Method for chemical plating of metal on particle surface

A particle surface, chemical plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of uneven surface plating, too fast plating speed, unstable plating solution, etc. Avoid the effects of unstable plating solution, easy operation and uniform particle dispersion

Inactive Publication Date: 2010-06-30
WENZHOU HONGFENG ELECTRICAL ALLOY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention aims at the deficiencies and defects of the above-mentioned prior art, and provides a method for chemically plating metal on the surface of particles, which effectively solves the problems of agglomeration, uneven surface plating, and excessive plating speed in the chemical plating of powder particles. unstable problem

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  • Method for chemical plating of metal on particle surface
  • Method for chemical plating of metal on particle surface

Examples

Experimental program
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Effect test

Embodiment 1

[0026] Take Ag metal on the surface of WC powder particles with an average particle size of 0.01μm as an example

[0027] First, 5g WC powder particles (with a particle size of 0.01 μm) are placed in a 5% nitric acid solution, stirred and cleaned for 10 minutes, and then cleaned with deionized water for three times and then filtered by suction.

[0028] Pour the powder particles after suction filtration into 500ml of hydrazine hydrate solution, the concentration of which is 3ml / L, adjust the PH value to 8 with ammonia water, the stirring speed is 500 rpm, the ultrasonic vibration frequency is 100KHz, and the stirring ultrasonic vibration is 15 minutes .

[0029] Then 500ml of silver nitrate solution with a concentration of 10g / L was added in the form of spray, and the silver nitrate solution was added at a speed of 5ml / min. After the electroless plating was completed, the coated WC powder particles were obtained by suction filtration and rinsed with deionized water all over.

[0030]...

Embodiment 2

[0032] Take Ag metal coated on the surface of WC powder particles with an average particle size of 1μm as an example

[0033] Firstly, 15 g of WC powder particles (with a particle size of 1 μm) were placed in a 5% nitric acid solution, stirred and washed for 5 minutes, and then washed with deionized water for three times and then filtered with suction.

[0034] Pour the powder particles after suction filtration into 500ml hydrazine hydrate solution, the concentration of which is 6ml / L, adjust the PH value to 10 with ammonia water, stir and ultrasonically shake, and then add 500ml silver nitrate solution with a concentration of 30g / L in the form of spray , The silver nitrate addition speed is 30ml / L, the stirring speed is 200 revolutions / min, and the ultrasonic vibration frequency is 15KHz.

[0035] After the electroless plating is completed, the coated WC powder particles are obtained by suction filtration, and rinsed with deionized water three times.

[0036] After that, the coated W...

Embodiment 3

[0038] Take Ag metal coated on the surface of SiC powder particles with an average particle size of 2μm as an example

[0039] First, 8 g of SiC powder particles (with a particle size of 2 μm) were placed in a 10% nitric acid solution, stirred and cleaned for 10 minutes, and then cleaned with deionized water for three times and then filtered by suction. The powder particles after suction filtration are sensitized and activated, using 15% SnCl 2 Solution sensitization and 20% PdCl solution activation treatment, followed by washing with deionized water three times.

[0040] Then, the above-mentioned processed powder particles are poured into 500 ml of hydrazine hydrate solution, the concentration of which is 4.5 ml / L, the pH value is adjusted to 9 with ammonia water, and the mixture is stirred and ultrasonically shaken. Then 500ml of silver nitrate solution with a concentration of 15g / L was added in the form of spray, the silver nitrate addition speed was 45ml / min, the stirring speed...

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Abstract

The invention discloses a method for chemical plating of metal on the particle surface. An ultrasonic oscillation generator is put into a mechanical stirring paddle, a mechanical agitator is combined with a built-in ultrasonator, then the powder particles are fully dispersed by adding the reaction components by a liquid-phase spraying method, and the reaction in the plated area is uniform and stable, therefore, the purpose of uniformly-distributed coating powder particles is achieved. The method of combining the mechanical agitator and the built-in ultrasonator is adopted, thereby effectively improving the dispersion efficiency and solving the problem of powder particle agglomeration; and the method of adding the reaction components by liquid-phase spraying is adopted, therefore, the reaction in the chemical plating solution is uniform, and the defects of the unstable plating solution and the uneven surface plating of the powder particles can be avoided. The method has the advantages of simple and convenient operation, uniform dispersion of the powder particles, complete coating and the like, and effectively solves the problems of agglomeration, uneven surface coating and instability of the plating solution due to the excessively high plating speed during the chemical plating of the powder particles.

Description

technical field [0001] The invention relates to a method in the technical field of material surface modification, in particular to a method for chemically plating metal on the surface of particles. Background technique [0002] Particle electroless metal plating is an effective means of surface modification. Electroless metal plating on the surface of ceramic or metal particles can often improve the surface properties of materials while maintaining the original material properties. For example, plating metals such as copper or silver on the surface of ceramic particles will change the surface properties of ceramic particles while maintaining the high hardness and high strength of the ceramic itself, making the surface of ceramic particles conductive and easy to combine with metal. Plating silver metal on the surface of copper particles will greatly increase the surface conductivity of copper particles and enhance the oxidation resistance of the particles. Therefore, electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02C23C18/31
Inventor 甘可可陈乐生祁更新陈晓
Owner WENZHOU HONGFENG ELECTRICAL ALLOY
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