213results about "Stacked PCBs" patented technology

Disclosed is an electronic device including a first circuit board including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; a second circuit board including a third surface facing the first direction and a fourth surface facing the second direction; an interposer disposed between the first circuit board and the second circuit board; an antenna disposed at the first surface of the first circuit board; a first electronic component disposed on the second surface of the first circuit board and electrically connected with the antenna; and a thermal interface material (TIM) disposed between the second surface of the first circuit board and the third surface of the second circuit board and contacting a surface of the first electronic component.

A soldering board arrangement has a base board, which has a holding section that has a plurality of more than 100 soldering connection points for electrical contacting for a soldering board module. The holding section has soldering connection strips that differ from the soldering connection points. The strips extend outward from the direction of a center of the holding section, and allow soldering to corners of soldering board modules of different sizes.

In an embodiment, a smart connector includes an Application Specific Electronics Packaging device formed by an Application Specific Electronic Packaging manufacturing process, and a separate printed circuit board electrically connected to electrical components of the Application Specific Electronic Packaging device. The ASEP Application Specific Electronic Packaging manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of Application Specific Electronic Packaging devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.

A network device or a system can include a printed circuit board, an integrated circuit mounted on a first side of the printed circuit board, a rigid-flex circuit having a first rigid portion, a second rigid portion, and a flexible portion joined between the first and second rigid portions, and port connectors mounted on the second rigid portion of the rigid-flex circuit. The first rigid portion of the rigid-flex circuit can be disposed on a second side, opposing the first side, of the printed circuit board. The rigid-flex circuit is configured to communicatively couple the integrated circuit to the port connectors. The network device can include alignment structures for positioning the printed circuit board and the rigid-flex circuit within a housing of the device.

According to various embodiments, a module for wireless communication may comprise: a radiator; a plurality of resonators; a first substrate on which the radiator and the plurality of resonators are disposed; and a second substrate including a power supply. The first substrate may include a plurality of first layers. The second substrate may include a plurality of second layers. The radiator may be disposed in a radiation layer among the plurality of first layers of the first substrate. The plurality of resonators may be disposed in a resonance layer among the plurality of first layers of the first substrate. At least a portion of the plurality of resonators in the resonance layer may be disposed in a different area than the area in which the radiator is disposed in the radiation layer.

This disclosure provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the core board in the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This disclosure further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this disclosure helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

To reduce the size of a module and improve the reliability of inspecting at mounting parts.SOLUTION: A semiconductor module 10 includes an insulating substrate 14, semiconductor chips 16a and 16b, and a printed board 15. The printed board 15 includes a multilayer structure in which an insulating layer 18 and a wiring layer are stacked, and includes a lowermost wiring layer formed in a lowermost layer and bonded to an upper surface of the insulating substrate 14, and an uppermost wiring layer formed in an uppermost layer and including semiconductor chip mount wiring layers 51b and 61b where the semiconductor chips 16a and 16b are mounted. Just under the semiconductor chips 16a and 16b, metal inlays 17a and 17b electrically connected to the semiconductor chips 16a and 16b are embedded.SELECTED DRAWING: Figure 2

A sensor driving device includes a first substrate; a second substrate disposed on the first substrate; and an image sensor. The second substrate includes a body having first and second lateral surfaces; a first protrusion part protruding from the first lateral surface; and a second protrusion part protruding from the second lateral surface. The first protrusion part includes a first extension part, and a second extension part extending in a direction different from the first extension part. The second protrusion part includes a first extension part, and a second extension part extending in a direction different from the first extension part. The first extension parts are disposed parallel to an optical axis of the image sensor. The second extension part of the first protrusion part is closer to the second extension part of the second protrusion part than to the first extension part of the second protrusion part.

An apparatus having at least one interconnect is provided. In one aspect, an apparatus includes a first media providing a first signal channel, a second media providing a second signal channel, and an interconnect. The interconnect includes a first mating structure that includes a first electrode mounted to the first media and a thin film dielectric disposed on the first electrode. The interconnect also includes a second mating structure having a second electrode mounted to the second media. The first mating structure is connectable with the second mating structure to connect the interconnect so that, when connected, the first electrode, the thin film dielectric, and the second electrode form a thin film capacitor between the first media and the second media and connect the first signal channel and the second signal channel to form a connected signal channel.

Fuse assemblies are disclosed. In one implementation, a fuse assembly may be disposed that includes a first portion of the second portion. The first portion may be formed of a first metal. The second portion may be formed of a second metal different from the first metal. The second metal may be copper, and the copper may be tin plated or silver plated.

