Silver-gold alloy target material, manufacturing method and application thereof

A manufacturing method and alloy target technology, which is applied in metal material coating technology, ion implantation plating, coating, etc., can solve the problems of small grain size, expensive equipment, and reduced material purity, so as to achieve finer grain size and reduce The effect of manufacturing costs
CN101805835AInactive Publication Date: 2010-08-18SOLAR APPLIED MATERIALS TECHNOLOGY CORPORATION
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SOLAR APPLIED MATERIALS TECHNOLOGY CORPORATION
Publication Date
2010-08-18
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a silver-gold alloy target material, a manufacturing method and application thereof. The manufacturing method comprises the following steps: putting a target raw material into a melting furnace and heating to be melted; casting the melted melting soup; hot forging ingots formed after the casting; cold rolling blanks formed after the hot forging; and hot treating the blanks formed after the cold rolling to obtain the silver-gold alloy target material with small grains. Through the method provided by the invention, the target material has fine grains, and casting defects can be effectively removed, so that the target material can not produce the problems such as uneven dust particles and components in the sputtering process and the like.
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Description

technical field

[0001] The invention relates to a method for manufacturing a silver-gold alloy target, in particular to a method for manufacturing a target that can be operated in large quantities, effectively refines crystal grains, and has no shrinkage. Background technique

[0002] Generally speaking, silver or gold are widely used to form thin layers of electrodes or reflective layers due to their good electrical conductivity and light reflectivity, and are even often used in films for electromagnetic wave shielding; In electronic components, semiconductor integrated circuits, optoelectronic components, optical recording media or electromagnetic wave shielding, the thin films of electrodes, reflective layers and shielding layers are generally formed by sputtering; the targets used for sputtering must have the following characteristics:

[0003] 1. Uniform composition and structure;

[0004] 2. Small grain size;

[0005] 3. Few defects such as inclusions and voids; [...

Claims

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