Wafer surface treatment device

Abstract

The invention discloses a wafer surface treatment device which is characterized by comprising a wafer clamping rotating device and a groove body. The groove body is provided with a groove cavity. The wafer clamping rotating device is hinged at the upper end of the groove body and arranged in a turning mode. The wafer clamping rotating device is composed of a lower base plate and a clamping clip, and the lower base plate is used for fixing a wafer and arranged in a rotating mode. The clamping clip consists of a hook body which extends toward the center of the base plate. The hook body is arranged below the lower base plate. The hook body which is driven to conduct motion toward the lower base plate and conduct reciprocating motion away from the lower base plate is arranged. The wafer surface treatment device not only fixes the wafer, but also drives the wafer to rotate. Even treatment on the surface of the wafer can be ensured after cleaning, galvanizing or etching. When cleaning is conducted, cleanout liquid does not need spraying the wafer, and risk of damage of the wafer can be reduced. When galvanizing or the etching is conducted, not only can each part of a galvanized or etched wafer be ensured, but also the galvanizing or the etching can be ensured. Meanwhile, the wafer surface treatment device is convenient to use.

Description

technical field [0001] The invention relates to a wafer surface treatment device. Background technique [0002] During the wafer production process, its surface needs to be treated, such as cleaning, plating or etching. A commonly used surface cleaning method is to fix the wafer in a cleaning tank, and spray the cleaning solution to the wafer. The spraying device of the cleaning fluid is in constant motion to thoroughly clean the wafer. Electroplating or etching is the same method. Although this device can process the surface of the wafer to a certain extent, the wafer cannot be rotated and cannot ensure uniform surface treatment. This surface device is difficult to achieve horizontal cleaning, electroplating or etching, that is, the wafer is placed horizontally above the cleaning solution, plating solution or etching solution, and the cleaning solution, plating solution or etching solution flows from bottom to top until it contacts the wafer. Clean the wafer surface. A...

AI Technical Summary

Problems solved by technology

Although this device can process the surface of the wafer to a certain extent, the wafer cannot be rotated and cannot guarantee uniform surface treatment.

This surface device is difficult to achieve horizontal cleaning, electroplating or etching, that is, the wafer is placed horizontally above the cleaning solution, plating solution or etching solution, and the cleaning solution, plating solution or etching solution flows from bottom to top until it contacts the wafer. Clean the wafer surface

Another disadvantage of cleaning is that the spray water is directly sprayed on the wafer, and the wafer is easily damaged if the water pressure is too high.

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