Method for avoiding solder bridge

A technology of tin bridging and wave soldering, which is applied in the field of avoiding improper solder bridging between two adjacent soldering points, so as to improve the first-pass rate, reduce maintenance costs, and improve the soldering qualification rate.

Active Publication Date: 2009-07-22
MICRO-STAR INTERNATIONAL +1
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  • Abstract
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Problems solved by technology

[0008] The main purpose of the present invention is to provide a method for avoiding solder bridging, so as to solve the problem of solder connection (bridging) where the pitch of parts is less than 2 mm (millimeters) and the gap between adjacent parts holes is less than 0.6 mm.

Method used

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  • Method for avoiding solder bridge

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Embodiment Construction

[0051] According to the welding theory, the smaller the distance between the parts holes, the easier it is to cause the phenomenon of tin connection (bridging). In order to prevent the phenomenon of tin connection (bridging) during soldering when the spacing between the parts feet is ≤ 2mm and the gap between the parts holes corresponding to the parts feet on the printed circuit board is ≤ 0.6mm, the present invention uses between two parts holes Solder mask material to be isolated. For example, a steel sheet with a thickness of 0.1-0.2mm is used to set up multiple dams or retaining walls with a width of 0.15-0.20mm, that is, isolation strips (lines), which can isolate and block the tin liquid during welding, effectively preventing two The phenomenon of tin connection (bridging) occurs in adjacent parts holes.

[0052] see figure 1 shown. In order to solve electronic products, such as the pin seat of the central processing unit in the wave soldering, the last row of part p...

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Abstract

The present invention relates to a method for avoiding solder bridging. A plurality of insulation strips are respectively placed among a plurality of component holes of printed circuit board to be welded for insulating the adjacent component hole. Then welding is executed so that the component pins placed in the component hole are respectively combined fixedly with the printed circuit board through tin liquor, wherein the tin liquor is obstructed by the insulating strip. Thereby the improper solder bridging of two adjacent welding points on the component pins and component holes with small distance. Furthermore the welding pass rate can be increased and the maintenance cost of product in future is reduced.

Description

technical field [0001] The invention relates to soldering operation between electronic parts, in particular to a method for avoiding improper soldering bridging (connecting tin) between two adjacent soldering points. Background technique [0002] There are various patented technologies for avoiding improper solder bridging between two adjacent solder joints, for example, the ground pad structure for preventing solder overflow and the semiconductor package with the ground pad structure disclosed in Taiwan Patent Publication No. 200504981 parts; Chinese Taiwan Patent Publication No. 488198 discloses a printed circuit board capable of avoiding electrical short circuits during the soldering process; Chinese Taiwan Patent Publication No. 483647 discloses a solder machine stabilizer tank structure for reducing residual tin on circuit boards, etc. [0003] When soldering, the component feet are plugged into the corresponding component holes of the printed circuit board. In the cur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 蔡辉展贺威张友良童庆平
Owner MICRO-STAR INTERNATIONAL
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