48results about "Stacked PCBs" patented technology

This disclosure provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the core board in the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This disclosure further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this disclosure helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

Fuse assemblies are disclosed. In one implementation, a fuse assembly may be disposed that includes a first portion of the second portion. The first portion may be formed of a first metal. The second portion may be formed of a second metal different from the first metal. The second metal may be copper, and the copper may be tin plated or silver plated.

The present invention relates to a method for manufacturing an SMD semiconductor assembly equipped with a circuit carrier. The method comprises the steps of: providing an SMD circuit carrier, preferably an IMS substrate or lead frame, having contacts between a conductor path structure and an insulator; providing a circuit carrier having a first main surface on which an electrical conductor is at least partially provided and a second main surface facing the first main surface and also on which an electrical conductor is at least partially provided, wherein the circuit carrier is provided with at least one blind hole having the electrical conductor and a blind hole bottom, the blind hole bottom preferably formed by only at least one layer of the electrical conductor; and positioning the blind hole bottom of the circuit carrier in contact with the contacts of the SMD circuit carrier, and making electrical contact by melting the blind hole bottom of the circuit carrier and the contacts of the SMD circuit carrier by laser welding.

The disclosure relates to an integral electronic stack and a multi-layer stack. Specifically, according to an embodiment of the disclosure, there is provided an integral electronic stack for grounding an electrically conductive component in which passive intermodulation (PIM) is reduced, wherein the integral electronic stack includes a first integral stack and a second integral stack, the first integral stack being bonded to the second integral stack, wherein the first integral stack includes: a first board which is substantially rigid; a first electrically conductive layer which is disposed on at least part of a first main surface of the first board; a first electrically conductive adhesive layer and a second electrically conductive adhesive layer; and a first electrically conductive film which is disposed between the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, and is bonded to the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, respectively, the first electrically conductive adhesive layer and the second electrically conductive adhesive layer including a plurality of electrically conductive elements substantially distributed in an electrically insulative material, wherein the first electrically conductive adhesive layer bonds the first electrically conductive film to the one or more first electrically conductive layer.

A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner.

Printed circuit board housing device (10) with at least three printed circuit board elements (11), namely a lower printed circuit board element (11.1) and an upper printed circuit board element (11.3) and at least one intermediate printed circuit board element (11.2) arranged between them, wherein the at least three printed circuit board elements (11) are arranged in a planar arrangement, wherein at least on the upper printed circuit board element (11.3) a plurality of interconnected components from the following group are provided: conductor tracks (12), sensor units (13), contact points (14), microchip units (15); characterized in that the lower printed circuit board element (11.1) together with the at least one intermediate printed circuit board element (11.2) and the upper printed circuit board element (11.3) forms a housing (10a) for the enclosure on at least one side of at least one of the components on the upper printed circuit board element (11.3).3) components provided; wherein a housing cavity (17) is formed by means of the at least one intermediate circuit board element (11.2), which is sealed by the upper and lower circuit board elements (11.3, 11.1) in such a way that the housing is formed and sealed exclusively by the interconnected circuit board elements (11.1, 11.2, 11.3), wherein the housing (10a) is sealed against the environment by a permanent irreversible, fully circumferential connection of the circuit board elements (11) to each other, with the housing cavity (17) in a hermetic seal against moisture and dust, wherein at least one of the components arranged on the upper circuit board element (11.3) is / remains contactable on the outer top surface of the upper circuit board element (11.3), wherein the permanent irreversible connection of the circuit board elements (11.3) are connected to each other by a metallic connection along one / the respective circumferential connection line (17.1), wherein an electromagnetic shielding function is integrated into the housing (10a) formed by the at least three circuit board elements ( 11).

A semiconductor storage device according to one embodiment comprises a first circuit board and a second circuit board. The first circuit board includes a first section, a second section that is thinner than the first section, and a plurality of first conductive sections on the second section. The second circuit board includes a plurality of second conductive sections. The plurality of second conductive sections overlaps the plurality of first conductive sections when viewed from a first direction, which is a thickness direction of the first circuit board. The plurality of second conductive sections are connected to the plurality of first conductive sections by solder in a one-to-one correspondence.

