Gold alloy bonding wire and manufacturing method thereof

A technology of alloy bonding and manufacturing method, which is applied in the field of bonding wire, can solve the problems of reducing the arc height, not describing the basic performance requirements, roundness and reliability, and not mentioning, so as to reduce the arc height and heat-affected zone The effect of small length and high roundness

Active Publication Date: 2016-08-31
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese invention patent application CN103155129 proposes that when the content of alloy elements Cu, Ag, Pd, and Pt varies between 0.5-30%, the elongation (EL) of the wire varies with temperature in the heat treatment range of 450-...

Method used

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  • Gold alloy bonding wire and manufacturing method thereof
  • Gold alloy bonding wire and manufacturing method thereof
  • Gold alloy bonding wire and manufacturing method thereof

Examples

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Embodiment 1

[0024] The gold alloy bonding wire of this embodiment contains 1.0% palladium (Pd), 24% silver (Ag), 100 ppm calcium (Ca), 80 ppm cerium (Ce), 5 ppm beryllium (Be), and the balance by weight. For gold.

[0025] In this embodiment, the manufacturing method of the gold alloy bonding wire includes the following steps:

[0026] (1) Melting and casting: Add palladium, silver, calcium, cerium, and beryllium to the gold raw material in the above proportions, and obtain a wire with a diameter of 6mm (millimeters) through a directional continuous drawing process;

[0027] (2) Wire drawing: Wire the wire obtained in step (1) to obtain a gold alloy bonding wire with a diameter of 20um (micrometer);

[0028] In this step (2), during the wire drawing process, when the wire is drawn to 0.0990mm, an intermediate annealing is performed, and N is used in the annealing process. 2 As the annealing atmosphere, the effective length of the annealing furnace is 600 mm, the annealing temperature is 600°C, an...

Embodiment 2

[0033] The gold alloy bonding wire of this embodiment contains 1.5% palladium (Pd), 20% silver (Ag), 10 ppm calcium (Ca), 5 ppm beryllium (Be), and the balance by weight.

[0034] In this embodiment, the manufacturing method of the gold alloy bonding wire includes the following steps:

[0035] (1) Melting and casting: Add palladium, silver, calcium, and beryllium to the gold raw materials in the above proportions, and obtain a wire with a diameter of 6mm (millimeters) through a directional continuous drawing process;

[0036] (2) Wire drawing: Wire the wire obtained in step (1) to obtain a gold alloy bonding wire with a diameter of 20um (micrometer);

[0037] In this step (2), during the wire drawing process, when the wire is drawn to 0.0990mm, an intermediate annealing is performed, and N is used in the annealing process. 2 As the annealing atmosphere, the effective length of the annealing furnace is 600 mm, the annealing temperature is 550°C, and the annealing rate is 35m / min;

[0038...

Embodiment 3

[0042] The gold alloy bonding wire of this embodiment contains 1.2% palladium (Pd), 22% silver (Ag), 50 ppm calcium (Ca), 50 ppm cerium (Ce), 20 ppm beryllium (Be), and the balance by weight. For gold.

[0043] In this embodiment, the manufacturing method of the gold alloy bonding wire includes the following steps:

[0044] (1) Melting and casting: Add palladium, silver, calcium, cerium, and beryllium to the gold raw material in the above proportions, and obtain a wire with a diameter of 8mm (millimeters) through a directional continuous drawing process;

[0045] (2) Wire drawing: Wire the wire obtained in step (1) to obtain a gold alloy bonding wire with a diameter of 20um (micrometer);

[0046] In this step (2), during the wire drawing process, when the wire is drawn to 0.0990mm, an intermediate annealing is performed, and N is used in the annealing process. 2 As the annealing atmosphere, the effective length of the annealing furnace is 600 mm, the annealing temperature is 750°C, an...

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Abstract

A gold alloy bonding wire comprises, by weight, 1-1.5% of palladium, 20-24% of silver, 2-200ppm of one or a combination comprising two or more of calcium, beryllium and cerium, and the balance of gold. The invention also provides a manufacturing method of the gold alloy bonding wire. The gold alloy bonding wire can be used in IC and LED packaging, and has excellent integral wiring performances, and the excellent integral wiring performances are characterized in that the length of heated affected zone is small (can reach 53-60[mu]m), and the wiring camber is greatly reduced; the performances of ignition balls are good, a moderate quantity of symmetric cylindrical crystals are obtained after FAB ball ignition, and the roundness of deformed balls is high; and packaged products have good heat shock resistance and high reliability.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a gold alloy bonding wire suitable for low-arc wire bonding packaging and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, is mainly the miniaturization of wire diameter, high floor life and high bobbin length; in terms of chemical composition, copper wire (including bare copper wire, palladium-plated copper wire, flash Gold-palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Another important development direction is to develop gold alloy wires to furth...

Claims

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Application Information

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IPC IPC(8): C22C5/02C22F1/14C22F1/02H01L23/49H01L21/60
CPCH01L24/45H01L24/85C22C5/02C22F1/02C22F1/14H01L2224/05139H01L2924/01004H01L2924/0102H01L2924/01058H01L2924/01046H01L2224/48463H01L2224/48511H01L2224/45144
Inventor 周振基周博轩彭政展
Owner NICHE TECH KAISER SHANTOU
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