Bonding sheet, preparation method thereof and metal foil-clad laminated board comprising bonding sheet

A bonding sheet and metal-clad technology, applied in the direction of metal layered products, chemical instruments and methods, layered products, etc., can solve the problems of difficulty in further improving the thermal conductivity of copper-clad laminates, low strength, and application limitations, and achieve good local Effect of heat dissipation, improvement of heat dissipation and hole filling performance, and bonding force between layers

Active Publication Date: 2021-06-29
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the resin composition with high thermal conductivity can improve the heat dissipation of the copper-clad laminate to a certain extent, it is difficult to further improve the thermal conductivity of the copper-clad laminate due to the barrier of glass cloth.
[0004] One solution is to replace the bonding sheet with an adhesive film made of a resin composition, which can avoid the influence of glass cloth on the thermal conductivity of the copper clad laminate. However, since the adhesive film does not contain reinforcing materials and has low strength, the rigidity of the copper clad laminate cannot be achieved. Guarantee, so its application in copper clad laminates (especially high multi-layer boards) is limited
[0005] CN 109693428A discloses a composite substrate, which uses fiber mesh cloth instead of glass cloth to prepare the substrate for copper clad laminates. Although the thermal conductivity of copper clad laminates can be improved, the meshes of the mesh cloth are evenly distributed on the mesh cloth, and the number is relatively large. , so it will also lead to insufficient rigidity of copper clad laminates, which is difficult to apply in high multilayer boards

Method used

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  • Bonding sheet, preparation method thereof and metal foil-clad laminated board comprising bonding sheet

Examples

Experimental program
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Effect test

Embodiment 1

[0048] This embodiment provides a copper clad laminate, the preparation method of which is as follows:

[0049] (1) Preparation of reinforced material with holes:

[0050] Use laser to punch holes in 2116 glass cloth, its structure is as follows figure 1 As shown, the hole diameter is 1mm, each punching area has 30 holes, and the spacing between the holes in each punching area is 1mm; the warp length of each punching area is 9mm, and the latitude length is 11mm; two adjacent The longitudinal spacing between the perforated areas is 100mm, and the latitudinal spacing is 200mm.

[0051] (2) Preparation of bonding sheet:

[0052] The above-mentioned perforated glass cloth was soaked with the glue of the high thermal conductivity resin composition 1, and then baked at 150°C for 3 minutes to make a bonding sheet (thickness 0.15mm).

[0053] (3) Preparation of copper clad laminate:

[0054] Stack the 2 prepared adhesive sheets neatly, align the punching positions up and down, cov...

Embodiment 2

[0056] This embodiment provides a copper-clad laminate. The difference from Embodiment 1 is that, when the bonding sheets are stacked, the perforated position of one bonding sheet corresponds to the unperforated position of the other bonding sheet.

Embodiment 3

[0058] This embodiment provides a circuit board, the preparation method of which is to use a bonding sheet prepared in embodiment 1 to be sandwiched between two core boards etched with lines, and pressed into a multi-layer board, wherein the punching positions correspond to Locations with high heat dissipation requirements.

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Abstract

The invention provides a bonding sheet, a preparation method thereof and a metal foil-clad laminated board comprising the bonding sheet. The bonding sheet comprises a reinforcing material and a resin composition for infiltrating and filling the reinforcing material; the reinforcing material is provided with at least one punching area, at least three holes are formed in any punching area, and the diameter of each hole is 0.5-4 mm; and the distance between holes in any one punching area ranges from 0.4 mm to 2 mm, and the minimum distance between every two adjacent punching areas is larger than the distance between the holes. The holes with specific diameters and intervals are formed in the reinforcing material, so that the holes are filled with the resin composition instead of the reinforcing material, the strength of the bonding sheet is not obviously reduced, meanwhile, the heat dissipation performance and the hole filling performance of the punching area of the bonding sheet are improved, and it is ensured that a metal foil-clad laminated board and a circuit board prepared through the bonding sheet have enough rigidity, good local heat dissipation capacity and high interlayer bonding force.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to an adhesive sheet, a preparation method thereof and a metal foil-clad laminate containing the adhesive sheet. Background technique [0002] With the mass production of electronic information products and the design towards the direction of light, thin, small and multi-functional, the printed circuit board as the main supporting material of electronic components is also continuously improving the technical level to meet the needs of high-density wiring, thin shape, micro Aperture, high heat dissipation performance requirements. In this context, high thermal conductivity copper clad laminates were born. [0003] A common copper-clad laminate is composed of at least one adhesive sheet and copper foil covering both sides of the adhesive sheet. The adhesive sheet is composed of glass cloth and a resin composition impregnated and adhered to the glass cloth. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/08C08L71/12C08L9/06C08K7/04C08K7/14C08K3/28C08K3/38C08J5/24B32B15/04B32B33/00H05K1/03
CPCC08J5/24B32B15/04B32B33/00H05K1/0366C08J2363/00C08J2379/08C08J2371/12C08J2309/06C08K7/14C08K7/04C08K2003/282C08K2003/385
Inventor 刘述峰佘乃东黄增彪陈涛
Owner GUANGDONG SHENGYI SCI TECH
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