To provide a sensor driver.SOLUTION: A sensor driving device according to one embodiment of the present invention includes a first substrate, a second substrate arranged on the first substrate and electrically connected to the first substrate, and an image sensor arranged on the second substrate, the second substrate includes a body and a first protrusion protruding from one end of the body, and the first protrusion includes a first extension part extending from the body in a first direction and a second extension part extending from the first extension part in a second direction different from the first direction.SELECTED DRAWING: Figure 2

A PCB component used in a voltage regulator module and a method for manufacturing the voltage regulator module are disclosed. The PCB component includes a PCB and an inductor. The PCB includes a top surface and a bottom surface. The inductor includes a magnetic core and a winding. The winding runs through the magnetic core, and the winding forms an upper outlet terminal on the upper surface and a lower outlet terminal on the lower surface. The inductor is embedded in the PCB. A plurality of conductive layers are respectively disposed above the upper surface and below the lower surface. The upper outlet terminal and the lower outlet terminal are electrically connected to a power device and an external circuit board. The power device, the PCB component and the external circuit board are stacked vertically in sequence and connected through one reflow welding process to form a voltage regulator module.

A module includes a wiring member, a first wiring board, and a second wiring board laminated on the first wiring board with the wiring member therebetween. A plurality of first pads bonded to the wiring member via a plurality of first bonding members are disposed on a first main surface of the first wiring board. A plurality of second pads bonded to the wiring member via a plurality of second bonding members are disposed on a second main surface of the second wiring board. The second wiring board has a lower flexural rigidity than the first wiring board. A total area of part of the plurality of second pads in contact with the plurality of second bonding members is larger than a total area of part of the plurality of first pads in contact with the plurality of first bonding members.

A circuit board weld structure comprises a first circuit board connected with and a second circuit board. A surface of the first circuit board is provided with a first covering film, the first covering film is provided with a first through hole, and a first welding pad is formed on the surface of the first circuit board. A surface of the second circuit board is provided with a second covering film, the second covering film is provided with a second through hole, and a second welding pad is formed on the surface of the second circuit board. The first welding pad is welded or coupled to the second welding pad through a filler piece.

A module includes: a wiring member; a first wiring board; and a second wiring board laminated on the first wiring board, in which the wiring member is between the first wiring board and the second wiring board. A plurality of first pads bonded to the wiring member via a plurality of first bonding members are provided on a first main surface of the first wiring board. A plurality of second pads bonded to the wiring member via a plurality of second bonding members are provided on a second main surface of the second wiring board. The second wiring board has a lower flexural rigidity than the first wiring board. A total area of portions of the plurality of second pads in contact with the plurality of second bonding members is larger than a total area of portions of the plurality of first pads in contact with the plurality of first bonding members.

A soldering board arrangement has a base board, which has a holding section that has a plurality of more than 100 soldering connection points for electrical contacting for a soldering board module. The holding section has soldering connection strips that differ from the soldering connection points. The strips extend outward from the direction of a center of the holding section, and allow soldering to corners of soldering board modules of different sizes.

A voltage converter (10) is provided, comprising: - a first printed circuit board (11) with a first circuit section (13) of the voltage converter (10), wherein the first circuit section (13) comprises semiconductor chips (15) embedded between metal layers of the first printed circuit board (11), and - a second printed circuit board (12) with a second circuit section (14) of the voltage converter (10), wherein the first circuit section (13) is electrically coupled to the second circuit section (14).

A module comprises a circuit element, a first circuit board, and a second circuit board laminated to the first circuit board with the circuit element sandwiched between them. A plurality of first pads, bonded to the circuit element by a plurality of first bonding elements, are arranged on a first principal surface of the first circuit board. A plurality of second pads, bonded to the circuit element by a plurality of second bonding elements, are arranged on a second principal surface of the second circuit board. The second circuit board has a lower bending stiffness than the first circuit board. The total area of ​​a portion of the plurality of second pads in contact with the plurality of second bonding elements is greater than the total area of ​​a portion of the plurality of first pads in contact with the plurality of first bonding elements.

Flexible circuit embodiments with high signal conductor density and high signal integrity are provided. An electrical communication system configured to be placed in electrical communication with the flexible circuit is described. Electrical communication systems are described that include an electrical connector that is selectively matable with an electrical connector mounted to a flexible circuit, and an electrical connector mounted to a substrate such as a printed circuit board (PCB).

A compression-defined broaching mount for compression-attached memory module (CAMM) includes a plurality of pins configured to retain a plurality of circuit boards in a compressed position. The pins may include a snap-pin, a push-pin, and / or a spring-loaded pin. The pin is removable. The CAMM may include a flat washer and / or a counter-sunk washer configured to receive the pin. The counter-sunk washer may have an opening to a chamber therein, where an inner surface of the chamber has a channel to receive a locking member of the pin. The CAMM may include a compressible material to exert a force when the pin is in a locked position. The compressible material may include an O-ring, a gasket, and / or a film. The CAMM may include a visual compression indicator.

