Platinum electroplating solution comprising dihydrogen dinitrosulfatoplatinate and electroplating method adopting platinum electroplating solution
A technology of dinitrosulfuric acid platinum dihydrogen and dodecylsulfuric acid, which is applied in the field of electroplating platinum, can solve the problems of poor performance of the plating solution, poor quality of the plating layer, and low current efficiency of the plating solution, and achieve high cathode current efficiency, The effect of good coating quality and excellent bath performance
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Embodiment 1
[0026] The formulation of the electroplating solution is as follows:
[0027]
[0028] Plating process conditions: the pulse width of single pulse square wave current is 0.5ms, the duty cycle is 30%, and the average current density is 2A / dm 2 ; The temperature is 80°C, and the electroplating time is 40min.
Embodiment 2
[0030] The formulation of the electroplating solution is as follows:
[0031]
[0032] Plating process conditions: the pulse width of single pulse square wave current is 0.6ms, the duty cycle is 25%, and the average current density is 2.5A / dm 2 ; The temperature is 80°C, and the electroplating time is 35min.
Embodiment 3
[0034] The formulation of the electroplating solution is as follows:
[0035]
[0036] Plating process conditions: the pulse width of single pulse square wave current is 0.8ms, the duty cycle is 20%, and the average current density is 3A / dm 2 ; The temperature is 80°C, and the electroplating time is 20min.
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