Electroplating solution and electroplating method for electroplating through holes and blind holes of circuit boards

Abstract

The invention discloses an electroplating solution for electroplating through holes and blind holes of circuit boards. The electroplating solution comprises the following components: 160-180g / L of copper sulfate pentahydrate, 20-50g / L of sulfuric acid, 0.05-0.07g / L of chloride ions, 0.5-1.5g / L of accelerant, 7-30g / L of inhibitor, 10-30g / L of leveling agent and the balance of water. The electroplating solution provided by the present invention is applicable to electroplate through holes and blinds holes of circuit boards, and in particular capable of realizing simultaneously hole-filling electroplating of a through hole and a blind hole in one groove of a circuit board; as a result, the electroplating steps are reduced and the production efficiency is improved.

Description

technical field

[0001] The invention relates to the technical field of circuit board electroplating, in particular to an electroplating solution and an electroplating method for electroplating through-hole blind holes of a circuit board. Background technique

[0002] Through-hole plating plays a very important role in interconnection in the high-density circuit board industry. The traditional hole filling technology of through-hole plating needs to realize the conduction of the upper and lower layers through conductive paste plug holes or resin plug holes, which is labor-intensive work. Mechanical grinding or resin curing after painting will lead to dimensional instability. In addition , The resin is a high molecular organic matter, and the coefficient of thermal expansion is different from that of pure copper, which will also affect the stability of the product. In order to solve the above problems and achieve good electrical interconnection, through-hole plating and filli...

Examples

Embodiment 1

[0028] An electroplating solution for electroplating circuit board through-hole blind holes, comprising the following components: copper sulfate pentahydrate 160g / L, sulfuric acid 20g / L, chloride ions 0.05g / L, accelerator 0.5g / L, inhibitor 7g / L , leveling agent 12g / L, the balance is water.

[0029] Wherein the accelerator is a mixture of sodium polydithiodipropanesulfonate, 1-2-ethylenethiourea and 2-mercaptobenzothiazole, and their mass percentage is 10:1:1.

[0030] Wherein the inhibitor is a mixture of polyethylene glycol and ethylenediamine polyoxyethylene polyoxypropylene ether with a relative molecular mass of 4000-6000, and their mass percentage is 8:1.

[0031] The leveling agent is a mixture of quaternary ammonium salt and polyethyleneimine alkyl compound copolymerized with alkyl dimethyl ammonium chloride and vinyl chloride ether, and their mass percentage is 10:1.

[0032] The preparation method of electroplating solution comprises the following steps:

[0033] (1...

Embodiment 2

[0041] An electroplating solution for electroplating circuit board through-hole blind holes, comprising the following components: copper sulfate pentahydrate 180g / L, sulfuric acid 50g / L, chloride ions 0.07g / L, accelerator 1.5g / L, inhibitor 30g / L , leveling agent 25g / L, the balance is water.

[0042] Wherein the accelerator is a mixture of sodium polydithiodipropanesulfonate and 1-2-ethylenethiourea, and their mass percentage is 8:1.

[0043] Wherein the inhibitor is a mixture of polyethylene glycol and ethylenediamine polyoxyethylene polyoxypropylene ether with a relative molecular mass of 4000-6000, and their mass percentage is 8:1.

[0044] The leveling agent is a quaternary ammonium salt copolymerized with alkyl dimethyl ammonium chloride and vinyl chloride ether.

[0045] The preparation method of this electroplating solution is identical with embodiment 1.

[0046] For through-hole blind holes in the same slot, the electroplating process is divided into two stages:

[...

Embodiment 3

[0051]An electroplating solution for electroplating circuit board through-hole blind holes, comprising the following components: copper sulfate pentahydrate 165g / L, sulfuric acid 22g / L, chloride ions 0.065g / L, accelerator 0.6g / L, inhibitor 10g / L , leveling agent 18g / L, the balance is water.

[0052] Wherein the accelerator is a mixture of sodium polydithiodipropanesulfonate, 2-thiazoline-based polydithiopropanesulfonate and 1-2-ethylenethiourea, and their mass percentage is 4:5:1.

[0053] Wherein the inhibitor is ethylenediamine polyoxyethylene polyoxypropylene ether.

