88results about "Stacked PCBs" patented technology

This disclosure provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the core board in the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This disclosure further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this disclosure helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

To reduce the size of a module and improve the reliability of inspecting at mounting parts.SOLUTION: A semiconductor module 10 includes an insulating substrate 14, semiconductor chips 16a and 16b, and a printed board 15. The printed board 15 includes a multilayer structure in which an insulating layer 18 and a wiring layer are stacked, and includes a lowermost wiring layer formed in a lowermost layer and bonded to an upper surface of the insulating substrate 14, and an uppermost wiring layer formed in an uppermost layer and including semiconductor chip mount wiring layers 51b and 61b where the semiconductor chips 16a and 16b are mounted. Just under the semiconductor chips 16a and 16b, metal inlays 17a and 17b electrically connected to the semiconductor chips 16a and 16b are embedded.SELECTED DRAWING: Figure 2

An apparatus having at least one interconnect is provided. In one aspect, an apparatus includes a first media providing a first signal channel, a second media providing a second signal channel, and an interconnect. The interconnect includes a first mating structure that includes a first electrode mounted to the first media and a thin film dielectric disposed on the first electrode. The interconnect also includes a second mating structure having a second electrode mounted to the second media. The first mating structure is connectable with the second mating structure to connect the interconnect so that, when connected, the first electrode, the thin film dielectric, and the second electrode form a thin film capacitor between the first media and the second media and connect the first signal channel and the second signal channel to form a connected signal channel.

Fuse assemblies are disclosed. In one implementation, a fuse assembly may be disposed that includes a first portion of the second portion. The first portion may be formed of a first metal. The second portion may be formed of a second metal different from the first metal. The second metal may be copper, and the copper may be tin plated or silver plated.

The invention relates to a method for producing an SMD semiconductor component assembly equipped with a circuit carrier (100), said method comprising: providing an SMD circuit carrier (1), preferably an IMS substrate or a pin frame, equipped with contact points (3) of a conductor structure (2a) and an insulator; according to the invention, a circuit carrier (100) having a first main surface (102) and a second main surface (103) opposite the first main surface (102) is provided, the first main surface is at least partially provided with an electrical conductor, the second main surface is at least partially provided with an electrical conductor, at least one blind hole (108) having a blind hole bottom (104) is provided in the circuit carrier (100), the blind hole is provided with an electrical conductor, and the blind hole bottom (104) is provided with an electrical conductor. And the blind hole bottom (104) is formed by, preferably only, at least one layer of the electrical conductor; according to the invention, the blind hole base (104) of the circuit carrier (100) is positioned in contact with the contact point (3) of the SMD circuit carrier (1), and the electrical contact is made by melting the blind hole base (104) of the circuit carrier (100) and the contact point (3) of the SMD circuit carrier (1) by means of laser welding.

Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

A component carrier assembly includes a first component carrier having a first electrically insulating layer structure and a via in the first electrically insulating layer structure, where the via is at least partially filled with electrically conductive material and where an upper part of the via extends beyond an outer main surface of the first component carrier; and a second component carrier having a second electrically insulating layer structure, and an electrically conductive adhesive material that is at least partially embedded in the second electrically insulating layer structure. The first component carrier and the second component carrier are interconnected and the upper part of the via at least partially penetrates into the electrically conductive adhesive material.

A technique for creating a printed circuit board (PCB) with 3D structure entails Manufacturing a main PCB and a plurality of PCB pieces. The plurality of PCB pieces are then loaded into a tape of a tape and reel assembly, and the main PCB is processed through an assembler, wherein a tape and reel placement machine is loaded with the tape and reel assembly. The assembler processes the main PCB such that one or more of the plurality of PCB pieces is placed on and affixed to the main PCB. The tape and reel placement machine may also contain a tape loaded with other SMTs, which may be affixed to the main PC.

The present invention relates to a method for manufacturing an SMD semiconductor assembly equipped with a circuit carrier. The method comprises the steps of: providing an SMD circuit carrier, preferably an IMS substrate or lead frame, having contacts between a conductor path structure and an insulator; providing a circuit carrier having a first main surface on which an electrical conductor is at least partially provided and a second main surface facing the first main surface and also on which an electrical conductor is at least partially provided, wherein the circuit carrier is provided with at least one blind hole having the electrical conductor and a blind hole bottom, the blind hole bottom preferably formed by only at least one layer of the electrical conductor; and positioning the blind hole bottom of the circuit carrier in contact with the contacts of the SMD circuit carrier, and making electrical contact by melting the blind hole bottom of the circuit carrier and the contacts of the SMD circuit carrier by laser welding.

