Manufacturing method for interconnected multilayer circuit board by copper cylinder method

Abstract

The invention relates to a manufacturing method for an interconnected multilayer circuit board by a copper cylinder method, comprising the following steps: (1) manufacturing an interlayer wiring layer on a substrate; (2) manufacturing a copper cylinder on the interlayer wiring layer; (3) manufacturing an insulating layer; (4) manufacturing another wiring layer on the basis of the copper cylinder and the insulating layer, wherein the step (3) of manufacturing the insulating layer comprises the following concrete steps: a, sequentially carrying out oil removing, acid cleaning, pre-impregnation, brownification and plate baking to a circuit board in the step (2); b, screening resin by silk and solidifying the resin; and c, rubbing down the copper cylinder and the resin. The invention discloses a concrete processing technique for plating the copper cylinder first and then the insulating layer and solves the key technical problem of the prior interconnected multilayer circuit board by the copper cylinder method in the production process. By the invention, more than three orders of HDI circuit boards can be manufactured, such as 4+N+4. The invention has the characteristics of high manufacturing efficiency, short production period and further reduction of the volume and the weight of products.

Description

technical field [0001] The invention relates to a method for manufacturing a multilayer circuit board, in particular to a method for manufacturing a high density interconnection (HIGH DENSITY INTERCONNECTION, HDI for short) multilayer circuit board based on a copper pillar method. Background technique [0002] Nowadays, the manufacturing method of multilayer printed circuit boards is mainly based on the build-up method. The basic principle is: an insulating layer is formed on a substrate with a wiring layer, and another wiring layer is formed on the insulating layer. Insulation layers and wiring layers are repeatedly formed in sequence to stack multilayer printed circuit boards. [0003] In the manufacturing process of multilayer printed circuit boards, it is necessary to make some specific contacts between the upper and lower wiring layers communicate with each other. At present, there are mainly two methods to achieve the purpose of interconnection and conduction. One is ...

AI Technical Summary

Problems solved by technology

The disadvantages of laser drilling method are: it is difficult to remove drilling dirt and glue residue during laser drilling, the process is not easy to master, and laser drilling equipment is expensive

However, the above-mentioned patents do not disclose relevant content, and most existing manufacturers of multilayer circuit boards based on the copper pillar method are also trapped in the production technology of the insulating layer, and a few foreign manufacturers are unwilling to disclose it as technical secrets

[0006] In addition, the other steps disclosed in the above-mentioned No. 01130862.1 patent can theoretically achieve the purpose of the invention, but without further creative work by those of ordinary skill in the art, it is impossible to make a product