[0054] The leveling agent is fatty amine ethoxy sulfonate, quaternary ammonium salt copolymerized with alkyl dimethyl ammonium chloride and vinyl chloride ether, and their mass percentage is 5:2.

[0055] The preparation method of this electroplating solution is identical with embodiment 1.

[0056] For through-hole blind holes in the same slot, the electroplating process is divided into two stages:

[0057...

technical field

[0001] The invention relates to the technical field of circuit board electroplating, in particular to an electroplating solution and an electroplating method for electroplating through-hole blind holes of a circuit board. Background technique

[0002] Through-hole plating plays a very important role in interconnection in the high-density circuit board industry. The traditional hole filling technology of through-hole plating needs to realize the conduction of the upper and lower layers through conductive paste plug holes or resin plug holes, which is labor-intensive work. Mechanical grinding or resin curing after painting will lead to dimensional instability. In addition , The resin is a high molecular organic matter, and the coefficient of thermal expansion is different from that of pure copper, which will also affect the stability of the product. In order to solve the above problems and achieve good electrical interconnection, through-hole plating and filli...

Examples

Embodiment 1

[0028] An electroplating solution for electroplating circuit board through-hole blind holes, comprising the following components: copper sulfate pentahydrate 160g / L, sulfuric acid 20g / L, chloride ions 0.05g / L, accelerator 0.5g / L, inhibitor 7g / L , leveling agent 12g / L, the balance is water.

[0029] Wherein the accelerator is a mixture of sodium polydithiodipropanesulfonate, 1-2-ethylenethiourea and 2-mercaptobenzothiazole, and their mass percentage is 10:1:1.

[0030] Wherein the inhibitor is a mixture of polyethylene glycol and ethylenediamine polyoxyethylene polyoxypropylene ether with a relative molecular mass of 4000-6000, and their mass percentage is 8:1.

[0031] The leveling agent is a mixture of quaternary ammonium salt and polyethyleneimine alkyl compound copolymerized with alkyl dimethyl ammonium chloride and vinyl chloride ether, and their mass percentage is 10:1.

[0032] The preparation method of electroplating solution comprises the following steps:

[0033] (1...

Embodiment 2

[0041] An electroplating solution for electroplating circuit board through-hole blind holes, comprising the following components: copper sulfate pentahydrate 180g / L, sulfuric acid 50g / L, chloride ions 0.07g / L, accelerator 1.5g / L, inhibitor 30g / L , leveling agent 25g / L, the balance is water.

[0042] Wherein the accelerator is a mixture of sodium polydithiodipropanesulfonate and 1-2-ethylenethiourea, and their mass percentage is 8:1.

[0043] Wherein the inhibitor is a mixture of polyethylene glycol and ethylenediamine polyoxyethylene polyoxypropylene ether with a relative molecular mass of 4000-6000, and their mass percentage is 8:1.

[0044] The leveling agent is a quaternary ammonium salt copolymerized with alkyl dimethyl ammonium chloride and vinyl chloride ether.

[0045] The preparation method of this electroplating solution is identical with embodiment 1.

[0046] For through-hole blind holes in the same slot, the electroplating process is divided into two stages:

[...

Embodiment 3

[0051]An electroplating solution for electroplating circuit board through-hole blind holes, comprising the following components: copper sulfate pentahydrate 165g / L, sulfuric acid 22g / L, chloride ions 0.065g / L, accelerator 0.6g / L, inhibitor 10g / L , leveling agent 18g / L, the balance is water.

[0052] Wherein the accelerator is a mixture of sodium polydithiodipropanesulfonate, 2-thiazoline-based polydithiopropanesulfonate and 1-2-ethylenethiourea, and their mass percentage is 4:5:1.

[0053] Wherein the inhibitor is ethylenediamine polyoxyethylene polyoxypropylene ether.

[0054] The leveling agent is fatty amine ethoxy sulfonate, quaternary ammonium salt copolymerized with alkyl dimethyl ammonium chloride and vinyl chloride ether, and their mass percentage is 5:2.

[0055] The preparation method of this electroplating solution is identical with embodiment 1.

[0056] For through-hole blind holes in the same slot, the electroplating process is divided into two stages:

[0057...