Magnesium alloy non cyanogen plating copper chemical plating nickle and its plating process

A technology of electroless nickel plating and cyanide-free pre-plating of copper, which is applied in the coating process of metal materials, plating of superimposed layers, and coatings, etc. question

Inactive Publication Date: 2005-03-23
GCI SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this process, the plating solution during cyanide copper plating contains a large amount of cyanides such as CuCN, KCN, NaCN, etc., which is highly toxic, seriously pollutes the environment, and post-processing is troublesome; and it is not suitable for alloys with high Al content
The method of direct electroless Ni-P plating has a simple process and does not contain cyanide in the plating solution, which has gradually attracted attention, but the bonding force between the coating and the substrate is not as high as that of the cyanide copper-plating base plate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] The material is AZ91D magnesium alloy, the specific operation steps are as follows:

[0056] (1) Pre-plating treatment

[0057] 1) Mechanical polishing The sample is removed with a grinder to remove burrs, scale, adhered release agent, various oil stains, reduce surface roughness, and wash to remove slag;

[0058] 2) Ultrasonic degreasing: Ultrasonic degreasing with acetone or trichlorethylene organic solvent, temperature: room temperature, time: 10min;

[0059] 3) Alkaline washing

[0060] Solution preparation and operating conditions are as follows: NaOH 50g dm -3 , Na 3 PO 4 12H 2 O 10g·dm -3 ;Temperature 60±5℃; Time 8-10min;

[0061] 4) pickling

[0062] Solution preparation and operating conditions are as follows: CrO 3 125g·dm -3 , HNO 3 (68%)110cm 3 · dm -3 ;Temperature 20℃; Time 1min;

[0063] 5) Activation:

[0064] Solution preparation and operating conditions are as follows: HF (40%) 385cm 3 · dm -3 ;Temperature 20℃; Time 15min;

[0065] 6) O...

Embodiment 2

[0078] The material is AZ91D magnesium alloy, which differs from Example 1 in that:

[0079] Pre-plated copper:

[0080] The formula of the plating solution for cyanide-free copper plating is: copper pyrophosphate 30g dm -3 ;Sodium pyrophosphate 100g·dm -3 , HEDP 60g·dm -3 ; Ammonium bifluoride 10g·dm -3 , NaF 5g·dm -3 ; Adjust the pH value to 11.0 with ammonia water; Cathode current density: initial current density 4A·dm -2 , time 3min; working current density 1A·dm -3 , time 20min;

[0081] (3) Acidic copper plating - three-layer nickel plating - chrome plating

[0082] 1) Acid copper plating

[0083] Solution preparation and operating conditions are as follows: copper sulfate (CuSO 4 .5H 2 O) 220g·dm -3 , sulfuric acid (H 2 SO 4 )(ρ=1.84g / l)36cm 3 · dm -3 , chloride ion (Cl - )90mg·dm -3 , cylinder opener 10cm 3 · dm -3 , leveling agent 0.5cm 3 · dm -3 , Brightener 0.5cm 3 · dm -3 Temperature 26°C; Cathode current density 5A·dm -2 , anode current den...

Embodiment 3

[0097] The material is AZ31B magnesium alloy, which differs from Example 1 in that:

[0098] pickling

[0099] CrO3 180g·dm -3 , Fe(NO 3 ) 3 9H 2 O 400g·dm -3 , NaF 3.5g·dm -3 ;Temperature 20℃; Time 10min;

[0100] activation

[0101] h 3 PO 4 (85%) 150-200g·dm -3 , NH 4 HF 2 80-100g·dm -3 ;Temperature 20℃;Time 2min

[0102] pre-plated copper

[0103] The plating solution formula for cyanide-free copper plating is: copper pyrophosphate 40g dm -3 , sodium pyrophosphate 60g·dm -3 , Trisodium citrate 60g·dm -3 , Sodium Potassium Tartrate 10g·dm -3 , ammonium bifluoride 10g·dm -3 , Sodium Fluoride 10g·dm -3 ; pH 9.0.

[0104] Cathode current density: initial current density 3A·dm -2 , time 5min; working current density 2A·dm -3 , time 30min.

[0105] Electroless Nickel

[0106] The formula of the plating solution is: 1) main salt nickel acetate 15g dm -3 ; 2) reducing agent sodium hypophosphite 30g dm -3 ; 3) Complexing agent trisodium citrate 2.5g dm ...

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PUM

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Abstract

The invention discloses a method of plating Nickel with magnalium alloy without cyanogen and the plating technique. The direction for the plating solution is: 20 to 80g.dm-3 of copper charred phosphate; one or several of the 60 to 320g.dm-3 of sodium charred phosphate or Potassium charred phosphate or 60 to 250g.dm-3 of sodium citric acid, 5 to 20g.dm-3 of Potassium sodium tartaric acid, 60 to 250g.dm-3 of HEDP and 60 to 250g.dm-3 of amine ethylene; one or several of the 5 to 20g.dm-3 of hydrogen amine di-fluorin or 5 to20 g.dm-3 sodium fluoride or 5 to 20g.dm-3 of Potassium fluoride or 5 to 20g.dm-3 of lithium fluoride. The plating solution chooses the nickel sulfate or alkali type nickel carbonate or nickel acetic acid as the main salt and adds the reducing agent, combination agent and stabilization agent. The plating technique adopts the acid plating copper-plating three nickel-plating chromium. The invention has little pollution to the environment, high binding power and erosion-proof property.

Description

technical field [0001] The invention relates to a cyanide-free copper pre-plating electroless nickel plating and electroplating process, in particular to an electroless nickel plating and electroplating process for a magnesium alloy cyanide-free pre-plating copper base. Background technique [0002] Magnesium alloy has the advantages of light weight, high specific strength and specific stiffness, excellent thin-wall formability and renewable performance, thermal conductivity, good electromagnetic shielding effect, and high anti-electromagnetic interference (EMI) performance. It is widely used in national defense industry, transportation, optical instruments, electronic device casings and other fields. The biggest use of magnesium alloys is as die-casting parts for automobiles, notebook computers and other micro electrical appliances. The shock absorption and light weight and energy saving of the automobile industry have prompted the increasing pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/02
Inventor 余刚肖耀坤刘振华张峰刘云娥陈珏玲惠华英
Owner GCI SCI & TECH
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