The disclosure relates to an integral electronic stack and a multi-layer stack. Specifically, according to an embodiment of the disclosure, there is provided an integral electronic stack for grounding an electrically conductive component in which passive intermodulation (PIM) is reduced, wherein the integral electronic stack includes a first integral stack and a second integral stack, the first integral stack being bonded to the second integral stack, wherein the first integral stack includes: a first board which is substantially rigid; a first electrically conductive layer which is disposed on at least part of a first main surface of the first board; a first electrically conductive adhesive layer and a second electrically conductive adhesive layer; and a first electrically conductive film which is disposed between the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, and is bonded to the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, respectively, the first electrically conductive adhesive layer and the second electrically conductive adhesive layer including a plurality of electrically conductive elements substantially distributed in an electrically insulative material, wherein the first electrically conductive adhesive layer bonds the first electrically conductive film to the one or more first electrically conductive layer.

A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner.

Printed circuit board housing device (10) with at least three printed circuit board elements (11), namely a lower printed circuit board element (11.1) and an upper printed circuit board element (11.3) and at least one intermediate printed circuit board element (11.2) arranged between them, wherein the at least three printed circuit board elements (11) are arranged in a planar arrangement, wherein at least on the upper printed circuit board element (11.3) a plurality of interconnected components from the following group are provided: conductor tracks (12), sensor units (13), contact points (14), microchip units (15); characterized in that the lower printed circuit board element (11.1) together with the at least one intermediate printed circuit board element (11.2) and the upper printed circuit board element (11.3) forms a housing (10a) for the enclosure on at least one side of at least one of the components on the upper printed circuit board element (11.3).3) components provided; wherein a housing cavity (17) is formed by means of the at least one intermediate circuit board element (11.2), which is sealed by the upper and lower circuit board elements (11.3, 11.1) in such a way that the housing is formed and sealed exclusively by the interconnected circuit board elements (11.1, 11.2, 11.3), wherein the housing (10a) is sealed against the environment by a permanent irreversible, fully circumferential connection of the circuit board elements (11) to each other, with the housing cavity (17) in a hermetic seal against moisture and dust, wherein at least one of the components arranged on the upper circuit board element (11.3) is / remains contactable on the outer top surface of the upper circuit board element (11.3), wherein the permanent irreversible connection of the circuit board elements (11.3) are connected to each other by a metallic connection along one / the respective circumferential connection line (17.1), wherein an electromagnetic shielding function is integrated into the housing (10a) formed by the at least three circuit board elements ( 11).

A stacked circuit board assembly comprises a first circuit board, a second circuit board arranged in parallel with the first circuit board, and a third circuit board arranged between the first circuit board and the second circuit board. The first and second circuit boards respectively comprise first and second electric contacts. The third circuit board comprises a substrate, a third electric contact, a fourth electric contact and a conductive connection structure. The third electric contact and the fourth electric contact are arranged on the two opposite surfaces of the substrate respectively and abut against the first electric contact and the second electric contact respectively. The conductive connection structure is connected with the third electric contact and the fourth electric contact.

A semiconductor storage device according to one embodiment comprises a first circuit board and a second circuit board. The first circuit board includes a first section, a second section that is thinner than the first section, and a plurality of first conductive sections on the second section. The second circuit board includes a plurality of second conductive sections. The plurality of second conductive sections overlaps the plurality of first conductive sections when viewed from a first direction, which is a thickness direction of the first circuit board. The plurality of second conductive sections are connected to the plurality of first conductive sections by solder in a one-to-one correspondence.

To provide a sensor driver.SOLUTION: A sensor driving device according to one embodiment of the present invention includes a first substrate, a second substrate arranged on the first substrate and electrically connected to the first substrate, and an image sensor arranged on the second substrate, the second substrate includes a body and a first protrusion protruding from one end of the body, and the first protrusion includes a first extension part extending from the body in a first direction and a second extension part extending from the first extension part in a second direction different from the first direction.SELECTED DRAWING: Figure 2

A PCB component used in a voltage regulator module and a method for manufacturing the voltage regulator module are disclosed. The PCB component includes a PCB and an inductor. The PCB includes a top surface and a bottom surface. The inductor includes a magnetic core and a winding. The winding runs through the magnetic core, and the winding forms an upper outlet terminal on the upper surface and a lower outlet terminal on the lower surface. The inductor is embedded in the PCB. A plurality of conductive layers are respectively disposed above the upper surface and below the lower surface. The upper outlet terminal and the lower outlet terminal are electrically connected to a power device and an external circuit board. The power device, the PCB component and the external circuit board are stacked vertically in sequence and connected through one reflow welding process to form a voltage regulator module.

