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Apparatus and method for processing substrate

A processing device and processing method technology, applied in chemical instruments and methods, cleaning methods using liquids, spraying devices, etc., can solve the problems of poor reactivity, inability to uniformly process substrates, different problems, etc.

Active Publication Date: 2005-02-09
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in supplying the processing liquid only to the plate surface of the substrate using a plurality of nozzles, the processing liquid supplied to the upper portion of the substrate processes the upper portion of the substrate and then mixes with the processing liquid supplied to the lower portion of the substrate to deteriorate the reactivity. The lower part of the substrate is handled worse than the upper part
Moreover, the speed of the processing liquid flowing through the upper and lower parts of the substrate is different due to the difference in height, so there is a problem that the upper and lower parts of the substrate cannot be uniformly processed due to the speed difference.

Method used

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  • Apparatus and method for processing substrate
  • Apparatus and method for processing substrate
  • Apparatus and method for processing substrate

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Embodiment Construction

[0052] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

[0053] Figure 1 to Figure 8 The first embodiment of the present invention is shown. The treatment device shown in FIG. 1 has a base station 1 . At one longitudinal end of the upper surface of the base 1, a loading section 2 and an unloading section 3 are arranged laterally apart. The loading part 2 and the unloading part 3 have a rectangular plate-shaped supporting member 4, which can be driven to swing along the lateral direction of the base 1 indicated by the arrow, using the lower end as a fulcrum.

[0054]At the lower end of one side of the loading part 2 and the unloading part 3 (only the loading part 2 is shown in the figure), a plurality of lower supporting rollers 5 are arranged at regular intervals, and a plurality of upper supporting rollers are arranged at prescribed intervals at the upper end. 6. The lower backup roller 5 is rotationally driven by a ...

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Abstract

Provided is a treatment apparatus with which a substrate to be conveyed in an erected state can be treated with a treating liquid. The treatment apparatus is provided with a conveying means for conveying the substrate in the erected state in a predetermined direction and an etching treatment part 18 for jetting the treating liquid toward the substrate to be conveyed in the erected state by the conveying means. The etching treatment part 18 is provided with a plurality of nozzles 21a-21d for jetting the treating liquid toward the surface of the substrate. The nozzles 21a-21d are arranged at the predetermined intervals in the height direction of the substrate so that the nozzle positioned on the upper part in the height direction is positioned at the back of the nozzle positioned on the lower part in the substrate conveying direction.

Description

technical field [0001] The present invention relates to a substrate processing device and a processing method that are suitable for processing a substrate with a processing liquid. Background technique [0002] A circuit pattern is formed on a glass substrate used in a liquid crystal display device. To form circuit patterns on the substrate, a lithography process is used. In the lithography process, as is well known, a resist is coated on the above-mentioned substrate, and light is irradiated on the resist through a mask on which a circuit pattern is formed. [0003] Next, remove the part of the resist that is not irradiated with light or the part that is irradiated with light, etch the part of the substrate from which the resist has been removed, and after etching, a series of steps such as removing the resist are repeated several times, A circuit pattern is formed on the above-mentioned substrate. [0004] In such a lithography process, it is necessary to process the su...

Claims

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Application Information

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IPC IPC(8): B08B3/02B05B1/00G02F1/13G03F7/00
CPCG02F1/13G02F2201/54H01L21/67051H01L21/6715
Inventor 矶明典西部幸伸和歌月尊彦
Owner SHIBAURA MECHATRONICS CORP
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