34 results about "Gold alloys" patented technology

The application discloses a kind of heat insulation films and preparation methods thereof.The heat insulation film includes substrate layer, hard coating layer, first dielectric layer, first barrier layer, noble metal layer, second barrier layer, second dielectric layer and adhesive layer from inside to outside.The first dielectric layer is aluminum-doped zinc oxide, the noble metal layer is a silver-gold alloy layer with controllable thickness, and has a gradient distribution of gold content in the thickness direction;The second dielectric layer is formed into a layered composite structure by alternately stacking titanium dioxide and hafnium oxide.The preparation method includes substrate cleaning and surface activation, hard coating layer coating and curing, magnetron sputtering of dielectric layer and barrier layer, alloying deposition of noble metal layer, alternating sputtering of layered composite dielectric, and adhesive layer coating and compounding.The application realizes excellent infrared barrier performance while maintaining high visible light transmittance through the synergistic design of multi-layer structure and components, significantly improves the stability in a humid and hot environment, and reduces the risk of performance degradation.

The invention relates to the field of semiconductor packaging materials, in particular to a high gold bonding alloy wire and a production process and application thereof, and the production process comprises the following steps: smelting and quickly solidifying raw materials with the purity being greater than or equal to 99.999% to prepare a gold alloy ingot with the gold content being greater than or equal to 99.99%; carrying out hot working and multi-pass cold drawing on the gold alloy cast ingot, and carrying out intermediate annealing during cold drawing to obtain an intermediate wire with the diameter of 50-200 microns; plastic twisting deformation is applied to the middle wire, and the twisting deformation degree ranges from 30 circles per meter to 120 circles per meter; the intermediate wire subjected to twisting deformation is subjected to rapid heat treatment, the heat treatment temperature ranges from 350 DEG C to 550 DEG C, the heat treatment time ranges from 2 s to 8 s, and then rapid cooling is conducted; and precisely drawing the wire material subjected to heat treatment to obtain a final finished product with the diameter of 15-33 microns. Through coordination of the components and the process, the problem of sliding balls or pseudo soldering defects is solved, and a high-strength and low-radian product is obtained.

A piece of jewelry having a copper-containing gold alloy consists of 58.5 to 58.7 wt. % gold, 26.9 to 32.6 wt. % copper, 5.7 to 10.7 wt. % silver, 1.0 to 3.0 wt. % palladium, and a remainder containing 0.7 to 2.2 wt. % zinc.

A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and / or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

Ablation catheter (1), featuring: - a longitudinally extended catheter shaft (2) with a distal end section (2a), - an electrode (3) connected to the distal end section (2a) which forms a tip of the ablation catheter (1), characterized in that the electrode (3) is made of gold or a gold alloy and is deep-drawn or manufactured using a machining process, wherein the electrode (3) is arranged on and connected to a carrier (4) connected to the distal end section (2a) of the catheter shaft (2).

A metal structure for an optical semiconductor device with improved adhesion to a resin material (3) is manufactured by impregnating and / or coating a substrate (10) having a topmost layer containing at least one selected from gold, silver, gold alloys, and silver alloys on a part or the whole surface with a solution containing a polyallylamine polymer.

The application relates to the field of non-gold alloys, and discloses a large-size oxidation-resistant amorphous alloy ribbon as well as a preparation method and application thereof. The large-size oxidation-resistant amorphous alloy ribbon comprises P 5-8%, Sn 4-16%, Ni 4-14%, Ge 0.05-0.15%, Mo 0.01-0.03%, R 0.05-0.1% and Cu in a residual amount, wherein R is one or more of Sc, Er and Y. The amorphous alloy ribbon has excellent amorphous forming capability under a larger width size, is high in toughness and oxidation resistance, and is excellent in brazing performance.

The present invention relates to a method for manufacturing a watch component, which comprises assembling gold alloys to create a powder mixture for producing an alloy having a particular color, said powders being combined and arranged to produce a visual effect on said watch component. The invention further relates to a watch component and to a watch comprising at least one said watch component.

