Hole metallization composition for vertical continuous pulse electroplating and electroplating method

A hole metallization and pulse electroplating technology, used in electrical components, printed circuits, printed circuit manufacturing, etc., can solve the problems of copper plating thickness on the board surface, hole copper fracture, etc., to increase production capacity, good thermal shock resistance, reduce The effect of material consumption

Active Publication Date: 2020-11-27
广东硕成科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous improvement of the integration of electronic products, the application of satellite navigation and 5G, the aspect ratio of printed circuit boards is also getting higher and higher, and the requirements for copper plating of via holes are naturally higher and higher. At present, the common copper plating process The following deficiencies exist: 1) It can only meet the needs of through-hole copper plating with low aspect ratio (plate thickness: aperture≦8:1); 2) for high aspect ratio (plate thickness: aperture: 12:1-25:1) ) Ap...

Method used

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  • Hole metallization composition for vertical continuous pulse electroplating and electroplating method
  • Hole metallization composition for vertical continuous pulse electroplating and electroplating method
  • Hole metallization composition for vertical continuous pulse electroplating and electroplating method

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Experimental program
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Effect test

Embodiment 1

[0058] Embodiment 1 provides a kind of hole metallization composition for vertical continuous pulse electroplating, composition sees the following table 1:

[0059] Table 1

[0060] components content Copper Sulfate Pentahydrate 75g / L sulfuric acid 220g / L hydrochloric acid 80ppm Ethylene oxide-propylene oxide block polymer 0.3g / L ferric chloride 40ppm Carboxypyridinium Ethyl / Ethylene Glycol Diglycidyl Ether Bromate 20ppm Sodium 3-(2-Benzenethiazolylthio)-1-propanesulfonate 2ppm Sodium N,N-Dimethyldithioformamide Propane Sulfonate 1ppm

[0061] Wherein, the ethylene oxide-propylene oxide copolymer is a product purchased from BASF; the carboxypyridinium ethyl / ethylene glycol diglycidyl ether hydrochloride can pass through 100mmol of ethylene glycol diglycidyl ether , 25 mmol of carboxypyridine (CAS: 59-67-6) was added into a round bottom reaction flask at room temperature. Next, 30 ml of DMF (N-N-dimethylfo...

Embodiment 2

[0075] The difference between embodiment 2 and embodiment 1 is that the parameters in the experimental conditions are different, specifically as shown in table 4 below:

[0076] Table 4

[0077]

[0078]

Embodiment 3

[0080] The difference between embodiment 3 and embodiment 1 is that the parameters in the experimental conditions are different, specifically as shown in table 5 below:

[0081] table 5

[0082]

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PUM

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Abstract

The invention belongs to the technical field of reverse pulse electroplating of hole metallization of a printed circuit board, and particularly relates to a hole metallization composition for verticalcontinuous pulse electroplating and an electroplating method. The hole metallization composition for vertical continuous pulse electroplating comprises water, one or more inorganic acids, one or moreheterocyclic compounds and one or more brighteners, and the one or more heterocyclic compounds are selected from one or more aromatic heterocyclic compounds, one or more epoxide-containing compoundsor one or more products obtained by any combination of the aromatic heterocyclic compounds and the epoxide-containing compounds; and wherein, the concentration of the one or more heterocyclic compounds in the hole metallization composition is 1 to 5000 ppm.

Description

technical field [0001] The invention belongs to the technical field of reverse pulse electroplating for hole metallization of printed circuit boards, and more specifically, the invention relates to a hole metallization composition and an electroplating method for vertical continuous pulse electroplating. Background technique [0002] With the continuous improvement of the integration of electronic products, the application of satellite navigation and 5G, the aspect ratio of printed circuit boards is also getting higher and higher, and the requirements for copper plating of via holes are naturally higher and higher. At present, the common copper plating process The following deficiencies exist: 1) It can only meet the needs of through-hole copper plating with low aspect ratio (plate thickness: aperture≦8:1); 2) for high aspect ratio (plate thickness: aperture: 12:1-25:1) ) Aperture copper plated through holes of printed circuit boards, even with low current density (0.5-0.8A / ...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/18H05K3/42
CPCC25D3/38C25D5/18H05K3/423H05K2203/0723
Inventor 孙宇曦曾庆明
Owner 广东硕成科技股份有限公司
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