Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board manufacturing method without tin plating, tin retreating and capable of saving copper and nickle

A circuit board and tin stripping technology, applied in the direction of removing conductive materials by chemical/electrolytic methods, can solve problems such as increased production costs, environmental pollution, waste of precious metal chemical materials, etc., to reduce pollution, avoid serious pollution, and achieve cleanliness production effect

Inactive Publication Date: 2009-07-22
陈国富
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the traditional process not only causes serious environmental pollution, but also causes a lot of waste of precious metals, water, electricity, and chemical materials, which greatly increases the production cost of enterprises.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board manufacturing method without tin plating, tin retreating and capable of saving copper and nickle
  • Circuit board manufacturing method without tin plating, tin retreating and capable of saving copper and nickle
  • Circuit board manufacturing method without tin plating, tin retreating and capable of saving copper and nickle

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The following examples are further explanations and illustrations of the present invention, and do not constitute any limitation to the present invention.

[0017] The manufacturing method of the circuit board (taking the double-sided panel as an example) free of tin plating and stripping of the present invention and can save copper and nickel consumption, the steps are as follows:

[0018] First, drill holes on the cut and baked copper clad board according to the program compiled by the user, and then carry out thick copper treatment on the drilled holes to make the circuits on both sides of the copper clad board conduct. This step is similar to the conventional method.

[0019] The gist of the present invention is to remove the electroplating tin and tin stripping process in the traditional circuit board manufacturing process, and selectively electroplate copper and nickel to the circuit pattern. The specific steps are:

[0020] 1. Coating a layer of anti-plating cove...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for manufacturing circuit board which is free of tin plating and tin removing and can save the using amounts of copper and nickel comprises the following steps: a. coating plating-resistant covering film on the circuit board after copper deposition or the first time of copper plating, then adhibiting the positive film of all metal holes and hole rings in the circuit pattern on the covering film for forming a primary circuit after exposing and developing; b. electroplating copper and nickel on the hole wall and hole ring of all metal holes, then removing the covering film; c. coating etching-resistant covering film on the circuit board after film removing, adhibiting the negative film of circuit pattern on the etching-resistant covering film, and forming the secondary circuit after exposing and developing; d. etching the circuit pattern, then removing film and checking erosion; and e. forming the finished product of circuit board through executing the steps of resistance welding, exposing, developing, printing component symbol or tin spraying or executing oxidation prevention procession. The method of the invention can reduce environment pollution and realize clean production through eliminating electrotinning and tin removing technique, effectively saves metal, water, electricity and chemical material and reduces production cost of enterprise through selectively electroplating copper and nickel.

Description

【Technical field】 [0001] The present invention relates to a printed circuit board (PCB), in particular to a process that eliminates tin plating and stripping tin, and greatly reduces the area of ​​copper and nickel to be plated by about 90%, thus effectively saving tin, nickel, copper and other precious metals The amount of circuit board production method. 【Background technique】 [0002] As we all know, printed circuit boards (PCBs) are widely used as the basic material of the electronics industry. As small as electronic watches, calculators, personal computers, as large as computers, communication equipment, medical equipment, and aerospace or military equipment, as long as there are electronic components such as integrated circuits, PCBs are used for electrical interconnection between them. Printed circuit boards are formed by setting conductive patterns for electrical connections between electronic components on an insulating substrate, and its manufacturing process is r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
Inventor 陈国富
Owner 陈国富
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products