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Through hole filling method by electroplating

A through-hole electroplating and blind hole technology, which is applied in the direction of electrical components, printed circuits, printed circuits, etc., can solve the problems of long hole filling process, holes in holes, and incomplete hole filling, so as to facilitate mass industrial production, The process is simple and the coating crystallization is refined

Inactive Publication Date: 2017-05-31
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] For this reason, the technical problem to be solved by the present invention is that the traditional hole filling method is not full, easy to generate air bubbles, resulting in holes in the hole, orifice depression, and the hole filling process is long and the production cost is high, so a plug hole is proposed Through-hole electroplating and filling method with good effect, high hole sag standard, simple process and low production cost

Method used

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  • Through hole filling method by electroplating
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  • Through hole filling method by electroplating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] This embodiment provides a method for through-hole electroplating and filling, and the method includes the following steps:

[0029] S1, the pre-process, the pre-process also includes the following steps:

[0030] S11. Cutting the material, cutting the inner core board and the outer copper foil material to the required size according to the design requirements. The inner core board is a copper clad laminate, which is formed by laminating copper foil and insulating The thickness can be divided into H / Hoz, 1 / 1oz, 2 / 2o and other types. After cutting, in order to prevent the expansion and contraction of the plate, it is necessary to bake the plate.

[0031] S12, making the inner layer circuit graphics, transfer the graphics on the negative film to the surface of the inner core board, first, pickle the copper surface, use 3% conventional acid solution to clean the board surface, remove the copper surface oxide layer and the original copper base A protective layer on the mat...

Embodiment 2

[0041] This embodiment provides a method for through-hole electroplating and filling, and the method includes the following steps:

[0042] S1, the pre-process, the pre-process also includes the following steps:

[0043] S11. Cutting the material, cutting the inner core board and the outer copper foil material to the required size according to the design requirements. The inner core board is a copper clad laminate, which is formed by laminating copper foil and insulating The thickness can be divided into H / Hoz, 1 / 1oz, 2 / 2o and other types. After cutting, in order to prevent the expansion and contraction of the plate, it is necessary to bake the plate.

[0044] S12, making the inner layer circuit graphics, transfer the graphics on the negative film to the surface of the inner core board, first, pickle the copper surface, use 4% conventional acid solution to clean the board surface, remove the copper surface oxide layer and the original copper base A protective layer on the mat...

Embodiment 3

[0054] This embodiment provides a method for through-hole electroplating and filling, and the method includes the following steps:

[0055] S1, the pre-process, the pre-process also includes the following steps:

[0056] S11. Cutting the material, cutting the inner core board and the outer copper foil material to the required size according to the design requirements. The inner core board is a copper clad laminate, which is formed by laminating copper foil and insulating The thickness can be divided into H / Hoz, 1 / 1oz, 2 / 2o and other types. After cutting, in order to prevent the expansion and contraction of the plate, it is necessary to bake the plate.

[0057] S12, making the inner layer circuit graphics, transfer the graphics on the negative film to the surface of the inner core board, first, pickle the copper surface, use 5% conventional acid solution to clean the board surface, remove the copper surface oxide layer and the original copper base A protective layer on the mat...

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Abstract

The invention provides a through hole filling method by electroplating. Pulse electroplating is carried out on a printed circuit board in which a through hole is formed regularly, a coating is fine in crystallization, high in a bonding force and voidless via the electroplating manner, the electroplated through hole is internally enclosed by electroplating copper, and is free of bubble or hole, the two ends of the electroplated through hole are molded into two blind holes whose thickness to radius ratio is lower than 1 respectively, and the blind holes are flattened in a routing electroplating hole filling method. The hole filling method can be used to solve the problem that the user requirement cannot be met due to the fact that cavities tend to form in the hole and an aperture recess is formed finally in a routine hole filling technology; and the hole filling method is simple in technical process, low in production cost and conducive to batch industrial production.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and relates to a through-hole filling method, in particular to a through-hole electroplating and filling method. Background technique [0002] The standard multi-layer printed circuit board structure usually contains inner-layer circuits and outer-layer circuits, and then uses the drilling process and the metallization process in the holes to realize the conduction and internal connection functions of each layer of circuits. Under the premise that electronic products are becoming more and more complex, the contact distance of integrated circuit components is reduced, and the speed of signal transmission is relatively increased, followed by the increase in the number of connections and the local shortening of the length of wiring between points. , these require the application of high-density circuit configuration and microvia technology to achieve the goal. Due to the in...

Claims

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Application Information

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IPC IPC(8): H05K3/42
CPCH05K3/423H05K2201/09563H05K2203/0723
Inventor 宋清张国城赵波
Owner SHENZHEN SUNTAK MULTILAYER PCB
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