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Bicomponent epoxy adhesive and preparation thereof

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, non-polymer organic compound adhesive, adhesive type, etc., can solve the problems of low bonding strength, poor deformability, and high brittleness, and achieve High bonding strength, simple process and easy operation

Active Publication Date: 2009-04-22
HAIAN JIAHE CHEM FIBER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cured product of epoxy resin has the disadvantages of poor deformability, high brittleness, and low bonding strength. Simple epoxy resin adhesives have a long curing time under normal temperature and pressure conditions, and the adhesive strength and temperature resistance after curing are not enough. Ideal, therefore, epoxy resin adhesives are constantly improving

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0019] The present invention also provides the preparation method of the above-mentioned adhesive, which method comprises mixing the epoxy resin and the toughening agent to prepare the A component; mixing the curing agent and the curing accelerator to prepare the B component, wherein, in The preparation of component A also includes mixing the unsaturated functional monomers.

[0020] The preparation method of the A component preferably includes: mixing the toughening agent with an organic volatile solvent, dissolving all the toughening agent at 80-90°C; then adding the epoxy resin, removing the After the organic volatile solvent is added, the unsaturated functional monomer is added.

[0021] The organic volatile solvent can be one or more selected from acetone, methyl ethyl ketone and cyclohexanone, based on 100 parts by weight of epoxy resin, the amount of the organic volatile solvent can be 40-80 parts by weight.

[0022] The method of preparing component B is preferably: ...

Embodiment 1

[0025] Add 3 grams of carboxyl-terminated liquid nitrile rubber (CTBN) (Taiwan Nandi Chemical Industry, model: 1052) into a 500ml three-necked flask with a stirring device, then add 40 grams of acetone, and raise the temperature to 80°C. After the nitrile rubber is completely dissolved, add 100 grams of E-51 epoxy resin (produced by Wuxi Resin Factory, number average molecular weight is 800), and stir for 2 hours. After the acetone is completely volatilized, add 50 grams of 1250-mesh silicon powder, 2 grams of fumed silica, 3 grams of γ-(methacryloyloxy)propyltrimethoxysilane (KH-570), α-cyanide 15 grams of ethyl acrylate, and stir well to get A component.

[0026] In another 500ml three-necked flask with a stirring device, add 25 grams of tetraethylenepentamine, 25 grams of p-hydroxybenzoic acid, 5 grams of N-methylolacrylamide, 2,4,6-tris(dimethylaminomethyl ) 3 grams of phenol (DMP-30). After 1 hour of constant temperature reaction at 50°C, the temperature was raised to 1...

Embodiment 2

[0029] Use the A component and B component prepared in Example 1, and mix the A component and the B component at a weight ratio of 2:1 to make an adhesive. The test was carried out according to the method described in Example 1. The curing time at room temperature (25° C.) was 5 minutes, and the tensile shear strength was 11.2 MPa after 30 minutes.

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Abstract

The invention provides a double-component epoxy resin adhesive, wherein component A comprises epoxy resin and a toughening agent, and component B comprises a curing agent and a curing accelerator, wherein the component A also comprises an unsaturated functional monomer which is selected from one or more of olefinic acid, olefinic acid ester, olefinic cyanide and olefinic alcohol. The invention also provides a preparation method for the double-component epoxy resin adhesive. The double-component epoxy resin adhesive has the advantages of high adhesive strength and good flexibility, and the preparation method has the advantages of simple process and easy operation.

Description

technical field [0001] The invention relates to a two-component epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin has good adhesion and corrosion resistance, low curing shrinkage and linear expansion coefficient, and is a commonly used adhesive material. However, the cured product of epoxy resin has the disadvantages of poor deformability, high brittleness, and low bonding strength. Simple epoxy resin adhesives have a long curing time under normal temperature and pressure conditions, and the adhesive strength and temperature resistance after curing are not enough. Ideally, therefore, epoxy resin adhesives are constantly being improved. [0003] The two-component epoxy resin adhesive is an improved epoxy resin adhesive with better comprehensive performance. The two-component epoxy resin adhesive is made by mixing the two components A and B in proportion. Among them, component A mainly contains epoxy resin and toughening agent, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J4/00
Inventor 张文娟张玉梅
Owner HAIAN JIAHE CHEM FIBER
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