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161results about How to "Low cost processing" patented technology

Reinforcing fiber base material for preforms, process for the production of laminates thereof, and so on

The invention provides (1) a reinforcing fiber base material having a weave constituted of both reinforcing fiber filaments arranged in one direction in parallel with each other and auxiliary yarns arranged in another direction, which satisfies the relationship: L=H / cos θ (wherein L is the length of auxiliary yarn covering one reinforcing fiber filament and H is the width of the filament as determined in such a state where the reinforcing fiber filaments are unified only with the auxiliary yarns; and 3°≦θ (in-plane shear strain)≦30°) and wherein 2 g / m2 to 40 g / m2 of an adhesive resin having a glass transition temperature between 0° C. and 95° C. is adhesed to at least one side thereof in spots, lines, or discontinuous lines; (2) a laminate obtained by laminating layers of the above reinforcing fiber base material, wherein the adhesive resin adhesed to each layer of base material partially bonds to a facing layer of base material over the whole surface thereof, with the maximum length of each bonding joint being not less than 1 mm and not more than the width H of a reinforcing fiber filament; and (3) a preform, obtained by shaping the laminate, having a reinforcing fiber volume fraction (Vpf) of 45% to 62%.
Owner:TORAY IND INC

Preparation method of SE-PERC solar cell with high conversion efficiency

The invention discloses a preparation method of an SE-PERC solar cell with high conversion efficiency, and relates to the technical field of solar cells. The method comprises preparation steps of 1) texturing; 2) phosphorus diffusion; 3) laser heavy doping; 4) oxidation; (5) PSG removal; 6) alkali etching and polishing, carrying out alkali etching and polishing on a back surface of a silicon wafer; 7) removing the phosphorosilicate glass on a front surface of the silicon wafer; 8) annealing; 9) plating a double-sided aluminum oxide passivation film on a surface of the silicon wafer; 10) depositing an antireflection film on the front surface; 11) depositing a passivation film on a back surface; 12) performing back laser grooving; 13) silk-screen printing; and 14) sintering. The method is advantaged in that the alkali etching technology is utilized, compared with acid etching, the use amount of etching acid can be reduced, acid wastewater cost treatment is reduced, environmental protection is facilitated, an oxidation procedure is added after laser heavy doping and before PSG removal, PN junctions can be prevented from being damaged, the good passivation effect can be achieved on thesilicon wafer, and conversion efficiency is obviously improved.
Owner:HENGDIAN GRP DMEGC MAGNETICS CO LTD
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