13results about "Stacked PCBs" patented technology

The present invention relates to a method for manufacturing an SMD semiconductor assembly equipped with a circuit carrier. The method comprises the steps of: providing an SMD circuit carrier, preferably an IMS substrate or lead frame, having contacts between a conductor path structure and an insulator; providing a circuit carrier having a first main surface on which an electrical conductor is at least partially provided and a second main surface facing the first main surface and also on which an electrical conductor is at least partially provided, wherein the circuit carrier is provided with at least one blind hole having the electrical conductor and a blind hole bottom, the blind hole bottom preferably formed by only at least one layer of the electrical conductor; and positioning the blind hole bottom of the circuit carrier in contact with the contacts of the SMD circuit carrier, and making electrical contact by melting the blind hole bottom of the circuit carrier and the contacts of the SMD circuit carrier by laser welding.

A semiconductor storage device according to one embodiment comprises a first circuit board and a second circuit board. The first circuit board includes a first section, a second section that is thinner than the first section, and a plurality of first conductive sections on the second section. The second circuit board includes a plurality of second conductive sections. The plurality of second conductive sections overlaps the plurality of first conductive sections when viewed from a first direction, which is a thickness direction of the first circuit board. The plurality of second conductive sections are connected to the plurality of first conductive sections by solder in a one-to-one correspondence.

To provide a sensor driver.SOLUTION: A sensor driving device according to one embodiment of the present invention includes a first substrate, a second substrate arranged on the first substrate and electrically connected to the first substrate, and an image sensor arranged on the second substrate, the second substrate includes a body and a first protrusion protruding from one end of the body, and the first protrusion includes a first extension part extending from the body in a first direction and a second extension part extending from the first extension part in a second direction different from the first direction.SELECTED DRAWING: Figure 2

Disclosed herein is a device that provides for high power transfer. The device may include a printed circuit board and a package substrate disposed on the printed circuit board. The device may also include a plurality of high-power voltage regulators disposed on and electrically connected to the package substrate. The device may also include a plurality of low-power voltage regulators disposed on and electrically connected to the printed circuit board.

This application discloses a flexible printed circuit, a circuit board assembly, and an electronic device. The flexible printed circuit includes a bent portion and a soldering portion connected to the bent portion. The flexible printed circuit includes a plurality of conductive layers and a plurality of insulating layers, and the insulating layers are disposed between two adjacent conductive layers. The plurality of conductive layers includes a first soldering layer, a second soldering layer, and a trace layer. Both the first soldering layer and the second soldering layer are located in the soldering portion. The first soldering layer is one surface layer of the soldering portion, and the first soldering layer is formed by a plurality of first pads arranged at intervals from each other. The second soldering layer is the other surface layer of the soldering portion, and the second soldering layer is formed by a plurality of second pads arranged at intervals from each other. The trace layer is located between the first soldering layer and the second soldering layer and extends from the soldering portion to the bent portion. The first pads and the second pads are connected by using through-hole conductors and are connected to the trace layer. The pad pitch in the soldering portion of the flexible printed circuit is relatively small, whereby the surface area of the soldering portion is reduced and miniaturization can be facilitated.

Disclosed herein are implementations of methods and devices for stacking printed circuit board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on surface mount technology (SMT) component and solder joint reliability.

Provided are a driver controller integrated board, a control system, and a robot. The driver controller integrated board includes a control module (1), a drive module (2), and a first substrate (3). The control module (1) and the drive module (2) are disposed on the first substrate (3), and the control module (1) is electrically connected to the drive module (2).

The invention relates to a power module (1) intended to be connected to a connection grid, comprising: - A power board (101) comprising a substrate (1011), two power portions (1012) arranged on the substrate, - A signal board (11) mounted on the power board, - Electrically conductive connection pads (12, 22), each connection pad comprising a first face (121, 221) and a second face (122, 222), the first face being connected to one of the power portions (1012) and the signal board (11), the second face being intended to be electrically connected to the connection grid, - A housing enclosing the power board, the signal board and the connection pads, the second face of the connection pads being flush with a top surface of the housing.

Disclosed are a display device and a display panel (100). The display device may include a display panel (100) and a plurality of circuit boards (200) connected to the display panel (100). The display panel (100) may include an electrode pattern (110) disposed on a substrate (10) and a pad (120) electrically connected to the circuit boards (200). The pad (120) may include a first pad (120a) arranged on the electrode pattern (110) to overlap the electrode pattern (110). The first pad (120a) may include a plurality of first pad wires (121) spaced apart from one another. This structure may allow for improved electrical connection and heat dissipation in regions where wire concentration is high.

A semiconductor storage device according to one embodiment includes a first board and a second board. The first board includes a first portion, a second portion thinner than the first portion, and a plurality of first conductive portions on the second portion. The second board includes a plurality of second conductive portions. The plurality of second conductive portions overlap the plurality of first conductive portions when viewed from a first direction which is a thickness direction of the first board. The plurality of second conductive portions are connected to the plurality of first conductive portions by solder in one-to-one correspondence.

An array printed circuit board, a printed circuit board, and a method of manufacturing the same are provided. The array printed circuit board includes a plurality of substrate regions in which a plurality of printed circuit boards are respectively disposed, and a peripheral region connected to the plurality of substrate regions. At least one substrate region of the plurality of substrate regions includes a separation hole. The at least one substrate region and the peripheral region include a wiring, and the wiring includes one or more wiring layers. The wiring includes an outer side wiring including a first portion between an edge of the at least one substrate region and a first side of the separation hole adjacent to the edge of the at least one substrate region.

A semiconductor storage device according to one embodiment includes a first board and a second board. The first board includes a first portion, a second portion thinner than the first portion, and a plurality of first conductive portions on the second portion. The second board includes a plurality of second conductive portions. The plurality of second conductive portions overlap the plurality of first conductive portions when viewed from a first direction which is a thickness direction of the first board. The plurality of second conductive portions are connected to the plurality of first conductive portions by solder in one-to-one correspondence.