An acidic gold alloy plating solution

A plating solution and alloy technology, applied in the field of acidic gold alloy plating solution, can solve problems such as burning

Active Publication Date: 2008-12-31
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, using conventional gold plating baths, there are some problems during high current density plating because of the so-called "burning" phenomenon that occurs on the deposited gold film
In addition, using the traditional gold plating solution, there is a problem that when partial plating is performed on a certain area of ​​an electronic component that requires a gold plating film, gold or gold alloys will also be deposited in the surrounding area, that is, where gold plating is not required

Method used

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  • An acidic gold alloy plating solution
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  • An acidic gold alloy plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-8

[0031] A gold-cobalt plating solution consisting of the following substances was prepared as a base bath.

[0032] Potassium cyanide gold (I) 15g / L (10g / L gold)

[0033] Basic cobalt carbonate 1.16g / L (0.5g / L cobalt)

[0034] Tripotassium citrate monohydrate 116g / L

[0035] Citric anhydride 66.11g / L

[0036] Hexamethylenetetramine 0.5g / L

[0037] Water (deionized water) balance

[0038] The pH value of the above plating solution was adjusted to 4.3 with potassium hydroxide.

Embodiment 1

[0040] The gold-cobalt plating bath in Example 1 was prepared by adding 0.5 g / L nicotinic acid (3-pyridinecarboxylic acid) as a brightener before adjusting the pH value of the above basic bath, and then adjusting the pH value to 4.3.

Embodiment 2-8

[0042] The preparation of the gold-cobalt plating solution was similar to that of Example 1, except that the compounds shown in Table 1 below were added in the indicated concentrations instead of nicotinic acid.

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PUM

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Abstract

The invention relates to a acid gold alloy plating liquid and a plating method thereof, and provides a gild liquid with high sediment selectivity. The gild liquid contains auroc cyanide, Co ions, formamine and special brightener.

Description

technical field [0001] The invention relates to an acidic gold alloy plating solution. Background technique [0002] In recent years, due to the excellent electrical properties and corrosion resistance of gold, gold plating has been widely used on electronic devices and electronic components in order to protect the surface of electronic components such as contact terminals. Gold plating is used as surface treatment of electrode terminals of semiconductor elements, as leads formed in plastic films, or as surface treatment of electronic components such as connectors communicating with electronic devices, and the like. Materials that can be gold-plated include metals, plastics, ceramics, semiconductors, and the like. [0003] Connectors connected to electronic devices use hard gold plating, because according to the characteristics of use, the gold-plated film as a surface treatment must have corrosion resistance, wear resistance, and electrical conductivity. Gold-cobalt alloy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/62
CPCC25D3/62C25D5/12C25D5/627C25D3/48
Inventor 森井丰折桥正典
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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