A printed circuit board laminated device includes a circuit board unit, a bracket unit, a cover plate unit and a coupled unit. The circuit board unit includes a first control circuit and a second control circuit disposed on a circuit board body. The bracket unit includes a hollow bracket body disposed on the circuit board unit along a laminating direction. The cover plate unit is disposed on the bracket unit along the laminating direction and opposite to the circuit board unit to cooperatively define a compartment. The coupled unit includes first and second coupled elements which are securely connected with the circuit board body and in the compartment and which are respectively and electrically connected with the first and second control circuits. The second coupled element responds to the first coupled element to generate a sensing signal.

This application provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This application further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this application helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.

A lens driving device related to the field of driving devices and includes a lens assembly and a driving module for driving the lens assembly to move. The driving module includes a first driving module and a second driving module. The lens assembly is accommodated in the first driving module. The second driving module is sleeved on one side of the first driving module away from the lens assembly. The lens assembly is driven by the first driving module and the second driving module that realize movement in multiple different directions, so the lens assembly accommodated in the first driving module realizes movement in multiple directions, thereby achieving good image stabilization effect.

A module includes a wiring member, a first wiring board, and a second wiring board laminated on the first wiring board with the wiring member therebetween. A plurality of first pads bonded to the wiring member via a plurality of first bonding members are disposed on a first main surface of the first wiring board. A plurality of second pads bonded to the wiring member via a plurality of second bonding members are disposed on a second main surface of the second wiring board. The second wiring board has a lower flexural rigidity than the first wiring board. A total area of part of the plurality of second pads in contact with the plurality of second bonding members is larger than a total area of part of the plurality of first pads in contact with the plurality of first bonding members.

A circuit board weld structure comprises a first circuit board connected with and a second circuit board. A surface of the first circuit board is provided with a first covering film, the first covering film is provided with a first through hole, and a first welding pad is formed on the surface of the first circuit board. A surface of the second circuit board is provided with a second covering film, the second covering film is provided with a second through hole, and a second welding pad is formed on the surface of the second circuit board. The first welding pad is welded or coupled to the second welding pad through a filler piece.

Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including at least two posts having different widths. In an embodiment, a system can include a first substrate having a first layer comprising a first post having a first width and a second layer coupled to the first layer and comprising an external surface of the first substrate and a second post having a second width connected to the first post. The first width can be less than the second width. The system can further include a solder connected to the second post and configured to connect the second post to a first connector on a second substrate.

A module includes: a wiring member; a first wiring board; and a second wiring board laminated on the first wiring board, in which the wiring member is between the first wiring board and the second wiring board. A plurality of first pads bonded to the wiring member via a plurality of first bonding members are provided on a first main surface of the first wiring board. A plurality of second pads bonded to the wiring member via a plurality of second bonding members are provided on a second main surface of the second wiring board. The second wiring board has a lower flexural rigidity than the first wiring board. A total area of portions of the plurality of second pads in contact with the plurality of second bonding members is larger than a total area of portions of the plurality of first pads in contact with the plurality of first bonding members.

A soldering board arrangement has a base board, which has a holding section that has a plurality of more than 100 soldering connection points for electrical contacting for a soldering board module. The holding section has soldering connection strips that differ from the soldering connection points. The strips extend outward from the direction of a center of the holding section, and allow soldering to corners of soldering board modules of different sizes.

A voltage converter (10) is provided, comprising: - a first printed circuit board (11) with a first circuit section (13) of the voltage converter (10), wherein the first circuit section (13) comprises semiconductor chips (15) embedded between metal layers of the first printed circuit board (11), and - a second printed circuit board (12) with a second circuit section (14) of the voltage converter (10), wherein the first circuit section (13) is electrically coupled to the second circuit section (14).

According to various embodiments, a module for wireless communication may comprise: a radiator; a plurality of resonators; a first substrate on which the radiator and the plurality of resonators are disposed; and a second substrate including a power supply. The first substrate may include a plurality of first layers. The second substrate may include a plurality of second layers. The radiator may be disposed in a radiation layer among the plurality of first layers of the first substrate. The plurality of resonators may be disposed in a resonance layer among the plurality of first layers of the first substrate. At least a portion of the plurality of resonators in the resonance layer may be disposed in a different area than the area in which the radiator is disposed in the radiation layer.