Electroplating device for printed breadboard

Abstract

The invention discloses an electroplating device for a printed circuit board, wherein, two opposite anodes are arranged inside an electroplating bath and electrically connected with a positive electrode; a floating trough is arranged between the two anodes in the electroplating bath; the printed circuit board which is connected with a negative electrode is arranged on the floating trough; the floating trough comprises two side plates; the circuit board is positioned between the side plates; and side plate holes are uniformly arranged on the two side plates. The electroplating device for the printed circuit board readjusts a power line in the electroplating bath, thereby electroplating of the circuit board is more uniform and the electroplating effect is good.

Description

technical field [0001] The invention relates to an electroplating device for a printed circuit board. Background technique [0002] Today's electronic products have gradually developed in the direction of light, thin, and small, which makes the integration of electronic products continue to increase. As printed circuit boards for connecting components in electronic products, their conductive patterns and via holes are becoming more and more dense. The conductor density, spacing and via hole diameter are getting smaller and smaller, which brings severe challenges to the production of printed circuit boards. In the electroplating process of printed circuit boards, the surface conductor copper has certain standard requirements, and because the distribution of power lines in the electroplating tank is uneven, especially the distribution of power lines around the entire electroplating window is relatively dense, so copper plating around the circuit board Thicker than the center ...

AI Technical Summary

Problems solved by technology

In the electroplating process of printed circuit boards, the surface conductor copper has certain standard requirements, and because the distribution of power lines in the electroplating tank is uneven, especially the distribution of power lines around the entire electroplating window is relatively dense, so copper plating around the circuit board Thicker than the center of the circuit board, this phenomenon is more prominent in high-density printed circuit boards, and the uneven thickness of copper plating affects the processing quality of the product. For example, in the subsequent etching process, the line width tolerance cannot be accurately controlled

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