Manufacturing method of circuit board without tin plating and tin removing
A circuit board and tin stripping technology, which is applied to the removal of conductive materials by chemical/electrolytic methods, can solve problems such as increased production costs, waste of precious metal chemical materials, environmental pollution, etc., to reduce pollution, achieve clean production, and avoid serious problems. The effect of pollution
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[0016] The following examples are further explanations and illustrations of the present invention, and do not constitute any limitation to the present invention.
[0017] The manufacturing method of the circuit board exempt from tin plating and stripping of the present invention (taking double-sided panels as an example), the steps are as follows:
[0018] First, drill holes on the cut and baked copper clad board according to the program compiled by the user, and then carry out thick copper treatment on the drilled holes to make the circuits on both sides of the copper clad board conduct. This step is similar to the conventional method.
[0019] The gist of the present invention is to remove the electroplating tin and tin stripping process in the traditional circuit board manufacturing process, and selectively electroplate copper and nickel to the circuit pattern. The specific steps are:
[0020] 1. Coating a layer of anti-plating covering film on the circuit board that has be...
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