413 results about "Gold alloy" patented technology

A low ampere mechanical switch has a contact design creating a line of contact between the moveable and stationary contacts. The stationary contacts are stainless steel and the moveable contact is Inconel TM . Both contacts have a thin plating of gold alloy to provide for good mechanical strength at high temperature with a natural lubricating ability. The contact physical design provides good wiping action and mechanical contact while preventing troughing.

A method for inlaying the diamond or zircon onto jadeite includes such steps as blanking, drilling one or more blind or through holes, installing inlaying nail, cutting the inlaying nail, inlaying the diamond or zircon to said inlaying nail, wrapping the edge of inlaid diamond or zircon by an expanding sleeve made of gold alloy or stainless steel, grinding and polishing.

A method is disclosed for fabricating a integrated device, such as a MEMS device. A first wafer is provided on an exposed surface with a layer of gold, gold alloy or gold compound. A second wafer is provided on its exposed surface with under-layer of gold, gold alloy or gold compound; and an over- of bismuth, bismuth alloy, a compound of bismuth, cadmium, cadmium alloy, a compound of cadmium compound, tin, tin alloy, or a compound of tin. The wafers are then brought into contact and bonded at their surfaces through the deposited layers.

Disclosed herein are a method for plating a printed circuit board and the printed circuit board manufactured therefrom. In the method, a bare soldering or wire bonding portion of a copper (Cu)- or copper alloy layer, is plated with palladium (Pd) or a palladium alloy, and then gold (Au) or a gold alloy is deposited over the palladium or palladium alloy plated layer by an electroless substitution plating process based on ionization tendency. Having superior hardness, ductility and corrosion resistance, palladium is suitable for use between a connector and a substrate and meets requirements for the printed circuit board even when applied to a low thickness, greatly reducing the process time. Accordingly, the problem of black pad, which frequently occur on electroless nickel and electroless gold finish upon surface mount technology, can be perfectly solved. Particularly, fatal bending cracks can be prevented from occurring in the rigid-flexible or flexible printed circuit boards.

High performance coated metal compositions resistant to metal dusting corrosion and methods of providing such compositions are provided by the present invention. The coated metal compositions are represented by the structure (PQR), wherein P is an oxide layer at the surface of (PQR), Q is a coating metal layer interposed between P and R, and R is a base metal. P includes alumina, chromia, silica, mullite or mixtures thereof. Q includes Ni and Al, and at least one element selected from the group consisting of Cr, Si, Mn, Fe, Co, B, C, N, P, Ga, Ge, As, In, Sn, Sb, Pb, Sc, La, Y, Ce, Ti, Zr, Hf, V, Nb, Ta, Mo, W, Ru, Rh, Ir, Pd, Pt, Cu, Ag, Au and mixtures thereof. R is selected from the group consisting of carbon steels, low chromium steels, ferritic stainless steels, austenetic stainless steels, duplex stainless steels, Inconel alloys, Incoloy alloys, Fe—Ni based alloys, Ni-based alloys and Co-based alloys. Advantages exhibited by the disclosed coated metal compositions include improved metal dusting corrosion resistance at high temperatures in carbon-supersaturated environments having relatively low oxygen partial pressures. The coated metal compositions are suitable for use in syngas generation process equipment.

A copper-based alloy wire made of a material selected from the group consisting of a copper-gold alloy, a copper-palladium alloy and a copper-gold-palladium alloy is provided. The alloy wire has a polycrystalline structure of a face-centered cubic lattice and consists of a plurality of equi-axial grains. The quantity of grains having annealing twins is 10 percent or more of the total quantity of the grains of the copper-based alloy wire.

Gold bonding wires for semiconductor devices featuring increased strength and modulus of elasticity, stable loop shapes, suppressing the flow of wires, suppressing the leaning, and totally improved junctions of the wedge junction portions or wear characteristics for realizing a narrow-pitch connection, and enhanced the productivity on an industrial scale, and a method of producing the same. A gold bonding wire for a semiconductor device has a crystal grain structure in cross section in the lengthwise direction of the bonding wire, wherein a ratio of the area of crystal grains having an orientation [111] to the area of crystal grains having an orientation [100] is not smaller than 1.2 in the crystal orientations in the lengthwise direction of the wire.