This application discloses a dental prosthesis and its fabrication method. The method includes: fabricating a gold alloy inner crown using a lost-wax casting process; fabricating a glass-ceramic outer crown using 3D printing or CAD / CAM cutting equipment; sequentially performing surface sandblasting, applying a metal surface treatment agent, and applying a light-curing adhesive on the bonding surface of the gold alloy inner crown; treating the bonding surface of the glass-ceramic outer crown with acid etching and a silane coupling agent; and finally bonding and fixing the glass-ceramic outer crown to the gold alloy inner crown using adhesive resin. This application uses a cold bonding system to achieve the molding of the gold alloy inner crown and the glass-ceramic outer crown, replacing the traditional high-temperature sintering process. This eliminates the potential for thermal stress at the source, avoiding problems such as porcelain chipping, inner crown oxidation, and edge deformation caused by high temperatures, while preserving the mechanical properties of the gold alloy and the aesthetic properties of the glass-ceramic.

The invention relates to the field of amorphous alloy, and discloses a large-size anti-oxidation amorphous alloy ribbon as well as a preparation method and application thereof. The large-size antioxidant amorphous alloy ribbon comprises the following components in percentage by weight: 5 to 8 percent of P, 4 to 16 percent of Sn, 4 to 14 percent of Ni, 0.05 to 0.15 percent of Ge, 0.01 to 0.03 percent of Mo, 0.05 to 0.1 percent of R and the balance of Cu, wherein R is one or more of Sc, Er and Y. The amorphous alloy ribbon still has excellent amorphous forming ability under a large width size, and also has high toughness and high oxidation resistance, so that the amorphous alloy ribbon has excellent brazing performance.

The invention relates to a method for manufacturing a timepiece component, in which a gold alloy is assembled into a mixed powder to produce an alloy having a specific color. These powders are combined and arranged to create a visual effect on the timepiece component. The invention also relates to a timepiece component and to a timepiece comprising at least one said timepiece component.

The present invention relates to a method for manufacturing a metal element of a piece of jewelry or a timepiece, the method comprising the steps of: (a) shaping and agglomerating a solid composition comprising a metal powder and optionally an organic binder, the metal powder consisting of particles of an alloy selected from the group consisting of the following alloys: * gold alloys containing at least 583 wt‰ gold; * silver alloys containing at least 750 wt‰ silver; * platinum alloys containing at least 850 wt‰ platinum; shaping the mixture, forming an agglomerate of metal particles; (b) forming a metal element by sintering the agglomerate of metal particles on a support at a sintering temperature Tfri, the support having a coefficient of thermal expansion ΔV1, the agglomerate of metal particles having a coefficient of thermal expansion ΔV2, where 0.5*|ΔV2| ≤ |ΔV1| ≤ 1.5*|ΔV2| over a temperature range between * Tfri-200°C and Tfri for gold or silver alloys; * Tfri-400°C and Tfri for platinum alloys, the support and the agglomerate of metal particles being made of different materials.

This disclosure relates to a platinum alloy for use in jewelry: - Platinum at 920‰ to 980‰ weight; - Tin in quantities of 5 m / s to 35 m / s; - Ruthenium in 8 wt‰ to 45 wt‰ or copper in 2 wt‰ to 45 wt‰; Regarding platinum alloys.

The present invention discloses a gold alloy self-adhesive enameled wire and a preparation method thereof, and relates to the technical field of enameled wire processing, wherein the gold alloy self-adhesive enameled wire comprises a gold alloy wire core, a basic insulating layer located outside the gold alloy wire core, and a self-adhesive insulating layer located outside the basic insulating layer, and the preparation method of the gold alloy self-adhesive enameled wire is realized by a preparation device for the gold alloy self-adhesive enameled wire; the preparation device for the gold alloy self-adhesive enameled wire comprises a shell, a positioning mechanism is provided at the inner left end of the shell, and a multiple driving mechanism is provided at the inner right end of the shell, and a one-way switching mechanism is connected to the left end of the multiple driving mechanism. The present invention can conveniently complete the switching of the contact position between the strip sandpaper and the basic insulating layer enameled wire, and the operation is simple and labor-saving, while greatly reducing the difficulty of operation, and the switching can be realized during the polishing process or the non-polishing process, and the use is more flexible.

A gold alloy may contain, by weight, between 73% and 77% of gold, between 5% and 11% of silver, between 1% and 7% of palladium, and between 10% and 18% of copper. The gold alloy may include iridium, rhenium, and / or ruthenium in up to 0.05 wt. %. The gold alloy may have an a* value in a range of from 3 to 9, and a b* value in a range of from 12 to 18, in CIELAB color space. A timepiece, piece of jewelry, or gemstone jewelry, may be made of such a gold alloy.

