A method for manufacturing circuit board which is free of 
tin plating and 
tin removing and can save the using amounts of 
copper and 
nickel comprises the following steps: a. 
coating plating-resistant covering film on the circuit board after 
copper deposition or the first time of 
copper plating, then adhibiting the positive film of all 
metal holes and hole rings in the circuit pattern on the covering film for forming a primary circuit after exposing and developing; b. 
electroplating copper and 
nickel on the hole wall and hole ring of all 
metal holes, then removing the covering film; c. 
coating etching-resistant covering film on the circuit board after film removing, adhibiting the negative film of circuit pattern on the 
etching-resistant covering film, and forming the 
secondary circuit after exposing and developing; d. 
etching the circuit pattern, then removing film and checking 
erosion; and e. forming the finished product of circuit board through executing the steps of resistance 
welding, exposing, developing, printing component symbol or 
tin spraying or executing oxidation prevention procession. The method of the invention can reduce environment 
pollution and realize clean production through eliminating electrotinning and tin removing technique, effectively saves 
metal, water, 
electricity and chemical material and reduces production cost of enterprise through selectively 
electroplating copper and 
nickel.