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Application of circuit board hole-filling electroplating leveling agent

A leveling agent and circuit board technology, applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems such as unsatisfactory, and achieve the effect of superior hole filling performance

Active Publication Date: 2021-09-24
SHENZHEN BANMING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] As the lines of circuit boards become more refined, the plane wiring width and line spacing are often less than 75 microns, and some even reach 40 / 50 microns. In this case, thinner surface copper thickness is required to reduce line etching. The purpose of the difficulty, and the existing electroplating additives for filling blind holes, the surface copper thickness after filling blind holes is generally 16-20 microns, sometimes even more than 20 microns, which can no longer meet the requirements of such finer circuit technology

Method used

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  • Application of circuit board hole-filling electroplating leveling agent
  • Application of circuit board hole-filling electroplating leveling agent
  • Application of circuit board hole-filling electroplating leveling agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Take a 250ml double-necked round bottom flask, add 40mL xylene, dissolve 10.2g (0.1mol) valeric acid and 10.32g (0.1mol) diethylenetriamine successively in the reaction system at room temperature, and stir at room temperature for 10min; Subsequently, the reaction temperature was raised to 150°C, and after 5 hours of reaction, the temperature was raised to 200°C for cyclization reaction for 2 hours to obtain alkenylamine ethyl imidazoline; cooled to 90°C, slowly added dropwise to the alkenylamine ethyl imidazoline 12.66g (0.1 mol) benzyl chloride, heat preservation reaction 3 h to get alkenylbenzylamine ethyl imidazoline quaternary ammonium chloride; slowly add 7.61 g (0.1mol) of thiourea was reacted at 110°C for 2 h, and dried in vacuo to obtain a khaki solid—thioureido imidazoline quaternary ammonium salt. The product does not need to be further purified, it can be directly dissolved in water and used as a leveling agent, code 1#.

Embodiment 2

[0032] Take a 250ml double necked round bottom flask, add 40mL xylene, dissolve 17.2g (0.1mol) capric acid and 10.32g (0.1mol) diethylenetriamine successively in the reaction system at room temperature, and stir at room temperature for 10min; Subsequently, the reaction temperature was raised to 160°C, and after 4 hours of reaction, the temperature was raised to 200°C for cyclization reaction for 2 hours to obtain alkenylamine ethyl imidazoline; cooled to 90°C, slowly added dropwise to the alkenylamine ethyl imidazoline 12.66 g (0.1 mol) benzyl chloride, heat preservation reaction for 3 h to obtain alkenylbenzylamine ethyl imidazoline quaternary ammonium chloride; slowly add 7.61 g (0.1mol) thiourea was reacted at 110°C for 2 h, and dried under vacuum to obtain a khaki solid—thioureido imidazoline quaternary ammonium salt. The product does not need further purification, and can be directly dissolved in water and used as a leveling agent. No. 2#.

[0033] In order to further di...

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Abstract

The invention provides application of a circuit board hole-filling electroplating leveling agent, and relates to the technical field of hole-filling electroplating. The circuit board hole-filling electroplating leveling agent is thioureido imidazoline quaternary ammonium salt, namely thioureido is introduced into leveling agent molecules, and when the leveling agent is added into an electroplating solution system for hole-filling electroplating, the surface copper thickness is small and is smaller than 15 micrometers; and the hole-filling performance is excellent, and the leveling agent can adapt to increasingly fine development of fine circuit processing. An electroplating solution used during electroplating is composed of 40 to 120 g / L of sulfuric acid, 120 to 240 g / L of copper sulfate pentahydrate, 40 to 80 ppm of chloride ions, 2 to 10 ppm of an accelerator, 600 to 1000 ppm of an inhibitor and 3 to 10 ppm of the thioureido imidazoline quaternary ammonium salt, and holes filled through electroplating are one or more of blind holes, through holes and buried holes.

Description

technical field [0001] The invention relates to the technical field of hole filling and electroplating, in particular to the application of a circuit board hole filling and electroplating leveling agent. Background technique [0002] In recent years, with the rapid development of electronic industry technology, electronic products are getting smaller and smaller, and their functions are more and more concentrated. Many electronic products must not only have powerful functions, but also have good portability. As the mother of electronic products, the circuit board must increase the circuit density as much as possible to save limited space. Thinning is an inevitable trend. [0003] The complete circuit of the circuit board is composed of plane wiring and interconnection of interlayer holes. The combination of tiny via holes and fine circuit technology is the premise to realize the high density of printed circuit boards. [0004] Micro vias (including through holes, blind hol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D7/00H05K3/42
CPCC25D3/38C25D7/00H05K3/424
Inventor 宗高亮谢慈育李得志冉光武
Owner SHENZHEN BANMING SCI & TECH CO LTD
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