Cyanide-free alkaline copper plating method for improving impermeable carbon copper film

A cyanide-free alkaline copper plating and carbon-copper film technology, applied in the field of technology, can solve the problems of impurity precipitation, hydrogen embrittlement, and the easy dissolution of single anode degreasing parts, so as to increase the bonding strength, improve the growth of mold, and reduce the The effect of temperature

Inactive Publication Date: 2014-04-16
哈尔滨云水工大环保科技股份有限公司
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

Solve the problems of hydrogen embrittlement, precipitated impurities and ...

Method used

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  • Cyanide-free alkaline copper plating method for improving impermeable carbon copper film
  • Cyanide-free alkaline copper plating method for improving impermeable carbon copper film
  • Cyanide-free alkaline copper plating method for improving impermeable carbon copper film

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specific Embodiment approach 1

[0022] Specific implementation mode one: a kind of preparation method of the cyanide-free alkaline copper plating of improving anti-carburization copper film of this embodiment comprises the following steps:

[0023] 1. Electrochemical method to remove oil and dirt on the surface of the workpiece: place the workpiece to be treated in an electrochemical degreasing solution with a temperature of 60 ° C to 75 ° C, and use a pulse power supply for electrolytic degreasing;

[0024] Among them, the electrolytic degreasing conditions are as follows: the cathode current density is 6-8A / dm 2 , the pulse period is 0.02s~0.002s, the anode current density is 6~8A / dm 2 , the pulse period is 0.02s ~ 0.002s, the number ratio of cathode and anode pulses (3 ~ 10): 1;

[0025] The proportion of the electrochemical degreasing solution is as follows: each 1L solution contains a sodium hydroxide solution with a concentration of 15-25g / L, a sodium carbonate solution with a concentration of 20-30g / ...

specific Embodiment approach 2

[0035] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the electrolytic degreasing conditions described in step one are as follows: the cathode current density is 7A / dm 2 , the pulse period is 0.02s~0.01s, the anode current density is 7A / dm 2 , the pulse period is 0.02s ~ 0.01s, the number ratio of cathode and anode pulses (5 ~ 7): 1. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0036] Specific embodiment 3: The difference between this embodiment and specific embodiment 1 or 2 is that the electrochemical degreasing solution described in step 1 is formulated as follows: every 1 L of solution contains sodium hydroxide with a concentration of 20-25 g / L Solution, sodium carbonate solution with a concentration of 25-30g / L and trisodium phosphate solution with a concentration of 15-20g / L. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a cyanide-free alkaline copper plating method for improving an impermeable carbon copper film, relates to a copper plating method for improving the performance of an impermeable carbon copper film, and aims at solving the problems that negative electrode deoiling alone causes hydrogen brittleness and impurity precipitation and positive electrode deoiling alone results in easy dissolution of parts. The method comprises steps of firstly, removing oil stain and dirt on the surface of a workpiece through an electrochemical method; secondly, activating the surface of the workpiece; thirdly, washing and drying; fourthly, carrying out pulse electroplating in a coating bath with an external overlaying magnetic field; fifthly, washing and passivating. Due to the introduction of the pulse electro-deposition and the overlaying magnetic field, the bonding strength of a plating layer and a substrate is improved, the temperature of plating solution is lowered, the heating cost for electroplating is saved, the problem that citrate is easy to mould because the traditional copper plating method by using citrate is carried out at high temperature is solved, and the method can substitutes for the technology of cyaniding copper plating in impermeable carbon copper plating. According to the method, the bonding strength of the plating layer and the substrate is improved, the temperature of the plating solution is lowered, and the heating cost for electroplating is saved.

Description

technical field [0001] The invention relates to a process method, in particular to a copper electroplating method designed to improve the performance of an anti-carburization copper plating film. Background technique [0002] Anti-carburizing copper plating on the partial surface of steel is a method widely used in gears and hydraulic parts such as aviation industry, automobile industry, and agricultural machinery. Anti-carburizing copper plating mainly plays the role of isolating the substrate surface from the heat seepage medium, so the copper plating layer must have good compactness, heat resistance, chemical stability and good bonding force on the basis of a certain thickness. Due to the uneven distribution of the workpiece shape and the current density during the electroplating process, the increase in the thickness of the copper layer will also lead to a decrease in the dimensional accuracy and geometric fine plating of the workpiece, which has become one of the proble...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/18C25D5/36
Inventor 袭建军赵君王志刚
Owner 哈尔滨云水工大环保科技股份有限公司
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