The invention relates to a method for producing an SMD semiconductor component assembly equipped with a circuit carrier (100), said method comprising: providing an SMD circuit carrier (1), preferably an IMS substrate or a pin frame, equipped with contact points (3) of a conductor structure (2a) and an insulator; according to the invention, a circuit carrier (100) having a first main surface (102) and a second main surface (103) opposite the first main surface (102) is provided, the first main surface is at least partially provided with an electrical conductor, the second main surface is at least partially provided with an electrical conductor, at least one blind hole (108) having a blind hole bottom (104) is provided in the circuit carrier (100), the blind hole is provided with an electrical conductor, and the blind hole bottom (104) is provided with an electrical conductor. And the blind hole bottom (104) is formed by, preferably only, at least one layer of the electrical conductor; according to the invention, the blind hole base (104) of the circuit carrier (100) is positioned in contact with the contact point (3) of the SMD circuit carrier (1), and the electrical contact is made by melting the blind hole base (104) of the circuit carrier (100) and the contact point (3) of the SMD circuit carrier (1) by means of laser welding.

A thin electronic device includes a first sealing member, a second sealing member, a first circuit member, and a second circuit member. The first sealing member substantially includes a first film formed with an opening and includes a frame film. At least one of the first circuit member and the second circuit member includes an exposed portion and a sealing portion surrounding the exposed portion. The frame film has a thin film sealing portion and a circuit sealing portion. The thin film sealing portion is joined to the first film to surround the opening. The circuit sealing portion is joined to the sealing portion to surround the exposed portion. The device is formed with a closed space enclosed by the first sealing member and the second sealing member. The exposed portion is exposed to an external space located outside the device. The device has a thinner structure.

Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

A circuit board assembly includes a first substrate and at least one first pad. The first substrate includes a first surface, a second surface, and a side surface. The first surface and the second surface are opposite to each other along a first direction, the side surface connects the first surface to the second surface, a groove is defined on the side surface and extending through the first surface and the second surface. Each first pad is accommodated in a corresponding groove of the groove and connects to a groove wall of the groove, each first pad includes a first welding surface, a second welding surface, and a third welding surface, the first welding surface connects the first surface, the second welding surface connects the second surface, the third welding surface connects the first welding surface to the second welding surface. The present disclosure further provides a terminal device.

A component carrier assembly includes a first component carrier having a first electrically insulating layer structure and a via in the first electrically insulating layer structure, where the via is at least partially filled with electrically conductive material and where an upper part of the via extends beyond an outer main surface of the first component carrier; and a second component carrier having a second electrically insulating layer structure, and an electrically conductive adhesive material that is at least partially embedded in the second electrically insulating layer structure. The first component carrier and the second component carrier are interconnected and the upper part of the via at least partially penetrates into the electrically conductive adhesive material.

The present invention is directed to semiconductor devices and packages. According to an exemplary embodiment, one or more substrate extensions are coupled to a base substrate, with portions of one or more substrates extending beyond the base substrate. Electrical and / or optical connections are connected to these substrate extensions. There are additional embodiments as well.

This application discloses a flexible printed circuit, a circuit board assembly, and an electronic device. The flexible printed circuit includes a bent portion and a soldering portion connected to the bent portion. The flexible printed circuit includes a plurality of conductive layers and a plurality of insulating layers, and the insulating layers are disposed between two adjacent conductive layers. The plurality of conductive layers includes a first soldering layer, a second soldering layer, and a trace layer. Both the first soldering layer and the second soldering layer are located in the soldering portion. The first soldering layer is one surface layer of the soldering portion, and the first soldering layer is formed by a plurality of first pads arranged at intervals from each other. The second soldering layer is the other surface layer of the soldering portion, and the second soldering layer is formed by a plurality of second pads arranged at intervals from each other. The trace layer is located between the first soldering layer and the second soldering layer and extends from the soldering portion to the bent portion. The first pads and the second pads are connected by using through-hole conductors and are connected to the trace layer. The pad pitch in the soldering portion of the flexible printed circuit is relatively small, whereby the surface area of the soldering portion is reduced and miniaturization can be facilitated.

A technique for creating a printed circuit board (PCB) with 3D structure entails Manufacturing a main PCB and a plurality of PCB pieces. The plurality of PCB pieces are then loaded into a tape of a tape and reel assembly, and the main PCB is processed through an assembler, wherein a tape and reel placement machine is loaded with the tape and reel assembly. The assembler processes the main PCB such that one or more of the plurality of PCB pieces is placed on and affixed to the main PCB. The tape and reel placement machine may also contain a tape loaded with other SMTs, which may be affixed to the main PC.

The present invention relates to a method for manufacturing an SMD semiconductor assembly equipped with a circuit carrier. The method comprises the steps of: providing an SMD circuit carrier, preferably an IMS substrate or lead frame, having contacts between a conductor path structure and an insulator; providing a circuit carrier having a first main surface on which an electrical conductor is at least partially provided and a second main surface facing the first main surface and also on which an electrical conductor is at least partially provided, wherein the circuit carrier is provided with at least one blind hole having the electrical conductor and a blind hole bottom, the blind hole bottom preferably formed by only at least one layer of the electrical conductor; and positioning the blind hole bottom of the circuit carrier in contact with the contacts of the SMD circuit carrier, and making electrical contact by melting the blind hole bottom of the circuit carrier and the contacts of the SMD circuit carrier by laser welding.

