Hanging tool for wafer electroplating

Abstract

The invention discloses a hanging tool for wafer electroplating. The hanging tool comprises an upper cover, a lower plate and a metal conductive ring, wherein an inner thread is arranged on the inner wall of the upper cover, a wafer groove is formed in the lower plate, an electroplating hole is formed in the middle of the wafer groove, and an outer thread engaged with the inner thread is arranged on the outer wall of the wafer groove; a platform is arranged between the inner wall of the wafer groove and the electroplating hole; the metal conductive ring is arranged on the platform. The upper cover of the hanging tool for the wafer electroplating is locked in a rotary mode, and the need of manually disassembling screws is eliminated, so that the hanging tool is convenient to operate, uniform in force, good in electrical conductivity and sealing performance and uniform in water coating, thereby greatly saving the manpower and reducing the wafer scrapping risk.

Description

technical field [0001] The invention relates to a wafer electroplating device of semiconductor electroplating equipment, in particular to a wafer electroplating hanger. Background technique [0002] The wafer plating hanger in the semiconductor electroplating equipment currently on the market is fixed by screws, which has the following disadvantages: 1. The operation procedure is relatively complicated, that is, when the wafer hanger is installed once, all the firm screws must be unscrewed before it can be opened. The upper cover of the hanger, after the wafer is installed, the above work must be repeated again to seal the wafer in the hanger; 2. If the existing hanger is not installed properly, it will directly affect the uniformity of the wafer surface coating , electrical conductivity, and the requirements for the screw material used on the surface of the hanger are very high, and the cost increases greatly; every time a wafer is installed in the hanger during on-site ope...

AI Technical Summary

Problems solved by technology

[0002] The wafer plating hanger in the semiconductor electroplating equipment currently on the market is fixed by screws, which has the following disadvantages: 1. The operation procedure is relatively complicated, that is, when the wafer hanger is installed once, all the firm screws must be unscrewed before it can be opened. The upper cover of the hanger, after the wafer is installed, the above work must be repeated again to seal the wafer in the hanger; 2. If the existing hanger is not installed properly, it will directly affect the uniformity of the wafer surface coating , electrical conductivity, and the requirements for the screw material used on the surface of the hanger are very high, and the cost increases greatly; every time a wafer is installed in the hanger during on-site operation, each screw must be manually locked. Greatly increased the workload and work procedures, wasting a lot of time

[0003] Electroplating hangers are mature products in the hardware industry and PCB industry, but in the wafer packaging industry, the requirements for the uniformity of the coating of electroplating products are extremely high, and ordinary hangers cannot meet the uniformity requirements of the coating at all.

[0004] A prior art discloses a wafer bump manufacturing hanger, which is installed on the conductive fixture at the side of the electroplating tank. This hanger is fixed by fastening plastic screws and metal threaded sleeves. It is not easy to control the strength when loading and unloading the screws. The tightness will have a great difference in the conductivity of the hanger, which will directly affect the uneven thickness of the coating and cause the scrapping of the wafer.

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