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Electroplate liquid and electroplate method for cyanide-free gold plating of thallium-contained sulfite

A sulfite and cyanide-free gold plating technology, which is applied in the field of electroplating copper and tin, can solve the problems that restrict the promotion of cyanide-free electroplating, the quality of the coating is not high, the performance of the plating solution is not good, and the performance of the plating solution is excellent and the brightness is high. , the effect of good coating quality

Inactive Publication Date: 2016-02-10
无锡永发电镀有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing cyanide electroplating generally has the technical defects of poor performance of the plating solution and low coating quality, which seriously restrict the further promotion of cyanide-free electroplating in industry

Method used

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  • Electroplate liquid and electroplate method for cyanide-free gold plating of thallium-contained sulfite
  • Electroplate liquid and electroplate method for cyanide-free gold plating of thallium-contained sulfite
  • Electroplate liquid and electroplate method for cyanide-free gold plating of thallium-contained sulfite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The formulation of the electroplating solution is as follows:

[0038]

[0039]

[0040] Plating process conditions: the pulse width of single pulse square wave current is 0.5ms, the duty cycle is 30%, and the average current density is 0.5A / dm 2 ; The pH is 8, the temperature is 60°C, and the electroplating time is 40min.

Embodiment 2

[0042] The formulation of the electroplating solution is as follows:

[0043]

[0044] Plating process conditions: the pulse width of single pulse square wave current is 0.6ms, the duty cycle is 25%, and the average current density is 0.6A / dm 2 ; The pH is 8.5, the temperature is 60°C, and the electroplating time is 35min.

Embodiment 3

[0046] The formulation of the electroplating solution is as follows:

[0047]

[0048] Plating process conditions: the pulse width of single pulse square wave current is 0.8ms, the duty cycle is 20%, and the average current density is 1A / dm 2 ; The pH is 9, the temperature is 50° C., and the electroplating time is 20 minutes.

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Abstract

The invention discloses electroplate liquid and an electroplate method for cyanide-free gold plating of thallium-contained sulfite. The electroplate liquid is composed of 10-15 g / L of gold chloride in terms of gold, 78-94 g / L of sulfite in terms of sulfite radicals, 1-4 g / L of glycerinum, 0.30-0.65 g / L of organic phosphorus compounds and 0.05-0.14 g / L of thallous salt in terms of thallium. According to the electroplate liquid, the sulfite serves as main coordination agents, the glycerinum serves as stabilizers, the organic phosphorus compounds serve as electron accelerators, the thallous salt serves as brightening agents, and the gold chloride serves as main gold salt, so that the obtained electroplate liquid is good in dispersion capacity and covering capacity, cathode currents are high in efficiency, and the electroplate liquid is excellent in performance. By the adoption of the electroplate liquid, plating obtained through electroplating under the alkaline condition is low in porosity, high in brightness and good in quality.

Description

technical field [0001] The invention relates to the technical field of copper-tin electroplating, in particular to a thallium-containing sulfite cyanide-free electroplating solution and an electroplating method. Background technique [0002] Gold has good ductility, is easy to polish, has low contact resistance, good conductivity and welding performance, and has been widely used as a solderable coating in the electronics industry. Gold is resistant to high temperatures, and hard gold is relatively wear-resistant, so gold plating is widely used in precision instruments, meters, printed circuit boards, integrated circuits, tube shells, electrical contacts and other parts that require long-term stable electrical parameters. Gold has high chemical stability and is only soluble in aqua regia but not in other acids. Therefore, the gold coating has strong corrosion resistance and good anti-tarnish performance. At the same time, the gold alloy coating has various colors, so it is of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/48C25D5/18
Inventor 石明
Owner 无锡永发电镀有限公司
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