43 results about "Gold alloys" patented technology

A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 μm or more and 0.01 μm or less.

The invention relates to the field of integrated circuit packaging, in particular to a gold-clad silver alloy bonding wire and a preparation method and application thereof. The gold-clad silver alloy bonding wire is mainly made of a silver alloy core material and a pure gold pipe material coated outside the silver alloy core material. The silver alloy core material comprises the following components in parts by mass: 90 to 99 parts of silver, 0.5 to 5 parts of nickel, 0.1 to 3.0 parts of palladium, 0.35 to 3.5 parts of indium and 0.05 to 1 part of yttrium. The gold-clad silver alloy bonding wire has the advantages of being stable in performance and free of residues on the surface, and meanwhile has high corrosion resistance.

The application discloses a kind of heat insulation films and preparation methods thereof.The heat insulation film includes substrate layer, hard coating layer, first dielectric layer, first barrier layer, noble metal layer, second barrier layer, second dielectric layer and adhesive layer from inside to outside.The first dielectric layer is aluminum-doped zinc oxide, the noble metal layer is a silver-gold alloy layer with controllable thickness, and has a gradient distribution of gold content in the thickness direction;The second dielectric layer is formed into a layered composite structure by alternately stacking titanium dioxide and hafnium oxide.The preparation method includes substrate cleaning and surface activation, hard coating layer coating and curing, magnetron sputtering of dielectric layer and barrier layer, alloying deposition of noble metal layer, alternating sputtering of layered composite dielectric, and adhesive layer coating and compounding.The application realizes excellent infrared barrier performance while maintaining high visible light transmittance through the synergistic design of multi-layer structure and components, significantly improves the stability in a humid and hot environment, and reduces the risk of performance degradation.

The invention relates to the field of semiconductor packaging materials, in particular to a high gold bonding alloy wire and a production process and application thereof, and the production process comprises the following steps: smelting and quickly solidifying raw materials with the purity being greater than or equal to 99.999% to prepare a gold alloy ingot with the gold content being greater than or equal to 99.99%; carrying out hot working and multi-pass cold drawing on the gold alloy cast ingot, and carrying out intermediate annealing during cold drawing to obtain an intermediate wire with the diameter of 50-200 microns; plastic twisting deformation is applied to the middle wire, and the twisting deformation degree ranges from 30 circles per meter to 120 circles per meter; the intermediate wire subjected to twisting deformation is subjected to rapid heat treatment, the heat treatment temperature ranges from 350 DEG C to 550 DEG C, the heat treatment time ranges from 2 s to 8 s, and then rapid cooling is conducted; and precisely drawing the wire material subjected to heat treatment to obtain a final finished product with the diameter of 15-33 microns. Through coordination of the components and the process, the problem of sliding balls or pseudo soldering defects is solved, and a high-strength and low-radian product is obtained.

A piece of jewelry having a copper-containing gold alloy consists of 58.5 to 58.7 wt. % gold, 26.9 to 32.6 wt. % copper, 5.7 to 10.7 wt. % silver, 1.0 to 3.0 wt. % palladium, and a remainder containing 0.7 to 2.2 wt. % zinc.

A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and / or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

The use of a silver alloy for manufacturing precious objects by means of a process which includes the following steps: a) adding a polymeric binder to the silver alloy for providing a semi-finished product; and b) sintering the semi-finished product. Besides the common impurities, silver alloy consists of: 80.00 % by weight - 97.50 % by weight of Silver (Ag); 0.01 % by weight - 15.00 % by weight of Indium (In); 0.01 % by weight - 15.00 % by weight of at least one first further element consisting of: Tin (Sn), Gallium (Ga), Copper (Cu), Palladium (Rd), Platinum (Pt), Zinc (Zn), Silicon (Si). A precious object made starting from such silver alloy.

The invention concerns a method for processing an optoelectronic device, wherein a sacrificial layer is deposited covering the sidewalls of a mesa etched semiconductor layer stack. The sacrificial layer may comprise an organic material and is subsequently planarized and recessed are formed therein. A bond layer is deposited into the recess, the bond layer in particular comprising one of an organic material, a nitride-based material, a solder material and a gold alloy. A temporary carrier is attached to the bond layer and the growth substrate removed, thereby exposing portions of the sacrificial layer and the semiconductor layer stack.

