19 results about "Gold alloys" patented technology

The application discloses a kind of heat insulation films and preparation methods thereof.The heat insulation film includes substrate layer, hard coating layer, first dielectric layer, first barrier layer, noble metal layer, second barrier layer, second dielectric layer and adhesive layer from inside to outside.The first dielectric layer is aluminum-doped zinc oxide, the noble metal layer is a silver-gold alloy layer with controllable thickness, and has a gradient distribution of gold content in the thickness direction;The second dielectric layer is formed into a layered composite structure by alternately stacking titanium dioxide and hafnium oxide.The preparation method includes substrate cleaning and surface activation, hard coating layer coating and curing, magnetron sputtering of dielectric layer and barrier layer, alloying deposition of noble metal layer, alternating sputtering of layered composite dielectric, and adhesive layer coating and compounding.The application realizes excellent infrared barrier performance while maintaining high visible light transmittance through the synergistic design of multi-layer structure and components, significantly improves the stability in a humid and hot environment, and reduces the risk of performance degradation.

A piece of jewelry having a copper-containing gold alloy consists of 58.5 to 58.7 wt. % gold, 26.9 to 32.6 wt. % copper, 5.7 to 10.7 wt. % silver, 1.0 to 3.0 wt. % palladium, and a remainder containing 0.7 to 2.2 wt. % zinc.

A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and / or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

The application relates to the field of non-gold alloys, and discloses a large-size oxidation-resistant amorphous alloy ribbon as well as a preparation method and application thereof. The large-size oxidation-resistant amorphous alloy ribbon comprises P 5-8%, Sn 4-16%, Ni 4-14%, Ge 0.05-0.15%, Mo 0.01-0.03%, R 0.05-0.1% and Cu in a residual amount, wherein R is one or more of Sc, Er and Y. The amorphous alloy ribbon has excellent amorphous forming capability under a larger width size, is high in toughness and oxidation resistance, and is excellent in brazing performance.

This application discloses a dental prosthesis and its fabrication method. The method includes: fabricating a gold alloy inner crown using a lost-wax casting process; fabricating a glass-ceramic outer crown using 3D printing or CAD / CAM cutting equipment; sequentially performing surface sandblasting, applying a metal surface treatment agent, and applying a light-curing adhesive on the bonding surface of the gold alloy inner crown; treating the bonding surface of the glass-ceramic outer crown with acid etching and a silane coupling agent; and finally bonding and fixing the glass-ceramic outer crown to the gold alloy inner crown using adhesive resin. This application uses a cold bonding system to achieve the molding of the gold alloy inner crown and the glass-ceramic outer crown, replacing the traditional high-temperature sintering process. This eliminates the potential for thermal stress at the source, avoiding problems such as porcelain chipping, inner crown oxidation, and edge deformation caused by high temperatures, while preserving the mechanical properties of the gold alloy and the aesthetic properties of the glass-ceramic.

This disclosure relates to a platinum alloy for use in jewelry: - Platinum at 920‰ to 980‰ weight; - Tin in quantities of 5 m / s to 35 m / s; - Ruthenium in 8 wt‰ to 45 wt‰ or copper in 2 wt‰ to 45 wt‰; Regarding platinum alloys.

A conductive member includes a main body part, a board connecting part positioned at a first end of the main body part, and a contact point part positioned at a second end of the main body part, the main body part, board connecting part, and contact point part each include exposed surfaces exposed outside of a housing, the main body part, board connecting part, and contact point part each include a metal base material and first to third layers formed on the metal base material, and the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, the thickness of the second layer is 2 to 200 [nm], and the thickness of the third layer is 0.2 to 15 [nm].

A method of inhibiting tarnish formation of silver or silver alloy and corrosion of gold or gold alloy by applying a thin coating of bismuth on the silver, silver alloy, gold or gold alloy. The thin bismuth coating does not compromise the electrical performance of the silver, silver alloy, gold or gold alloy even after thermal aging.

The invention belongs to the technical field of photocatalysis and carbon dioxide resource utilization, and relates to a preparation method of an oxygen-resistant NiAu alloy nano-cluster loaded titanium dioxide photocatalyst and application of the oxygen-resistant NiAu alloy nano-cluster loaded titanium dioxide photocatalyst in carbon dioxide reduction in an oxygen-containing atmosphere. The method comprises the following steps: dispersing a TiO2 carrier, adding Ni and Au precursors, and carrying out photo-reduction to form a NiAu alloy nano-cluster precursor; the precursor is placed in a Fe < 3 + > acid solution for directional etching, Ni atoms on the surface layer are selectively removed, Au sites are exposed, and the oxygen-resistant NiAu-TiO2 photocatalyst with the surface rich in Au is obtained. According to the catalyst, CO2 is activated through Ni sites, O2 adsorption is inhibited through an Au-rich surface layer, and efficient Ni-Au synergy is achieved. In an atmosphere containing 5% of O2, the CO generation rate can reach 375.5 [mu] mol.g <-1 >. H <-1 >, the selectivity is close to 100%, and high activity and stability are maintained in simulated flue gas. The process is simple, the precious metal utilization rate is high, and an effective solution is provided for direct photocatalytic conversion of CO2 in oxygen-containing industrial waste gas.