A method of inhibiting tarnish formation of silver or silver alloy and corrosion of gold or gold alloy by applying a thin coating of bismuth on the silver, silver alloy, gold or gold alloy. The thin bismuth coating does not compromise the electrical performance of the silver, silver alloy, gold or gold alloy even after thermal aging.

A conductive member includes a main body part, a board connecting part positioned at a first end of the main body part, and a contact point part positioned at a second end of the main body part, the main body part, board connecting part, and contact point part each include exposed surfaces exposed outside of a housing, the main body part, board connecting part, and contact point part each include a metal base material and first to third layers formed on the metal base material, and the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, the thickness of the second layer is 2 to 200 [nm], and the thickness of the third layer is 0.2 to 15 [nm].

The conductive component comprises a body part, a substrate connecting part located at one end of the body part and a contact part located at the other end of the body part, and the body part, the substrate connecting part and the contact part each comprise an exposed face exposed out of the base. Each of the body part, the substrate connection part and the contact part comprises a metal base material and first to third layers formed on the metal base material, and the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, and the first to third layers are formed on the metal base material. The thickness of the second layer ranges from 2 nm to 200 nm, and the thickness of the third layer ranges from 0.2 nm to 15 nm.

The invention relates to the technical field of semiconductor test probes, discloses a high-sensitivity palladium-gold semiconductor test probe system, and aims to solve the problems of signal attenuation, test fluctuation, short service life and the like caused by high material resistivity, unstable contact resistance and easy oxidation of a traditional probe. The system comprises a palladium-gold alloy probe main body, a contact interface enhancement module integrated with an amorphous carbon protection layer and a noble metal transition layer, a signal transmission optimization module comprising an impedance matching and signal conditioning circuit, and a system control unit for monitoring contact resistance, pressure and temperature in real time, through material optimization, interface enhancement and closed-loop monitoring, low-resistance and high-stability contact is realized, the test sensitivity and precision are remarkably improved, and the service life of the probe is remarkably prolonged.

A method of inhibiting tarnish formation of silver or silver alloy and corrosion of gold or gold alloy by applying a thin coating of bismuth on the silver, silver alloy, gold or gold alloy. The thin bismuth coating does not compromise the electrical performance of the silver, silver alloy, gold or gold alloy even after thermal aging.

The invention belongs to the technical field of photocatalysis and carbon dioxide resource utilization, and relates to a preparation method of an oxygen-resistant NiAu alloy nano-cluster loaded titanium dioxide photocatalyst and application of the oxygen-resistant NiAu alloy nano-cluster loaded titanium dioxide photocatalyst in carbon dioxide reduction in an oxygen-containing atmosphere. The method comprises the following steps: dispersing a TiO2 carrier, adding Ni and Au precursors, and carrying out photo-reduction to form a NiAu alloy nano-cluster precursor; the precursor is placed in a Fe < 3 + > acid solution for directional etching, Ni atoms on the surface layer are selectively removed, Au sites are exposed, and the oxygen-resistant NiAu-TiO2 photocatalyst with the surface rich in Au is obtained. According to the catalyst, CO2 is activated through Ni sites, O2 adsorption is inhibited through an Au-rich surface layer, and efficient Ni-Au synergy is achieved. In an atmosphere containing 5% of O2, the CO generation rate can reach 375.5 [mu] mol.g <-1 >. H <-1 >, the selectivity is close to 100%, and high activity and stability are maintained in simulated flue gas. The process is simple, the precious metal utilization rate is high, and an effective solution is provided for direct photocatalytic conversion of CO2 in oxygen-containing industrial waste gas.

It is known that when etching gold films using etching solutions containing iodine and iodide, N-methyl-2-pyrrolidinone (NMP) is added to improve the etching solution's wettability, microfabrication property, and solution life. However, in recent years, the use of NMP has been regulated due to its adverse effects on human health. The present invention provides an etching solution and etching method for gold film that improves wettability, microfabrication property, and solution life without containing NMP. In order to address the problem of the prior art, the present invention provides etching solutions and etching methods for gold films that improve wettability, microfabrication property, and liquid life without NMP, characterized by the inclusion of a specific organic solvent in the etching solution containing iodine and iodide. [No Figure]

