Alkaline P salt plating solution for electroplating platinum and electroplating method thereof
An electroplating solution and a technology of a plating solution, applied in the field of electroplating platinum, can solve the problems of poor performance of the plating solution, poor quality of the plating layer, and low current efficiency of the plating solution, and achieve high cathode current efficiency, good quality of the plating layer, and excellent performance of the plating solution Effect
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Embodiment 1
[0026] The formulation of the electroplating solution is as follows:
[0027]
[0028] Plating process conditions: the pulse width of single pulse square wave current is 0.5ms, the duty cycle is 30%, and the average current density is 0.5A / dm 2 ; The pH is 11, the temperature is 70°C, and the electroplating time is 40min.
Embodiment 2
[0030] The formulation of the electroplating solution is as follows:
[0031]
[0032] Plating process conditions: the pulse width of single pulse square wave current is 0.6ms, the duty cycle is 25%, and the average current density is 0.8A / dm 2 ; The pH is 13, the temperature is 80° C., and the electroplating time is 35 minutes.
Embodiment 3
[0034] The formulation of the electroplating solution is as follows:
[0035]
[0036]
[0037] Plating process conditions: the pulse width of single pulse square wave current is 0.8ms, the duty cycle is 20%, and the average current density is 3A / dm 2 ; The pH is 12, the temperature is 70°C, and the electroplating time is 20min.
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