Method for improving nickel electroplating quality of aluminum-silicon alloy

A technology of silicon-aluminum alloy and electroplating nickel, which is applied in the direction of electrolytic coating, surface reaction electrolytic coating, anodic oxidation, etc., can solve problems such as delamination, rough coating, and blistering, and achieve manufacturing cost reduction, electroplating cost reduction, and product quality. The effect of high pass rate

A technology of silicon-aluminum alloy and electroplating nickel, which is applied in the direction of electrolytic coating, surface reaction electrolytic coating, anodic oxidation, etc., can solve problems such as delamination, rough coating, and blistering, and achieve manufacturing cost reduction, electroplating cost reduction, and product quality. The effect of high pass rate

CN110670098AActive Publication Date: 2020-01-10GUIZHOU ZHENHUA HUALIAN ELECTRONICS
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  • Method for improving nickel electroplating quality of aluminum-silicon alloy
  • Method for improving nickel electroplating quality of aluminum-silicon alloy
  • Method for improving nickel electroplating quality of aluminum-silicon alloy

Examples

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Effect test

Embodiment 1

[0044] A method for improving the quality of electroplating nickel on silicon-aluminum alloys, comprising:

[0045] (1) Organic degreasing: soak the silicon-aluminum alloy in an organic solvent, wash at 50°C for 15 minutes, and dry the silicon-aluminum alloy for later use; the organic solvent is composed of turpentine and gasoline with a mass ratio of 3:1;

[0046] (2) Cleaning: Rinse the silicon-aluminum alloy in clean water at room temperature for 1-15 minutes;

[0047] (3) Electrolytic degreasing: use tungsten carbide-based hard alloy as the cathode, and silicon-aluminum alloy as the anode, and put it into the electrolyte solution for electrolytic degreasing for 5 minutes. The formula of the electrolyte is tripotassium phosphate 80g / L, acetic acid 20g / L, potassium hydroxide 5g / L, sodium sulfate 10g / L, and the balance is water; the electrolysis conditions are: temperature 55°C, current density 8A / dm 2 ;

[0048] (4) Drying: bake the silicon-aluminum alloy at 60°C and 0.1 s...

Embodiment 2

[0072] A method for improving the quality of electroplating nickel on silicon-aluminum alloys, comprising:

[0073] (1) Organic degreasing: soak the silicon-aluminum alloy in an organic solvent, wash at 55° C. for 15 minutes, and dry the silicon-aluminum alloy for later use; the organic solvent is composed of turpentine and gasoline with a mass ratio of 3:1;

[0074] (2) Cleaning: Rinse the silicon-aluminum alloy in clean water at room temperature for 1 min;

[0075] (3) Electrolytic degreasing: use tungsten carbide-based hard alloy as the cathode, and silicon-aluminum alloy as the anode, and put it into the electrolyte solution for electrolytic degreasing for 8 minutes. The formula of the electrolyte is tripotassium phosphate 80g / L, acetic acid 20g / L, potassium hydroxide 5g / L, sodium sulfate 10g / L, and the balance is water; the electrolysis conditions are: temperature 55°C, current density 8A / dm 2 ;

[0076] (4) Drying: bake the silicon-aluminum alloy at 65°C and 0.2 standa...

Embodiment 3

[0100] Implement according to the steps of Example 2, but the step (21) pre-nickeling is changed to: put the silicon-aluminum alloy into the alkaline pre-nickeling solution for pre-nickeling, at a temperature of 26° C., pre-plating for 5 minutes; the pre-nickeling The solution formula is: nickel chloride 19g / L, sodium hypophosphite 20g / L, sodium pyrophosphate 30g / L, sodium citrate 3g / L, potassium hydroxide 6g / L; other operating measures are the same.

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Abstract

The invention relates to the field of aluminum-silicon alloy electroplating, in particular to a method for improving the nickel electroplating quality of aluminum-silicon alloy. The method comprises the steps of organic oil removal, cleaning, electrolytic degreasing, drying, sand blasting, cleaning, oil removal, cleaning, descaling, cleaning, racking, cleaning, activation, cleaning, hard sulfuricacid anodizing, cleaning, copper pre-plating, cleaning, activation, cleaning, nickel pre-plating, nickel plating, cleaning, cleaning with hot water, cleaning and drying. According to the method, through adding of the steps of activation and hard sulfuric acid anodizing, the bonding between a substratum and copper plating is promoted, and generation of watermarks after plating is avoided; the qualified rate reaches 97%, and rework is reduced after the plating quality is qualified; the plating cost is reduced, so that the overall manufacturing cost is further reduced; meanwhile, the delivery cycle is shortened; and the method is high in adaptation to operators, and benefits scale promotion.

Description

technical field [0001] The invention relates to the field of silicon aluminum alloy electroplating, in particular to a method for improving the quality of silicon aluminum alloy electroplating nickel. Background technique [0002] The current silicon-aluminum alloy electroplating nickel, the plating quality is not good, and the electroplating process is cumbersome: silicon-aluminum alloy → degreasing → cleaning → drying → sandblasting → cleaning → pickling → cleaning → hanging → cleaning → zinc dipping → once Cleaning → dezincification → cleaning → secondary galvanizing → cleaning → pre-plating copper → cleaning → activation → cleaning → pre-nickel plating → nickel plating → recycling → cleaning → drying → inspection → storage, plus hanging to pre-plating Copper: There are 7 processes in the galvanizing process and 8 processes in pre-copper plating, and there are two galvanizing and one dezincifying processes. It is difficult to control the operation, the product qualificati...

Claims

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Application Information

Patent Timeline
10 Jan 2020
Publication
CN110670098A
IPC
C25D5/14; C25D11/10; C25D11/08; C25D11/16; C25D5/44; C25D3/12; C25D3/38
CPC
C25D3/12; C25D3/38; C25D5/14; C25D5/44; C25D11/08; C25D11/10; C25D11/16
Inventors
潘彦霖; 黎学良