Through hole pulse electroplating solution and through hole pulse electroplating coating method

A technology of pulse electroplating and electroplating solution, which is applied to the formation of electrical connections of electrodes and printed components, etc. It can solve the problems of reducing factory production efficiency and increasing the cost of raw materials-copper, so as to reduce workload, increase organic matter consumption, and improve production. efficiency effect

Pending Publication Date: 2022-01-04
广州市慧科高新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It greatly reduces the production efficiency of the factory and increases the cost of the raw material - copper. The current price of copper anode materials has risen sharply, which has brought great cost pressure to circuit board manufacturers.

Method used

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  • Through hole pulse electroplating solution and through hole pulse electroplating coating method
  • Through hole pulse electroplating solution and through hole pulse electroplating coating method
  • Through hole pulse electroplating solution and through hole pulse electroplating coating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Copper plating is performed on an epoxy resin substrate with a through hole diameter of 0.2mm, a thickness of 1.6mm, and an aspect ratio of 8:1.

[0040] Composition of copper sulfate plating solution:

[0041] Copper sulfate pentahydrate: 70g / L;

[0042] Sulfuric acid (mass fraction 98%): 230g / L;

[0043] Chloride ion: 70mg / L (added by 37% hydrochloric acid);

[0044] Wetting agent: The wetting agent contains ethylene oxide / propylene oxide copolymer and polyethylene glycol, among which the ethylene oxide and propylene oxide copolymer is BASF Pluronic PE6100 with a content of 500mg / L; polyethylene glycol Select polyethylene glycol 8000 for use, and the content is 500mg / L;

[0045] Brightener: sodium dithiopropane sulfonate, 3mg / L;

[0046] Heptahydrate ferrous sulfate: 50g / L;

[0047] Fe(III): 1.3g / L.

[0048] Plating conditions:

[0049] Bath temperature: 25°C;

[0050] Cathode current density: 3A / dm 2 ;

[0051] Plating time 60min;

[0052]

[0053] Stir...

Embodiment 2

[0056] Copper plating is performed on an epoxy resin substrate with a through hole diameter of 0.2mm, a thickness of 3.2mm, and an aspect ratio of 16:1.

[0057] Composition of copper sulfate plating solution:

[0058] Copper sulfate pentahydrate: 70g / L;

[0059] Sulfuric acid (mass fraction 98%): 230g / L;

[0060] Chloride ion: 70mg / L (added by 37% hydrochloric acid);

[0061] Wetting agent: ethylene oxide / propylene oxide copolymer, Dow Ucon 50HB-2000, 800mg / L;

[0062] Brightener: sodium dithiopropane sulfonate, 2mg / L;

[0063] Heptahydrate ferrous sulfate: 50g / L;

[0064] Fe(III): 1.3g / L.

[0065] Plating conditions:

[0066] Bath temperature: 25°C;

[0067] Cathode current density: 2A / dm 2 ;

[0068] Plating time 90min;

[0069] DC first pulse second pulse third pulse DC Forward current density A / dm 2

[0070] Stirring: jet flow + air stirring.

Embodiment 3

[0072] Copper plating is performed on an epoxy resin substrate with a through hole diameter of 0.2 mm, a thickness of 4.0 mm, and an aspect ratio of 20:1.

[0073] Composition of copper sulfate plating solution:

[0074] Copper sulfate pentahydrate: 70g / L;

[0075] Sulfuric acid: 240g / L;

[0076] Chloride ion: 70mg / L (added by 37% hydrochloric acid);

[0077] Wetting agent: wetting agent includes copolymer and polyethylene glycol, among which the ethylene oxide / propylene oxide copolymer is DowUcon50HB-660, the concentration is 1000mg / L; the polyethylene glycol is polyethylene glycol 20000, the content 500mg / L;

[0078] Brightener: sodium dithiopropane sulfonate: 4mg / L;

[0079] Heptahydrate ferrous sulfate: 50g / L;

[0080] Fe(III): 1.5g / L.

[0081] Plating conditions:

[0082] Bath temperature: 25°C;

[0083] Cathode current density: 1.5 / dm 2 ;

[0084] Plating time 120min;

[0085]

[0086] Stirring: jet flow + air stirring.

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Abstract

The invention provides a through hole pulse electroplating solution. The through hole pulse electroplating solution comprises 60-80 g / L of copper ions, 200-250 g / L of acid, 40-100 mg / L of chloride ions, 0.05-20 mg / L of a brightening agent and 50-4000 mg / L of a wetting agent. Through combination of the electroplating solution and the pulse electroplating technology, electroplating to a PCB through hole reaches the deep plating capacity exceeding 100%, and a circuit board with the aspect ratio exceeding 12: 1 and the board thickness exceeding 3 mm can obtain more excellent deep plating capacity.

Description

technical field [0001] The invention relates to the technical field of through-hole copper plating in the manufacture of PCB boards, in particular to a through-hole pulse electroplating solution and a through-hole pulse electroplating coating method. Background technique [0002] Plated Through Hole (PTH) is a very important link in the PCB manufacturing process. In order to achieve electrical conduction between different layers, it is necessary to plate a metal-copper with good conductivity on the wall of the non-metallized through hole. With the rapid development of terminal electronic products, circuit boards with increasingly complex structures have continuously improved the requirements for the uniformity of electroplated copper in plated through holes, and put forward higher requirements for the reliability of PCB electroplated copper. Affected by factors such as polarization, current density, conductivity of the solution, and current efficiency, the deposition thickne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D5/18C25D7/00C25D17/12H05K3/42
CPCC25D3/38C25D5/18C25D7/00C25D17/12H05K3/42
Inventor 张之勇罗东明
Owner 广州市慧科高新材料科技有限公司
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