedded on a printed circuit board. The testing system may further include a test circuit electrically connected to the printed-circuit board coil, the test circuit configured to: receive a signal from the printed-circuit board coil, analyze the signal from the printed-circuit board coil, and determine a fault based on the signal from the printed circuit board coil.

A segmented bottom-emitting OLED device compromising an array of multiple OLED segments arranged on a common transparent substrate, where the array forms an emitting area where each segment is separated by a non-emitting gap; wherein each OLED segment is defined by a transparent bottom electrode segment, organic layers for light emission, and a top electrode; wherein between the bottom electrode and the substrate in at least one OLED segment, there is a transparent insulating layer that is closer to the bottom electrode segment and a transparent conductive layer that is closer to the substrate.

A display device includes a capping layer surrounding an open area and a metal material is disposed on an intermediate area between a display area and the open area, thereby preventing moisture penetration from a position on top of an insulating layer through the insulating layer near the open area.

A circuit board includes a board, an interface formed on the board, a discharge wiring pair formed on the board and having a first discharge wire connected to the interface and a second discharge wire having a second tip portion facing a first tip portion of the first discharge wire with an interval, an electronic component installed in a signal path connected to the interface, a ground path connected to the second discharge wire, and a discharge induction unit configured to induce discharge between the discharge wiring pair by making a current having a frequency based on a voltage waveform of static electricity to be discharged flow more easily in the discharge wiring pair than in the signal path.

Embodiments of the present disclosure relate to the technical field of display, and provide a flexible printed circuit board. The flexible printed circuit board comprises a board body, a first shielding layer, a reinforcing sheet, and a connector; the board body has a first surface and a second surface which are opposite to each other; and the board body has a first end and a second end in the length direction of the board body. The connector is located on the first surface and at the first end, and the connector is connected to the board body. The reinforcing sheet is located on the second surface and at the first end, and the orthographic projection of the connector on the first surface at least partially overlaps the orthographic projection of the reinforcing sheet on the first surface. The first shielding layer is located on the second surface, and the first shielding layer is electrically connected to the reinforcing sheet. The embodiments of the present disclosure can ameliorate the problem of poor electrostatic and electromagnetic protection capabilities of the back surface of the connector in the flexible printed circuit board.

The invention relates to the technical field of flexible printed circuit boards, and discloses a high-reliability vehicle-mounted module FPC structure and a preparation method thereof.The high-reliability vehicle-mounted module FPC structure comprises a base material layer, a first rolled copper layer, an FR4 enhancement layer, a second rolled copper layer, a covering layer, an EMI shielding layer and a binding structure shaped like a Chinese character'feng ', and the first rolled copper layer and the second rolled copper layer are symmetrically arranged to form a four-layer rolled copper structure; a circle of copper ground wire is reserved on the edges of the upper and lower line layers, and grid copper is fully paved on the two layers outside the upper and lower line pavement. Through the triple shielding design of the copper ground wire, the grid copper and the EMI material, full-band electromagnetic shielding is realized, the shielding effectiveness is improved by more than or equal to 15dB, and the problem of signal interference in a vehicle-mounted environment is effectively solved; and by adopting a rolled copper material and an FR4 enhancement layer structure, the bending resistance of the FPC exceeds one million times, the binding strength is greater than or equal to 49N, and the FPC is suitable for a vehicle-mounted wide temperature range from-45 DEG C to 125 DEG C.

Disclosed is a substrate comprising a ceramic main body (1) and an organic surface structure (2) on at least one outer face of the ceramic main body (1), outer redistribution layers (3) being integrated into the organic surface structure.

A layered body contains: a first resin layer; a first conductive layer; an insulating layer; and a second conductive layer; in this order, in which the first resin layer comprises a storage portion, and the first conductive layer is disposed within the storage portion of the first resin layer. A conductive layered body contains: a first conductive layer; an insulating layer; and a second conductive layer; in this order, in which an adhesive layer is provided between the first conductive layer and the insulating layer, and between the insulating layer and the second conductive layer, respectively.

