Electroplating solution and electroplating method and application thereof

A technology of electroplating solution and compound, which is applied in electroplating solution and its electroplating method and application field, can solve the problems of ignoring the properties of electroplating solution, etc., and achieve the effect of improving hole filling ability, better deep plating ability, and fine crystallization of plating layer

Active Publication Date: 2021-06-01
上海天承化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the electroplating solution disclosed by it introduces vanadate and surfactant, the focus of its disclosure is on the method of implementing electrodeposited titanium, ignoring the properties of the electroplating solution itself

Method used

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  • Electroplating solution and electroplating method and application thereof
  • Electroplating solution and electroplating method and application thereof
  • Electroplating solution and electroplating method and application thereof

Examples

Experimental program
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Embodiment 1

[0054] This embodiment provides a kind of electroplating liquid, and described electroplating liquid is made up of following components according to mass concentration: sulfuric acid 200g / L, copper sulfate 60g / L, sodium chloride 100mg / L, tetravalent vanadium compound VOSO 4 (the mass concentration of tetravalent vanadium is 50g / L), pentavalent vanadium compound V 2 o 5 (the mass concentration of pentavalent vanadium 5g / L), surfactant 500mg / L (as shown in formula I, R 1 is methyl, R 2 for hydrogen, R 3 is methyl, R 4 is hydrogen, x=24, y=36, n=3, number average molecular weight is 10852g / mol), brightener 5mg / L (sodium 3-mercaptopropane sulfonate) and carrier 500mg / L (polypropylene glycol, number average The molecular weight is 20000 g / mol).

[0055] This embodiment also provides an electroplating layer, which is obtained by pulse electroplating with the electroplating solution.

[0056] The electroplating method of above-mentioned electroplating layer is as follows:

[0...

Embodiment 2

[0059] This embodiment provides a kind of electroplating liquid, and described electroplating liquid is made up of following components according to mass concentration: sulfuric acid 50g / L, copper sulfate 15g / L, sodium chloride 5mg / L, tetravalent vanadium compound V 2 o 4 (The mass concentration of tetravalent vanadium is 1g / L), the pentavalent vanadium compound NaVO 3 (the mass concentration of pentavalent vanadium is 0.5g / L), surfactant 10mg / L (as shown in formula I, R 1 is C10 alkyl, R 2 is C5 alkenyl, R 3 is hydroxyl, R 4 C12 alkoxy group, x=2, y=5, n=25), brightener 0.5mg / L (sodium N,N-dimethyldithiocarbonylpropane sulfonate) and carrier 10mg / L (poly Ethylene glycol, the number average molecular weight is 400g / mol).

[0060] This embodiment also provides an electroplating layer, which is obtained by pulse electroplating with the electroplating solution.

[0061] The electroplating method of above-mentioned electroplating layer is as follows:

[0062] Immerse the pl...

Embodiment 3

[0064] This embodiment provides a kind of electroplating liquid, and described electroplating liquid is made up of following components according to mass concentration: sulfuric acid 350g / L, copper sulfate 100g / L, sodium chloride 200mg / L, tetravalent vanadium compound: mass ratio is 1 : 1 VOSO 4 and V 2 o 4 (The mass concentration of tetravalent vanadium is 100g / L), pentavalent vanadium compound: NaVO with a mass ratio of 1:1 3 and NH 4 VO 3 (mass concentration of pentavalent vanadium 10g / L), surfactant 1000mg / L (as shown in formula I, R 1 is C16 cycloalkyl, R 2 is ethyl, R 3 for hydrogen, R 4 C4 alkoxy, x=15, y=40, n=5), brightener 10mg / L (mass ratio of 2:1 isothiuronium propanesulfonic acid inner salt and 3-(benzothiazole-2- mercapto)-sodium propanesulfonate) and carrier 1000mg / L (polyethylene glycol, number average molecular weight 40000g / mol).

[0065] This embodiment also provides an electroplating layer, which is obtained by pulse electroplating with the electro...

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Abstract

The invention relates to a electroplating solution and an electroplating method and application thereof. The electroplating solution comprises sulfuric acid, copper ions, chloride ions, a tetravalent vanadium compound, a pentavalent vanadium compound, a surfactant and an auxiliary agent. The surfactant comprises any one or a combination of at least two of polyoxyethylene and a derivative thereof, polyoxypropylene and a derivative thereof, a polyoxyethylene-polyoxypropylene copolymer and a derivative thereof or a fatty alcohol ethyoxyl compound. A plating layer formed after electroplating of the electroplating solution has the characteristics of fine plating layer crystals, high ductility and high electrical conduction performance.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating solution and an electroplating method and application thereof. Background technique [0002] In modern society, electronic products such as smart phones and tablet computers are developing in the direction of miniaturization and multi-function. The number of components to be carried has greatly increased, but the space for circuit boards has become increasingly limited. Therefore, the width and spacing of printed circuit board (PCB) wires, the diameter of the microporous plate and the center distance of the hole, and the thickness of the conductor layer and the insulating layer are all decreasing, while the aperture ratio is increasing, making the PCB board in size and weight. And in the case of reduced volume, it needs to accommodate more components. [0003] The IC carrier board is the highest level in the field of PCB miniaturization technology, provi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D5/18C25D7/00
CPCC25D3/38C25D5/18C25D7/00
Inventor 林章清黄叔房王科刘江波章晓冬童茂军
Owner 上海天承化学有限公司
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