Apparatus and method for processing substrate

A processing device and processing method technology, applied in chemical instruments and methods, cleaning methods using liquids, spraying devices, etc., can solve the problems of difference, poor reactivity, and inability to uniformly process substrates, etc.
CN100419501CInactive Publication Date: 2008-09-17SHIBAURA MECHATRONICS CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHIBAURA MECHATRONICS CORP
Publication Date
2008-09-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

Provided is a treatment apparatus with which a substrate to be conveyed in an erected state can be treated with a treating liquid. The treatment apparatus is provided with a conveying means for conveying the substrate in the erected state in a predetermined direction and an etching treatment part 18 for jetting the treating liquid toward the substrate to be conveyed in the erected state by the conveying means. The etching treatment part 18 is provided with a plurality of nozzles 21a-21d for jetting the treating liquid toward the surface of the substrate. The nozzles 21a-21d are arranged at the predetermined intervals in the height direction of the substrate so that the nozzle positioned on the upper part in the height direction is positioned at the back of the nozzle positioned on the lower part in the substrate conveying direction.
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Description

technical field

[0001] The present invention relates to a substrate processing device and a processing method that are suitable for processing a substrate with a processing liquid. Background technique

[0002] A circuit pattern is formed on a glass substrate used in a liquid crystal display device. To form circuit patterns on the substrate, a lithography process is used. In the lithography process, as is well known, a resist is coated on the above-mentioned substrate, and light is irradiated on the resist through a mask on which a circuit pattern is formed.

[0003] Next, remove the part of the resist that is not irradiated with light or the part that is irradiated with light, etch the part of the substrate from which the resist has been removed, and after etching, a series of steps such as removing the resist are repeated several times, A circuit pattern is formed on the above-mentioned substrate.

[0004] In such a lithography process, it is necessary to process the su...

Claims

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