A gold alloy wire with excellent strength that can withstand secondary processing and less strength degradation due to heat in the operating environment. The ratio of the specific grain boundary lengths of the crystal grains in the cross section perpendicular to the length direction of the gold alloy wire, as defined by the following formula (1), is 60% or less, and the ratio of the orientation of the crystal orientation <hkl> within the length direction of the gold alloy wire measured in this cross section, with an angular difference of less than 15 degrees relative to the length direction of the gold alloy wire, <111>, is 20% to 70%. The ratio of specific grain boundary lengths = Σ3~Σ29 grain boundary lengths / total grain boundary length (1)

Ablation catheter (1), featuring: - a longitudinally extended catheter shaft (2) with a distal end section (2a), - an electrode (3) connected to the distal end section (2a) which forms a tip of the ablation catheter (1), characterized in that the electrode (3) is made of gold or a gold alloy and is deep-drawn or manufactured using a machining process, wherein the electrode (3) is arranged on and connected to a carrier (4) connected to the distal end section (2a) of the catheter shaft (2).

A metal structure for an optical semiconductor device with improved adhesion to a resin material (3) is manufactured by impregnating and / or coating a substrate (10) having a topmost layer containing at least one selected from gold, silver, gold alloys, and silver alloys on a part or the whole surface with a solution containing a polyallylamine polymer.

The application relates to the field of non-gold alloys, and discloses a large-size oxidation-resistant amorphous alloy ribbon as well as a preparation method and application thereof. The large-size oxidation-resistant amorphous alloy ribbon comprises P 5-8%, Sn 4-16%, Ni 4-14%, Ge 0.05-0.15%, Mo 0.01-0.03%, R 0.05-0.1% and Cu in a residual amount, wherein R is one or more of Sc, Er and Y. The amorphous alloy ribbon has excellent amorphous forming capability under a larger width size, is high in toughness and oxidation resistance, and is excellent in brazing performance.

The present invention relates to a method for manufacturing a watch component, which comprises assembling gold alloys to create a powder mixture for producing an alloy having a particular color, said powders being combined and arranged to produce a visual effect on said watch component. The invention further relates to a watch component and to a watch comprising at least one said watch component.

This application discloses a dental prosthesis and its fabrication method. The method includes: fabricating a gold alloy inner crown using a lost-wax casting process; fabricating a glass-ceramic outer crown using 3D printing or CAD / CAM cutting equipment; sequentially performing surface sandblasting, applying a metal surface treatment agent, and applying a light-curing adhesive on the bonding surface of the gold alloy inner crown; treating the bonding surface of the glass-ceramic outer crown with acid etching and a silane coupling agent; and finally bonding and fixing the glass-ceramic outer crown to the gold alloy inner crown using adhesive resin. This application uses a cold bonding system to achieve the molding of the gold alloy inner crown and the glass-ceramic outer crown, replacing the traditional high-temperature sintering process. This eliminates the potential for thermal stress at the source, avoiding problems such as porcelain chipping, inner crown oxidation, and edge deformation caused by high temperatures, while preserving the mechanical properties of the gold alloy and the aesthetic properties of the glass-ceramic.

The invention relates to the field of amorphous alloy, and discloses a large-size anti-oxidation amorphous alloy ribbon as well as a preparation method and application thereof. The large-size antioxidant amorphous alloy ribbon comprises the following components in percentage by weight: 5 to 8 percent of P, 4 to 16 percent of Sn, 4 to 14 percent of Ni, 0.05 to 0.15 percent of Ge, 0.01 to 0.03 percent of Mo, 0.05 to 0.1 percent of R and the balance of Cu, wherein R is one or more of Sc, Er and Y. The amorphous alloy ribbon still has excellent amorphous forming ability under a large width size, and also has high toughness and high oxidation resistance, so that the amorphous alloy ribbon has excellent brazing performance.

The invention relates to a method for manufacturing a timepiece component, in which a gold alloy is assembled into a mixed powder to produce an alloy having a specific color. These powders are combined and arranged to create a visual effect on the timepiece component. The invention also relates to a timepiece component and to a timepiece comprising at least one said timepiece component.