An IDT electrode (3) on a piezoelectric substrate (2) has an electrode including first metal layers (31a, 31b) formed of titanium or a titanium alloy, or chromium or a chromium alloy and second metal layers (32a, 32b) formed of aluminum or an aluminum alloy, copper or a copper alloy, or gold or a gold alloy, which are laminated alternately. The orientation degrees in the first metal layer (31a) that is closest to the surface of the piezoelectric substrate (2) in the first metal layers (31a, 31b) and the second metal layer (32a) that is closest to the surface of the piezoelectric substrate (2) in the second metal layers (32a, 32b) are higher than the orientation degrees in the upper metal layers. As compared with the prior art where the orientation degrees in the first metal layers (31a, 31b) and the second metal layers (32a, 32b) are not considered, the power handling capability of the IDT electrode (3) can be significantly improved.

Methods for forming hydrogen sensing materials include forming a palladium alloy thin film having less than about 83 atomic percent of palladium, and annealing the palladium alloy thin film to relieve residual stress and increase atomic intermixing of the nanorystaline lattice, while maintaining a grain size close to the grain size of the nonannealed palladium alloy thin film. For example, the sensing material may include a palladium-gold alloy thin film having about 60 atomic percent of palladium and about 40 atomic percent of gold. The palladium-gold alloy thin film is then annealed at a temperature of about 200 degrees Celsius for 1 hour. Methods for detecting hydrogen containing gas in which the hydrogen sensing material is maintained in a single phase when exposed to the hydrogen containing gas, and optical hydrogen sensors are also disclosed.

A decorative part and a process for producing the decorative part. A first nitride layer containing at least one metal selected among hafnium, titanium, and zirconium is formed on the surface of a decorative part comprising a soft base made of a material selected among stainless steel, titanium and titanium alloys, brass, etc., and a second nitride layer containing at least one metal which is selected among hafnium, titanium, and zirconium and is different from that in the first nitride layer is formed on the first nitride layer to thereby form a primer layer. A multilayered hardened layer including a gold alloy layer is further formed as a finish layer on the primer layer.

The invention relates to a gas sensor for monitoring the gas content in insulating oil, in particular to a gas sensor for the online monitoring of the acetylene gas content in insulating oil. The gas sensor comprises a hollow-structure integrated casing, and combined type oil-gas separation membrane and a fuel cell type gas sensing component which are installed inside the casing; wherein a selective electrocatalysis filtering layer for filtering interfering gas is also installed between the combined type oil-gas separation membrane and the fuel cell. Identical gas diffusion electrodes formed by gold alloy (Au) clectrocatalyst are adopted for the anode and the cathode of the selective acetylene fuel cell. The activity of the selective electrocatalysis filtering layer to the interfering gas is higher than the fuel cell itself to the interfering gas; with the increasing of the activity ratio, the filtering effect is also improved. The gas sensor is resistant to various ambient pressure and temperature changes, and the content of low concentration acetylene gas can be correctly and stably monitored in the environment with high concentration interfering gas such as hydrogen gas, carbon monoxide and ethylene gas.

The invention relates to a method for preparing an auric alloy catalyst with high dispersion, high thermal stability and high activity. Firstly, a group which can complexate metallic ions is grafted on the surface of an oxhydryl-containing carrier; secondly, according to certain percentage, the carrier is dispersed in a solution containing aurum and another or a plurality of metal precursors so that the carrier carries out synchronous or substep complexation on the metallic ions; through certain steps of filtering and washing, the carrier complexated with the metallic ions is re-dispersed in a solvent with certain amount and is added with a reducing agent with proper amount for deoxidation; and finally, collected solid powder is treated for 0.5 to 6 hours under the atmosphere of hydrogen gas at a temperature of between 400 and 600 DEG C to obtain the auric alloy catalyst with high dispersion, high thermal stability and high activity. The auric alloy catalyst shows high activity in the oxidation reaction of carbon monoxide and the oxidation reaction of ethanol.