This invention relates to the field of semiconductor packaging materials, specifically to a high-gold-bond alloy wire, its production process, and its applications. The process includes the following steps: melting and rapidly solidifying raw materials with a purity ≥99.999% to prepare a gold alloy ingot with a gold content ≥99.99%; hot-working and multi-pass cold drawing of the gold alloy ingot, with intermediate annealing during cold drawing to obtain an intermediate wire with a diameter between 50μm and 200μm; applying plastic torsional deformation to the intermediate wire at a degree of 30 turns / meter to 120 turns / meter; subjecting the torsional-deformed intermediate wire to rapid heat treatment at a temperature of 350℃ to 550℃ for 2s to 8s, followed by rapid cooling; and precision drawing the heat-treated wire to a final product with a diameter of 15μm to 33μm. This invention, through the coordination of components and processes, solves the problem of slippage or poor soldering defects, achieving the goal of producing high-strength, low-curvature products.

The utility model provides a quartz crystal relates to quartz crystal technical field, including base, the base is opened in the base cavity that has the cover plate, wafer, the upper and lower surface of wafer all form the silver gold alloy electrode of gradient structure, and one end of wafer is bonded in the base cavity through conductive glue. Advantageous effect is that the silver gold alloy with good thermal expansion coefficient matching, excellent stability and medium price is used as electrode main material in the quartz crystal, which reduces the electrode cost under the performance premise of meeting the low aging rate of medium and high frequency products.

A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and / or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

The invention discloses a wear-resistant and corrosion-resistant 1K gold alloy for jewelry and a preparation method of the wear-resistant and corrosion-resistant 1K gold alloy, and belongs to the technical field of precious metal materials and jewelry processing. According to the alloy, on the basis of 4.166% of gold, 0.1%-0.5% of rhodium (Rh) is creatively added, and ruthenium, iridium, gallium, zirconium, zinc and copper are cooperatively matched. The component design aims at forming a stable rhodium-rich transition region on the surface of a matrix. The preparation method sequentially comprises the steps of precision casting, surface mirror finishing and electrochemical activation, gradient composite electroplating (firstly plating the hard gold layer and then plating the rhodium / ruthenium surface layer) and low-temperature thermal diffusion stabilization treatment. The core of the invention is that unique alloy components are combined with a systematized surface engineering process, so that the prepared jewelry product keeps the remarkable cost advantage, and meanwhile, the obtained product is strong in plating binding force, high in surface hardness and excellent in wear resistance and corrosion resistance; and an effective technical scheme is provided for developing the 1K gold jewelry with high quality and high cost performance.

The application discloses a transistor, a manufacturing method thereof and an electronic device. The manufacturing material of the electrode comprises titanium alloy and gold alloy. The conductive penetrating part penetrates through the barrier layer and is directly connected with the two-dimensional electron gas in the electrode and the channel layer respectively, so that the direct contact between the electrode and the two-dimensional electron gas is realized. When the contact between the electrode and the two-dimensional electron gas is ohmic contact, the existence of the conductive penetrating part can reduce the contact resistance in the ohmic contact, thereby improving the electrical performance of the transistor.

The invention relates to a sulfur atom-doped gold-silver alloy nanocluster capable of emitting light in a near-infrared second region as well as a preparation method and application of the sulfur atom-doped gold-silver alloy nanocluster. The nano-cluster is a water phase Au25 nano-cluster co-doped with Ag (silver) and S (sulfur), namely Au13-16Ag12-9S2. The near-infrared second-region photoluminescence property of the nanocluster at 1030 nm is remarkably improved, and the intensity is improved by 10 times or more compared with that of a classic nanocluster without doped water phase Au25; meanwhile, the nanocluster not only has higher imaging contrast in the aspect of photoluminescence imaging of near-infrared second regions of lymphatic vessels and inflammatory lymph nodes, but also shows lower tissue accumulation and higher in-vivo clearing efficiency after intravenous injection compared with non-doped similar nanoclusters. Therefore, the accurate sulfur atom doped gold-silver alloy nanocluster is expected to provide a new insight for near-infrared fluorescence performance regulation and control and a structure-performance relationship of the metal nanocluster, and has a wide application prospect in the field of biological imaging.

Gold alloy for jewelry or tabulation applications, in particular for the manufacture of jewelry items having at least partial shape and / or dimensional recovery properties upon application of a deformation force, comprising: 700 to 800 per thousand by weight of gold; 25% by weight to 170% by weight of copper; palladium, 50% by weight to 165% by weight; and cobalt, 7% by weight to 40% by weight. And the gold alloy is gray alloy.