It is known that when etching gold films using etching solutions containing iodine and iodide, N-methyl-2-pyrrolidinone (NMP) is added to improve the etching solution's wettability, microfabrication property, and solution life. However, in recent years, the use of NMP has been regulated due to its adverse effects on human health. The present invention provides an etching solution and etching method for gold film that improves wettability, microfabrication property, and solution life without containing NMP. In order to address the problem of the prior art, the present invention provides etching solutions and etching methods for gold films that improve wettability, microfabrication property, and liquid life without NMP, characterized by the inclusion of a specific organic solvent in the etching solution containing iodine and iodide. [No Figure]

This invention relates to the field of semiconductor packaging materials, specifically to a high-gold-bond alloy wire, its production process, and its applications. The process includes the following steps: melting and rapidly solidifying raw materials with a purity ≥99.999% to prepare a gold alloy ingot with a gold content ≥99.99%; hot-working and multi-pass cold drawing of the gold alloy ingot, with intermediate annealing during cold drawing to obtain an intermediate wire with a diameter between 50μm and 200μm; applying plastic torsional deformation to the intermediate wire at a degree of 30 turns / meter to 120 turns / meter; subjecting the torsional-deformed intermediate wire to rapid heat treatment at a temperature of 350℃ to 550℃ for 2s to 8s, followed by rapid cooling; and precision drawing the heat-treated wire to a final product with a diameter of 15μm to 33μm. This invention, through the coordination of components and processes, solves the problem of slippage or poor soldering defects, achieving the goal of producing high-strength, low-curvature products.

The utility model provides a quartz crystal relates to quartz crystal technical field, including base, the base is opened in the base cavity that has the cover plate, wafer, the upper and lower surface of wafer all form the silver gold alloy electrode of gradient structure, and one end of wafer is bonded in the base cavity through conductive glue. Advantageous effect is that the silver gold alloy with good thermal expansion coefficient matching, excellent stability and medium price is used as electrode main material in the quartz crystal, which reduces the electrode cost under the performance premise of meeting the low aging rate of medium and high frequency products.

A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and / or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

The invention discloses a wear-resistant and corrosion-resistant 1K gold alloy for jewelry and a preparation method of the wear-resistant and corrosion-resistant 1K gold alloy, and belongs to the technical field of precious metal materials and jewelry processing. According to the alloy, on the basis of 4.166% of gold, 0.1%-0.5% of rhodium (Rh) is creatively added, and ruthenium, iridium, gallium, zirconium, zinc and copper are cooperatively matched. The component design aims at forming a stable rhodium-rich transition region on the surface of a matrix. The preparation method sequentially comprises the steps of precision casting, surface mirror finishing and electrochemical activation, gradient composite electroplating (firstly plating the hard gold layer and then plating the rhodium / ruthenium surface layer) and low-temperature thermal diffusion stabilization treatment. The core of the invention is that unique alloy components are combined with a systematized surface engineering process, so that the prepared jewelry product keeps the remarkable cost advantage, and meanwhile, the obtained product is strong in plating binding force, high in surface hardness and excellent in wear resistance and corrosion resistance; and an effective technical scheme is provided for developing the 1K gold jewelry with high quality and high cost performance.

A shield includes a main body part, a board connecting part at a first end of the main body part, and a contact point part at a second end of the main body part, and surrounds a periphery of the connector; the main body part, board connecting part, and contact point part include exposed surface exposed outside of a housing; the board connecting part is formed around the entire periphery of the connector; the main body part, board connecting part, and contact point part include a metal base material and first to third plating layers formed on the metal base material; and the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or platinum group metal plating layer, the third layer is a gold or gold alloy plating layer, and a thickness of the third layer is 0.2 to 15 [nm].

The present invention provides a semiconductor module manufacturing method and a semiconductor module capable of significantly reducing the thermal resistance of the semiconductor module. This semiconductor module comprises a semiconductor chip (12), a joining layer (11), and a metal plate (101) in this order. The joining layer (11) includes at least one type of substance selected from the group consisting of gold, silver, a gold alloy, and a silver alloy. The main surface, of the metal plate (101), on the joining layer (11) side includes a polycrystalline structure of copper and / or a copper alloy. The metal plate (101) has, on the main surface (101a), a texture in which the maximum value of the degree of integration of the <111> axis during a polar analysis using X-ray diffraction is greater than 20.

The utility model provides an electroplating flow field baffle plate and an electroplating system, the electroplating flow field baffle plate is used for electroplating silver-gold alloy bumps and comprises a baffle plate body, and the baffle plate body is provided with a plurality of holes; wherein the aperture size of the opening in the central area of the shielding plate body is larger than that of the opening in the edge area of the shielding plate body. The aperture size of the holes in the central area of the shielding plate body is increased, so that the convection of plating solution can be increased, the plating solution exchange during electroplating is facilitated, and the concentration stability of Ag + and Au + during electroplating is ensured, thereby improving the electroplating efficiency of the central area of the wafer, and finally increasing the height of the bumps in the central area of the wafer. And the uniformity of the height of the silver-gold alloy bump and the silver-gold ratio of the wafer is optimal.

It is known that when etching gold films using etching solutions containing iodine and iodide, N-methyl-2-pyrrolidinone (NP) is added to improve the etching solution's wettability, microfabrication property, and solution life. However, in recent years, the use of NMP has been regulated due to its adverse effects on human health. The present invention provides an etching solution and etching method for gold film that improves wettability, microfabrication property, and solution life without containing NP. In order to address the problem of the prior art, the present invention provides etching solutions and etching methods for gold films that improve wettability, microfabrication property, and liquid life without NMP, characterized by the inclusion of a specific organic solvent in the etching solution containing iodine and iodide.