A method for manufacturing circuit board which is free of
tin plating and
tin removing and can save the using amounts of
copper and
nickel comprises the following steps: a.
coating plating-resistant covering film on the circuit board after
copper deposition or the first time of
copper plating, then adhibiting the positive film of all
metal holes and hole rings in the circuit pattern on the covering film for forming a primary circuit after exposing and developing; b.
electroplating copper and
nickel on the hole wall and hole ring of all
metal holes, then removing the covering film; c.
coating etching-resistant covering film on the circuit board after film removing, adhibiting the negative film of circuit pattern on the
etching-resistant covering film, and forming the
secondary circuit after exposing and developing; d.
etching the circuit pattern, then removing film and checking
erosion; and e. forming the finished product of circuit board through executing the steps of resistance
welding, exposing, developing, printing component symbol or
tin spraying or executing oxidation prevention procession. The method of the invention can reduce environment
pollution and realize clean production through eliminating electrotinning and tin removing technique, effectively saves
metal, water,
electricity and chemical material and reduces production cost of enterprise through selectively
electroplating copper and
nickel.