Thiosulfate cyanide-free gold-plating electroplating liquid with added hydrazine hydrochloride and electroplating method

A technology of thiosulfate and thiosulfate is applied in the field of electroplating copper and tin, which can solve the problems of low quality of coating, poor performance of plating solution, restricting the promotion of cyanide-free gold electroplating, etc., and achieves high brightness and coating quality. Good results with excellent bath performance

Inactive Publication Date: 2016-03-30
无锡杨市表面处理科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing cyanide electroplating generally has the technical defects of poor performance of the plating solution and low coating quality, which seriously restrict the further promotion of cyanide-free electroplating in industry

Method used

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  • Thiosulfate cyanide-free gold-plating electroplating liquid with added hydrazine hydrochloride and electroplating method
  • Thiosulfate cyanide-free gold-plating electroplating liquid with added hydrazine hydrochloride and electroplating method
  • Thiosulfate cyanide-free gold-plating electroplating liquid with added hydrazine hydrochloride and electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The formulation of the electroplating solution is as follows:

[0036]

[0037] Plating process conditions: the pulse width of single pulse square wave current is 0.5ms, the duty cycle is 30%, and the average current density is 0.5A / dm 2 ; The pH is 6, the temperature is 60°C, and the electroplating time is 40min.

Embodiment 2

[0039] The formulation of the electroplating solution is as follows:

[0040]

[0041] Plating process conditions: the pulse width of single pulse square wave current is 0.6ms, the duty cycle is 25%, and the average current density is 0.6A / dm 2 ; The pH is 6.5, the temperature is 60°C, and the electroplating time is 35min.

Embodiment 3

[0043] The formulation of the electroplating solution is as follows:

[0044]

[0045] Plating process conditions: the pulse width of single pulse square wave current is 0.8ms, the duty cycle is 20%, and the average current density is 1A / dm 2 ; The pH is 7, the temperature is 50° C., and the electroplating time is 20 minutes.

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PUM

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Abstract

The invention discloses a thiosulfate cyanide-free gold-plating electroplating liquid with added hydrazine hydrochloride and an electroplating method. The electroplating liquid comprises, 10-15 g/L of gold trichloride calculated based on gold, 100-140 g/L of a thiosulfate calculated based on thiosulfate radical, 78-94 g/L of a sulfite calculated based on sulfite radical, 5-15 g/L of hydrazine hydrochloride compound and 0.08-0.22 g/L of diantimony trioxide. The electroplating liquid employs the hydrazine hydrochloride compound as a stabilizing agent, employs diantimony trioxide as a brightener, employs a thiosulfate as a coordination agent and employs gold trichloride as a gold main salt, and the obtained electroplating liquid possesses relatively good dispersing force and covering power, high cathodic current efficiency and excellent performances. A plating layer obtained by employing the electroplating liquid for performing electroplating under an alkaline condition is low in porosity, high in brightness and good in plating-layer quality.

Description

technical field [0001] The invention relates to the technical field of copper-tin electroplating, in particular to an electroplating solution and an electroplating method for cyanide-free gold plating with thiosulfate added with hydrazine hydrochloride. Background technique [0002] Gold has good ductility, is easy to polish, has low contact resistance, good conductivity and welding performance, and has been widely used as a solderable coating in the electronics industry. Gold is resistant to high temperatures, and hard gold is relatively wear-resistant, so gold plating is widely used in precision instruments, meters, printed circuit boards, integrated circuits, tube shells, electrical contacts and other parts that require long-term stable electrical parameters. Gold has high chemical stability and is only soluble in aqua regia but not in other acids. Therefore, the gold coating has strong corrosion resistance and good anti-tarnish performance. At the same time, the gold all...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/48C25D5/18
Inventor 潘增炎
Owner 无锡杨市表面处理科技有限公司
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