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Electroplating solution for HEDP cyanide-free copper plating and electroplating method

A cyanide-free copper plating and electroplating solution technology, applied in the electrolysis process, electrolysis components, cells, etc., can solve the problems of poor coating quality and unsatisfactory bath performance, and achieve good coating quality, excellent bath performance, and cathode. The effect of high current efficiency

Inactive Publication Date: 2015-05-20
WUXI XUEJIANG ENVIRONMENT ENG EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Existing cyanide-free copper plating generally has the technical defects that the performance of the plating solution is not ideal enough, and the quality of the coating is not strong.

Method used

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  • Electroplating solution for HEDP cyanide-free copper plating and electroplating method
  • Electroplating solution for HEDP cyanide-free copper plating and electroplating method
  • Electroplating solution for HEDP cyanide-free copper plating and electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The formulation of the electroplating solution is as follows:

[0038]

[0039] Plating process conditions: the pulse width of the single pulse square wave current is 1ms, the duty cycle is 30%, and the average current density is 1A / dm 2 ; The pH is 10.5, the temperature is 50°C, and the electroplating time is 90min.

Embodiment 2

[0041] The formulation of the electroplating solution is as follows:

[0042]

[0043] Plating process conditions: the pulse width of the single pulse square wave current is 1ms, the duty cycle is 25%, and the average current density is 1.2A / dm 2 ; The pH is 10, the temperature is 45°C, and the electroplating time is 70min.

Embodiment 3

[0045] The formulation of the electroplating solution is as follows:

[0046]

[0047] Plating process conditions: the pulse width of the single pulse square wave current is 2ms, the duty cycle is 20%, and the average current density is 1.4A / dm 2 ; The pH is 8.5, the temperature is 35°C, and the electroplating time is 60min.

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PUM

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Abstract

The invention discloses an electroplating solution for HEDP (1-hydroxyethylidene-1, 1-diphosphonic) cyanide-free copper plating and an electroplating method. The electroplating solution includes: 14-20g / L Cu2(OH)2CO3, 82123g / L HEDP, 20-40g / L citrate and 3-7g / L nitrate. The electroplating solution provided by the invention adopts HEDP as the coordination agent and citrate as the auxiliary coordination agent, so that the electroplating solution has good dispersion force and deep plating ability, high cathode current efficiency, and excellent performance. The coating obtained by electroplating of the electroplating solution under an alkaline condition has low porosity and good quality.

Description

technical field [0001] The invention relates to the technical field of electroplating copper technology, in particular to an electroplating solution and an electroplating method for HEDP cyanide-free copper plating. Background technique [0002] Copper has good electrical and thermal conductivity, relatively soft, easy to polish, soluble in nitric acid, and also soluble in heated concentrated sulfuric acid, and it acts slowly in hydrochloric acid and dilute sulfuric acid. It is easy to oxidize in the air (especially under heating conditions). After oxidation, it will lose its color and luster. It will react with carbon dioxide or oxides in humid air to form a layer of basic copper carbonate. When subjected to the action of sulfide, it will form Brown or black film. [0003] Since copper is more positive, it deposits easily on other metals. Very good corrosion resistant coatings are obtained when used with copper as an underlayer in combination with bright nickel and microc...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/18C25D21/10
CPCC25D3/38C25D5/18C25D21/10
Inventor 曾雄燕
Owner WUXI XUEJIANG ENVIRONMENT ENG EQUIP
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