Electroplate liquid and electroplate method for cyanide-free gold plating of antimony-contained sulfite
A sulfite and cyanide-free gold plating technology, which is applied in the field of electroplating copper and tin, can solve the problems that restrict the promotion of cyanide-free electroplating, the quality of the coating is not high, the performance of the plating solution is not good, and the performance of the plating solution is excellent and the brightness is high. , the effect of good coating quality
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Embodiment 1
[0035] The formulation of the electroplating solution is as follows:
[0036]
[0037] Plating process conditions: the pulse width of single pulse square wave current is 0.5ms, the duty cycle is 30%, and the average current density is 0.5A / dm 2 ; The pH is 8, the temperature is 60°C, and the electroplating time is 40min.
Embodiment 2
[0039] The formulation of the electroplating solution is as follows:
[0040]
[0041] Plating process conditions: the pulse width of single pulse square wave current is 0.6ms, the duty cycle is 25%, and the average current density is 0.6A / dm 2 ; The pH is 8.5, the temperature is 60°C, and the electroplating time is 35min.
Embodiment 3
[0043] The formulation of the electroplating solution is as follows:
[0044]
[0045] Plating process conditions: the pulse width of single pulse square wave current is 0.8ms, the duty cycle is 20%, and the average current density is 1A / dm 2 ; The pH is 9, the temperature is 50° C., and the electroplating time is 20 minutes.
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