The present invention relates to a method for manufacturing a metal element of a piece of jewelry or a timepiece, the method comprising the steps of: (a) shaping and agglomerating a solid composition comprising a metal powder and optionally an organic binder, the metal powder consisting of particles of an alloy selected from the group consisting of the following alloys: * gold alloys containing at least 583 wt‰ gold; * silver alloys containing at least 750 wt‰ silver; * platinum alloys containing at least 850 wt‰ platinum; shaping the mixture, forming an agglomerate of metal particles; (b) forming a metal element by sintering the agglomerate of metal particles on a support at a sintering temperature Tfri, the support having a coefficient of thermal expansion ΔV1, the agglomerate of metal particles having a coefficient of thermal expansion ΔV2, where 0.5*|ΔV2| ≤ |ΔV1| ≤ 1.5*|ΔV2| over a temperature range between * Tfri-200°C and Tfri for gold or silver alloys; * Tfri-400°C and Tfri for platinum alloys, the support and the agglomerate of metal particles being made of different materials.

This disclosure relates to a platinum alloy for use in jewelry: - Platinum at 920‰ to 980‰ weight; - Tin in quantities of 5 m / s to 35 m / s; - Ruthenium in 8 wt‰ to 45 wt‰ or copper in 2 wt‰ to 45 wt‰; Regarding platinum alloys.

The present invention discloses a gold alloy self-adhesive enameled wire and a preparation method thereof, and relates to the technical field of enameled wire processing, wherein the gold alloy self-adhesive enameled wire comprises a gold alloy wire core, a basic insulating layer located outside the gold alloy wire core, and a self-adhesive insulating layer located outside the basic insulating layer, and the preparation method of the gold alloy self-adhesive enameled wire is realized by a preparation device for the gold alloy self-adhesive enameled wire; the preparation device for the gold alloy self-adhesive enameled wire comprises a shell, a positioning mechanism is provided at the inner left end of the shell, and a multiple driving mechanism is provided at the inner right end of the shell, and a one-way switching mechanism is connected to the left end of the multiple driving mechanism. The present invention can conveniently complete the switching of the contact position between the strip sandpaper and the basic insulating layer enameled wire, and the operation is simple and labor-saving, while greatly reducing the difficulty of operation, and the switching can be realized during the polishing process or the non-polishing process, and the use is more flexible.

Use of a silver-copper-gold alloy, which, based on the total weight of the alloy, consists of ≥ 97.50 wt.% to ≤ 98.50 wt.% silver, ≥ 0.75 wt.% to ≤ 1.25 wt.% copper and ≥ 0.75 wt.% to ≤ 1.25 wt.% gold consists of an electrical, electronic and / or electrotechnical component and / or a device for sound reproduction and / or recording and / or for sound signal processing, output, reception and / or transmission, wherein the electrical, electronic and / or electrotechnical component is a component of a loudspeaker and / or an amplifier and / or an audio signal source and / or a microphone and / or a pickup and / or a mixing console, wherein the electrical, electronic and / or electrotechnical component is an inductive electronic component, namely a coil, in particular a voice coil, and / or a capacitive electronic component, namely a capacitor, and / or a crossover, in particular a crossover, and / or an ohmic resistor and / or a switch and / or a transformer, for example an audio and / or voltage transformer, and / or a solder and / or a connection element, for example for connecting a coil and / or a capacitor and / or for connecting a printed circuit board and / or a crossover, such as e.g.a crossover network, and / or for connecting an ohmic resistor and / or a switch and / or for connecting a transformer, for example an audio and / or voltage transformer, and / or for connecting a loudspeaker, and / or for connecting an amplifier and / or an audio signal source and / or a microphone and / or a pickup, especially for an instrument, for example a guitar, and / or for connecting a mixing console, for example a terminal, for example a loudspeaker terminal and / or an amplifier terminal, and / or a clamp and / or a plug and / or a socket and / or a wire and / or a flag, and / or . wherein the electrical, electronic and / or electrotechnical device is a loudspeaker and / or an amplifier and / or a sound signal source and / or a microphone and / or a pickup and / or a mixing console.

The shielding piece comprises a body part, a substrate connecting part located at one end of the body part and a contact part located at the other end of the body part, and the shielding piece surrounds the periphery of the connector; each of the body part, the substrate connecting part and the contact part comprises an exposed surface exposed out of the base; the substrate connecting part is formed around the whole circumference of the connector; the body part, the substrate connecting part and the contact part respectively comprise a metal base material and first to third layers formed on the metal base material; the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, and the thickness of the third layer is 0.2-15 nm.

