Nickel-tungsten graphene oxide (GO) composite plating solution, plated film and preparation method thereof

Abstract

The invention discloses a nickel-tungsten graphene oxide (GO) composite plating solution, a plated film and a preparation method thereof. According to the plating solution, GO which has good mechanical properties and can be effectively dispersed is introduced into the plating solution and is effectively deposited and dispersed in a Ni-W matrix during electroplating. A Ni-W-GO composite plated film is successfully prepared on a carbon steel base body by a pulse electroplating codeposition method. Graphene oxide is dispersed in the Ni-W matrix, so that the coefficient of friction is effectively lowered. The competitive relation between crystal nucleation and growth is effectively changed during codeposition, so that the structure of the plated film is improved, a deposited film layer can become more uniform and denser, intercrystalline corrosion is weakened, the diffusion path of a corrosive medium is prolonged, the self-corrosion potential is increased, local corrosion is effectively inhibited, the stability of a passivation film is improved, and thus, the corrosion resistance of the composite plated film is improved.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a nickel-tungsten graphene oxide composite plating solution, a coating film and a preparation method thereof. Background technique [0002] At present, the method for preparing Ni-W coating is mainly the traditional Ni-W coating electroplating process, and the main plating solution composition and process parameters are shown in Table 1: [0003] Table 1 [0004] [0005] The Ni-W coating preparation process is: sanding → ultrasonic cleaning → degreasing → ultrasonic cleaning → pickling activation → pulse plating → cleaning → post-processing → finished product. [0006] When the traditional electroplating process is used to prepare Ni-W coatings, the current efficiency is low, the deposition rate is slow, the hydrogen evolution is serious, and the electrochemical active sites are few, which leads to the residual internal stress of the coating formed during the depositi...

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Problems solved by technology

[0006] When the traditional electroplating process is used to prepare Ni-W coatings, the current efficiency is low, the deposition rate is slow, the hydrogen evolution is serious, and the electrochemical active sites are few, which leads to the residual internal stress of the coating formed during the deposition process, coarse crystal grains, and crystal grains. Defects such as obvious boundary, coating surface dew point and micro cracks

These defects will firstly induce severe localized corrosion in the practical application of Ni-W coating, which will affect the mechanical properties of the film, thereby reducing the service life of Ni-W coating.

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