LED lead frame and electroplating method and electroplating equipment thereof

A lead frame, selective electroplating technology, applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of affecting the quality of LED products, high production costs, low silver utilization, etc., to reduce the area of ​​electroplated silver layer and high production costs , The effect of reducing the cost of electroplating
CN101867009AInactive Publication Date: 2010-10-20XIAMEN YONGHONG TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
XIAMEN YONGHONG TECH
Publication Date
2010-10-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses an LED lead frame which is divided into three parts, i.e. a side frame, a functional area and a chip placing area; an anti-replacement protective film is formed on the whole lead frame; a primary silver plated layer is formed on the whole functional area by selecting electroplating silver, and a secondary silver plated layer is formed on the chip placing area by local silver electroplating, so that the silver plated layer of the chip placing area is thicker than the silver plated layer of the functional area around; and an anti-copper oxidation organic protective film is formed on the side frame. The electroplating method comprises the following steps: chemical deoiling->electrolytic deoiling->water washing->acid washing->water washing->copper plating->water washing->anti-replacement treatment->water washing->electroplating silver selection for functional areas on the back side and on the front side->local silver electroplating of chip placing area->silver recovery->water washing->deplating->water washing->neutralization->water washing->anti-copper oxidization treatment->water washing->hot water washing->drying. The invention also discloses electroplating equipment. The invention can effectively use metal silver, reduces the cost, improves the bonding force between plastics and the lead frame, and achieves the purpose of anti-layering.
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Description

technical field

[0001] The invention relates to an LED lead frame, and relates to an electroplating method and equipment for the LED lead frame. Background technique

[0002] In the prior art, the structure of the LED lead frame is as follows figure 1 , figure 2 with image 3 As shown, the entire lead frame 100 is entirely silver-plated 200 .

[0003] Cooperate Figure 4 As shown, the electroplating process is as follows: chemical degreasing → electrolytic degreasing → water washing → pickling → water washing → copper plating → water washing → all electroplating silver (or all electroplating silver → partial electroplating silver in functional areas) → silver recovery → water washing →Deplating→Water washing→Neutralization→Water washing→Hot water washing→Drying, all of which are silver-plated for the entire lead frame.

[0004] The role of each step in the process flow is as follows:

[0005] Both chemical degreasing and electrolytic degreasing are used to remove grea...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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