The disclosure relates to an integral electronic stack and a multi-layer stack. Specifically, according to an embodiment of the disclosure, there is provided an integral electronic stack for grounding an electrically conductive component in which passive intermodulation (PIM) is reduced, wherein the integral electronic stack includes a first integral stack and a second integral stack, the first integral stack being bonded to the second integral stack, wherein the first integral stack includes: a first board which is substantially rigid; a first electrically conductive layer which is disposed on at least part of a first main surface of the first board; a first electrically conductive adhesive layer and a second electrically conductive adhesive layer; and a first electrically conductive film which is disposed between the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, and is bonded to the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, respectively, the first electrically conductive adhesive layer and the second electrically conductive adhesive layer including a plurality of electrically conductive elements substantially distributed in an electrically insulative material, wherein the first electrically conductive adhesive layer bonds the first electrically conductive film to the one or more first electrically conductive layer.

To provide a smart connector and a method of manufacturing the same.SOLUTION: A smart connector includes: an Application Specific Electronics Packaging (ASEP) device for a specific application; and a separate printed circuit board connected to the ASEP device. An ASEP manufacturing process includes: forming a continuous carrier web having a plurality of lead frames; overmolding a substrate onto fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers; and electroplating traces, and electrically attaching at least one electrical component to the traces to form a plurality of ASEP devices. In some embodiments, the printed circuit board has electrical components configured to control functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.SELECTED DRAWING: Figure 2

A wiring board according to an embodiment includes: a first wiring board (11) including a first insulating layer (111), a first conductor layer (112), and a first via conductor (113); and a second wiring board (12) including a second insulating layer (211), a second conductor layer (212), and a second via conductor (213). The second wiring substrate (12) is mounted on the first wiring substrate (11), the minimum value of the wiring width of the wiring (FW2) included in the second conductor layer (212) is smaller than the minimum value of the wiring width of the wiring (FW1) included in the first conductor layer (112), the minimum value of the wiring interval of the wiring (FW2) is smaller than the minimum value of the wiring interval of the wiring (FW1), the wiring width of the wiring (FW2) is 3 [mu] m or less, and the wiring width of the wiring (FW1) is 3 [mu] m or less. The wiring interval of the wiring (FW2) is 3 [mu] m or less, and the aspect ratio of the wiring (FW2) is 2.0-4.0 (inclusive).

A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

Printed circuit board housing device (10) with at least three printed circuit board elements (11), namely a lower printed circuit board element (11.1) and an upper printed circuit board element (11.3) and at least one intermediate printed circuit board element (11.2) arranged between them, wherein the at least three printed circuit board elements (11) are arranged in a planar arrangement, wherein at least on the upper printed circuit board element (11.3) a plurality of interconnected components from the following group are provided: conductor tracks (12), sensor units (13), contact points (14), microchip units (15); characterized in that the lower printed circuit board element (11.1) together with the at least one intermediate printed circuit board element (11.2) and the upper printed circuit board element (11.3) forms a housing (10a) for the enclosure on at least one side of at least one of the components on the upper printed circuit board element (11.3).3) components provided; wherein a housing cavity (17) is formed by means of the at least one intermediate circuit board element (11.2), which is sealed by the upper and lower circuit board elements (11.3, 11.1) in such a way that the housing is formed and sealed exclusively by the interconnected circuit board elements (11.1, 11.2, 11.3), wherein the housing (10a) is sealed against the environment by a permanent irreversible, fully circumferential connection of the circuit board elements (11) to each other, with the housing cavity (17) in a hermetic seal against moisture and dust, wherein at least one of the components arranged on the upper circuit board element (11.3) is / remains contactable on the outer top surface of the upper circuit board element (11.3), wherein the permanent irreversible connection of the circuit board elements (11.3) are connected to each other by a metallic connection along one / the respective circumferential connection line (17.1), wherein an electromagnetic shielding function is integrated into the housing (10a) formed by the at least three circuit board elements ( 11).

The present disclosure provides a flexible circuit board and a display device. The flexible circuit board includes: a plurality of sub-circuit boards arranged in a stacked manner, the plurality of sub-circuit boards at least including a first sub-circuit board and a second sub-circuit board; and a pressure sensor arranged on the first sub-circuit board, wherein the first sub-circuit board includes: a substrate film; a conductive film arranged on a side of the substrate film away from the second sub-circuit board; an adhesive layer arranged on a side of the conductive film away from the substrate film; a covering layer arranged on a side of the adhesive layer away from the substrate film; and an electromagnetic shielding layer arranged on a side of the covering layer away from the substrate film, wherein at least a portion of the conductive film forms an electrode of the pressure sensor.

A stacked circuit board assembly comprises a first circuit board, a second circuit board arranged in parallel with the first circuit board, and a third circuit board arranged between the first circuit board and the second circuit board. The first and second circuit boards respectively comprise first and second electric contacts. The third circuit board comprises a substrate, a third electric contact, a fourth electric contact and a conductive connection structure. The third electric contact and the fourth electric contact are arranged on the two opposite surfaces of the substrate respectively and abut against the first electric contact and the second electric contact respectively. The conductive connection structure is connected with the third electric contact and the fourth electric contact.