Circuit board manufacturing method without tin plating, tin retreating and capable of saving copper and nickle
A circuit board and tin stripping technology, applied in the direction of removing conductive materials by chemical/electrolytic methods, can solve problems such as increased production costs, environmental pollution, waste of precious metal chemical materials, etc., to reduce pollution, avoid serious pollution, and achieve cleanliness production effect
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[0016] The following examples are further explanations and illustrations of the present invention, and do not constitute any limitation to the present invention.
[0017] The manufacturing method of the circuit board (taking the double-sided panel as an example) free of tin plating and stripping of the present invention and can save copper and nickel consumption, the steps are as follows:
[0018] First, drill holes on the cut and baked copper clad board according to the program compiled by the user, and then carry out thick copper treatment on the drilled holes to make the circuits on both sides of the copper clad board conduct. This step is similar to the conventional method.
[0019] The gist of the present invention is to remove the electroplating tin and tin stripping process in the traditional circuit board manufacturing process, and selectively electroplate copper and nickel to the circuit pattern. The specific steps are:
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