A testing system may include a first printed-circuit board coil embedded on a printed circuit board. The testing system may include a second printed-circuit board coil embedded on a second printed circuit board, wherein the second printed-circuit board coil is electrically connected to the first printed-circuit board coil in a series-type configuration. The testing system may include a test circuit electrically connected to the first printed-circuit board coil and the second printed-circuit board coil, the test circuit configured to: receive a signal from at least one selected from a group consisting of the first printed-circuit board coil and the second printed-circuit board coil, analyze the signal, and determine a fault based on the signal.

This composite electronic component (1) is provided with: an insulating layer (12) positioned between a first wiring structure and a second wiring structure; and an ESD protection member (2) embedded in the insulating layer (12). The insulating layer (12) includes insulating layers (12A, 12B), and a weld leg of an adhesion layer (15) formed of the same resin as the adhesive resin of the insulating layer (12B) is formed on a corner portion (C) between a surface (S1) of the insulating layer (12A) and a side surface (2C) of the ESD protection member (2). As a result, the adhesion between the ESD protection member (2) and the insulating layer (12A) can be improved.

The present disclosure discloses an electrostatic discharge (ESD) protection system for micro devices. The ESD protection system includes a pixel driver circuit electrically connected to at least one micro LED pixel for controlling the turn-on or turn-off of the micro LED pixel, and a first ESD protection unit configured in an external circuit outside the pixel driver circuit. The first ESD protection unit includes at least one unidirectional transient voltage suppressor. The cathode of the unidirectional transient voltage suppressor is connected to a first level voltage (Vdd), and the anode of the unidirectional transient voltage suppressor is connected to a second level voltage (Vcom). The micro LED pixel is connected to the second level voltage (Vcom). The present disclosure can protect the micro LED pixel from damage by electrostatic discharge. Various embodiments include an ESD protection system for a display panel having an array of micro LED pixels.

Disclosed is a display device including: a display panel including a display area, the display area including a plurality of pixels, in which the display panel has opposite sides; a first printed circuit board disposed on one of the opposite sides; a second printed circuit board disposed on the other of the opposite sides; and a grounded flexible printed circuit board having opposite sides, in which one of the opposite sides of the grounded flexible printed circuit board is electrically connected to the display panel, and the other of the opposite sides of the grounded flexible printed circuit board is connected to the second printed circuit board, in which the grounded flexible printed circuit board is connected to ground. Therefore, the influence of noise generated when the display device is operated on video or image quality can be reduced.

The invention relates to a galvanic separating apparatus, comprising a printed circuit board (3), the printed circuit board (3) comprising a first soldering pad (7), a second soldering pad (8) and a recess (12), whereby the pads (7, 8) are arranged on a lower side (9) of the printed circuit board (3) thereby defining a clearance and / or creepage distance (10, 11) between the pads (7, 8), and the recess (12) is arranged between the pads (7, 8), a primary insulated winding layer (5) connected to the first soldering pad (7) and a second insulated winding layer (6) connected to the second soldering part (8), whereby the winding layers (5, 6) are arranged on an upper side (2) of the printed circuit board (3), and an insulating layer (13), whereby the insulating layer (13) extends from the upper side (2) through the recess (12) and protrudes on the lower side (9) beyond the printed circuit board (3) thereby increasing the clearance and / or creepage distance (10, 11).

The present disclosure relates to a display device and an electronic device, wherein the display device includes: a display panel including a plurality of pixels, a first panel pad and a second panel pad; and a circuit board including a first substrate pad and a second substrate pad, the first substrate pad and the second substrate pad applying a first power supply voltage to the first panel pad and the second panel pad. The display panel also includes a first power line pattern and a second power line pattern, the first power line pattern being connected to the second substrate pad to apply the first power supply voltage to the plurality of pixels, and the second power line pattern being connected to the first substrate pad. The circuit board also includes: a first electrostatic discharge protection circuit connected between the first substrate pad and the second substrate pad; a substrate power pattern electrically connected to the first substrate pad; a ground pattern receiving a ground voltage; and a second electrostatic discharge protection circuit connected between the substrate power pattern and the ground pattern.

A high-density multi-component package is provided that includes a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to the first module interconnect pad and the second module interconnect pad and between the first module interconnect pad and the second module interconnect pad, wherein the first electronic component is vertically oriented with respect to the first module interconnect pad. The second electronic component is vertically oriented with respect to the second module interconnect pad.