A high tarnish resistant silver alloy composition formulated for jewelry and flatware manufacture is provided. In certain implementations, the alloy contains about 92%-97% by weight silver, about 0.25%-3.5% by weight palladium, about 0%-3.5% by weight platinum, about 0%-2.5% by weight gold, about 0.1%-1.0% by weight copper, about 0.5%-3.5% by weight zinc, about 0.1%-1.5% by weight tin, about 0.25%-1.5% by weight indium, about 0.03%-1.1% by weight silicon, about 0%-0.5% by weight germanium, about 0.15%-0.5% by weight gallium, about 0.25%-0.5% by weight cobalt and about 0%-0.5% by weight ruthenium. These unique combinations of elements result in the alloys with the tarnish resistance superior to typical 10K gold alloy.

The invention discloses a silver-gold alloy target material, a manufacturing method and application thereof. The manufacturing method comprises the following steps: putting a target raw material into a melting furnace and heating to be melted; casting the melted melting soup; hot forging ingots formed after the casting; cold rolling blanks formed after the hot forging; and hot treating the blanks formed after the cold rolling to obtain the silver-gold alloy target material with small grains. Through the method provided by the invention, the target material has fine grains, and casting defects can be effectively removed, so that the target material can not produce the problems such as uneven dust particles and components in the sputtering process and the like.

The invention discloses a porous core-shell nano auriferous alloy and a preparation method for the same. The alloy comprises an Au (gold) core and a metal shell of a porous structure, the thickness of the shell ranges from 25nm to 35nm, and components of the shell consist of Au, Pd (palladium), Pt (platinum) and alloy of Au, Pd and Pt. Compared with the prior art, the method is used for preparing a porous core-shell auriferous alloy nano structure by using low-valence (univalent or divalent) noble metal saline solution as raw materials. The method is simple, controllable, high in reproducibility and generally applicable, and purity approximates 100%. Compared with a monocrystal core-shell nano structure, the porous core-shell auriferous alloy nano structure is larger in specific surface area and more excellent in catalysis, and can be used for heterogeneous catalysis and used as electrode materials for electro-catalysis and fuel cells.

A dental alloy that comprises little or no amounts of noble metals. The alloys herein are designed to be a substitute for gold alloys in the fabrication of prosthetic dental appliances employing porcelain to metal bonds. The alloys are based on a combination of iron and chromium with a lesser inclusion of other elements to provide a high yield strength and to provide a durable impact resistant bond with dental porcelain.

The invention relates to a manufacturing method of a ceramic/copper composite material throat insert, comprising preparation of a ceramic skeleton and infiltration of a copper alloy, wherein the preparation of the ceramic skeleton comprises the steps of ball milling, pelletizing, moulding, presintering and degreasing as well as high temperature sintering, and a porous ceramic skeleton blank used for preparing a throat insert is prepared; and the infiltration of the copper alloy comprises that Cu-Ni-Ag-Au alloy powder accounting for 36-38% of the weight of the porous ceramic skeleton blank is infiltrated into the porous ceramic skeleton blank at a high temperature, and the Cu-Ni-Ag-Au alloy is in composition of Cu-2.5Ni-1.45Ag-0.15Au in percent by weight. The manufacturing method provided by the invention is simple and is convenient to operate, the prepared ceramic/copper composite material has high thermal conductivity, low thermal expansion coefficient, low density and excellent anti-erosion property, a high-strengthen ceramic skeleton material is designed, the proportion of an infiltration agent is adjusted, the wettability of liquid copper/ceramic is improved, the light copper/ceramic throat insert composite material with excellent anti-erosion property can be prepared, and a high-density tungsten-copper throat insert composite material can be replaced, thus the ceramic/copper composite material throat insert is applicable to industrial production.

Disclosed is a catalyst, including a catalyst particle containing at least one component selected from the group consisting of gold, platinum and an gold alloy, the gold alloy containing gold and at least one element selected from transition metal elements of the fourth period, fifth period and sixth period of the Periodic Table, and a catalyst carrier carrying the catalyst particle and containing a perovskite type oxide represented by general formula (1) given below:

A_(1-x)B_xTiO_y  (1)

where the element A is at least one element selected from the group consisting of Ca, Sr and Ba, the element B is at least one element selected from the group consisting of La, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb, and Lu, the molar ratio x satisfies 0<x<1, and the molar ratio y satisfies 2.7≦y≦3.