A gold alloy may contain, by weight, between 73% and 77% of gold, between 5% and 11% of silver, between 1% and 7% of palladium, and between 10% and 18% of copper. The gold alloy may include iridium, rhenium, and / or ruthenium in up to 0.05 wt. %. The gold alloy may have an a* value in a range of from 3 to 9, and a b* value in a range of from 12 to 18, in CIELAB color space. A timepiece, piece of jewelry, or gemstone jewelry, may be made of such a gold alloy.

A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 μm or more and 0.3 μm or less.

A method of inhibiting tarnish formation of silver or silver alloy and corrosion of gold or gold alloy by applying a thin coating of bismuth on the silver, silver alloy, gold or gold alloy. The thin bismuth coating does not compromise the electrical performance of the silver, silver alloy, gold or gold alloy even after thermal aging.

A conductive member includes a main body part, a board connecting part positioned at a first end of the main body part, and a contact point part positioned at a second end of the main body part, the main body part, board connecting part, and contact point part each include exposed surfaces exposed outside of a housing, the main body part, board connecting part, and contact point part each include a metal base material and first to third layers formed on the metal base material, and the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, the thickness of the second layer is 2 to 200 [nm], and the thickness of the third layer is 0.2 to 15 [nm].

The conductive component comprises a body part, a substrate connecting part located at one end of the body part and a contact part located at the other end of the body part, and the body part, the substrate connecting part and the contact part each comprise an exposed face exposed out of the base. Each of the body part, the substrate connection part and the contact part comprises a metal base material and first to third layers formed on the metal base material, and the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, and the first to third layers are formed on the metal base material. The thickness of the second layer ranges from 2 nm to 200 nm, and the thickness of the third layer ranges from 0.2 nm to 15 nm.

The invention relates to the technical field of semiconductor test probes, discloses a high-sensitivity palladium-gold semiconductor test probe system, and aims to solve the problems of signal attenuation, test fluctuation, short service life and the like caused by high material resistivity, unstable contact resistance and easy oxidation of a traditional probe. The system comprises a palladium-gold alloy probe main body, a contact interface enhancement module integrated with an amorphous carbon protection layer and a noble metal transition layer, a signal transmission optimization module comprising an impedance matching and signal conditioning circuit, and a system control unit for monitoring contact resistance, pressure and temperature in real time, through material optimization, interface enhancement and closed-loop monitoring, low-resistance and high-stability contact is realized, the test sensitivity and precision are remarkably improved, and the service life of the probe is remarkably prolonged.

A method of inhibiting tarnish formation of silver or silver alloy and corrosion of gold or gold alloy by applying a thin coating of bismuth on the silver, silver alloy, gold or gold alloy. The thin bismuth coating does not compromise the electrical performance of the silver, silver alloy, gold or gold alloy even after thermal aging.

The invention belongs to the technical field of photocatalysis and carbon dioxide resource utilization, and relates to a preparation method of an oxygen-resistant NiAu alloy nano-cluster loaded titanium dioxide photocatalyst and application of the oxygen-resistant NiAu alloy nano-cluster loaded titanium dioxide photocatalyst in carbon dioxide reduction in an oxygen-containing atmosphere. The method comprises the following steps: dispersing a TiO2 carrier, adding Ni and Au precursors, and carrying out photo-reduction to form a NiAu alloy nano-cluster precursor; the precursor is placed in a Fe < 3 + > acid solution for directional etching, Ni atoms on the surface layer are selectively removed, Au sites are exposed, and the oxygen-resistant NiAu-TiO2 photocatalyst with the surface rich in Au is obtained. According to the catalyst, CO2 is activated through Ni sites, O2 adsorption is inhibited through an Au-rich surface layer, and efficient Ni-Au synergy is achieved. In an atmosphere containing 5% of O2, the CO generation rate can reach 375.5 [mu] mol.g <-1 >. H <-1 >, the selectivity is close to 100%, and high activity and stability are maintained in simulated flue gas. The process is simple, the precious metal utilization rate is high, and an effective solution is provided for direct photocatalytic conversion of CO2 in oxygen-containing industrial waste gas.