A wiring board includes a first insulating layer, a second insulating layer, a first ground conductor, and a first signal conductor. The first insulating layer includes a first upper surface and a first lower surface. The second insulating layer is positioned on the first insulating layer and includes a second upper surface and a second lower surface. The first ground conductor is positioned on the first lower surface and includes a first opening and a second opening. The first signal conductor includes a first line positioned on the first upper surface and a second line positioned on the second lower surface. The first line includes a first end portion and a first line portion. The second line includes a second end portion electrically connected to the first end portion, and a second line portion. The first opening is larger in area than the second opening in a planar view.

A display device (10) is provided. The display device (1) includes an auxiliary substrate (200), a display substrate (100), and a circuit board (300). The auxiliary substrate (200) includes an auxiliary circuit (202). The display substrate (100) is disposed on the auxiliary substrate (200). The display substrate (100) includes a circuit (102). The circuit board (300) is electrically connected to the auxiliary substrate (200). The circuit (102) of the display substrate (100) is electrically connected to the auxiliary circuit (202) through a first conductive via (104), and the circuit board (300) provides a signal to the auxiliary circuit (202).

An electrical connection according to the invention comprises superimposing a flexible printed circuit board (200) onto a rigid printed circuit board (100) by aligning a hole (231) in a contact area (230) of the flexible circuit with a plated-through hole (131) of the rigid circuit. A connecting pin (300) made of conductive material is then inserted through the hole in the flexible circuit such that a first press-fit end (310) of the connecting pin is inserted into the plated-through hole, and an opposite end (320) of the connecting pin holds the flexible circuit against the rigid circuit by pressing against the contact area. By being in contact with the contact area and with the plated-through hole, the connecting pin establishes an electrical connection between the two printed circuit boards without requiring an additional connecting component on the flexible circuit. (See Fig. 3 for abbreviations.)

Systems, structures, packages, circuits, and methods provide winding-less transformer structures, sub-assemblies and assemblies. Larger substate panels, e.g., a PCB or other type of substrate, can be constructed with designated locations in smaller subunits for transformer cores, which when placed at those designated locations create portions of transformers. The cores can be affixed onto the larger panels, which can then be partitioned or broken into smaller parts that can each form a subassembly. The subassemblies can then be combined with appropriate matching structures to complete the coil structures for the transformers. One or more integrated circuits such as gate drivers may be included with transformer sub-assemblies, assemblies, packages or modules.

A compression-defined broaching mount for compression-attached memory module (CAMM) includes a plurality of pins configured to retain a plurality of circuit boards in a compressed position. The pins may include a snap-pin, a push-pin, and / or a spring-loaded pin. The pin is removable. The CAMM may include a flat washer and / or a counter-sunk washer configured to receive the pin. The counter-sunk washer may have an opening to a chamber therein, where an inner surface of the chamber has a channel to receive a locking member of the pin. The CAMM may include a compressible material to exert a force when the pin is in a locked position. The compressible material may include an O-ring, a gasket, and / or a film. The CAMM may include a visual compression indicator.

A substrate structure includes a first substrate and a second substrate. The first substrate includes a first dielectric substrate, at least one first conductive via, at least one first conductive pad, a first bonding layer, and a first electroless metal layer. The second substrate includes a second dielectric substrate, at least one second conductive via, at least one second conductive pad a second bonding layer, and a second electroless metal layer. The second substrate is bonded to the first substrate, wherein the second bonding layer is bonded to the first bonding layer to define a non-metallic contact interface, and the second electroless metal layer is bonded to the first electroless metal layer to define a metal bonding contact interface.

A voltage converter (10) is provided, comprising:-a first circuit board (11) having a first circuit section (13) of the voltage converter (10), the first circuit section (13) comprising a semiconductor chip (15) embedded between metal layers of the first circuit board (11), and-a second circuit board (12) having a second circuit section (13) of the voltage converter (10), the second circuit section (13) comprising a semiconductor chip (15) embedded between metal layers of the first circuit board (11), the second circuit board has a second circuit section (14) of the voltage converter (10), wherein the first circuit section (13) is electrically coupled to the second circuit section (14).

In one embodiment, a printed circuit board includes a first circuit board portion comprising a set of first conducting layers and one or more plated through hole (PTH) vias formed through the first conducting layers and a second circuit board portion comprising a set of second conducting layers. The second circuit board portion has an area less than an area of the first circuit board portion, and the second circuit board portion is coupled to the first circuit board portion via a laminate layer such that the first and second conducting layers are parallel with one another. The printed circuit board further includes one or more PTH vias formed through the first and second conducting layers in an area of the printed circuit board where the first and second circuit board portions overlap.

Disclosed herein is a device that provides for high power transfer. The device may include a printed circuit board and a package substrate disposed on the printed circuit board. The device may also include a plurality of high-power voltage regulators disposed on and electrically connected to the package substrate. The device may also include a plurality of low-power voltage regulators disposed on and electrically connected to the printed circuit board.

Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including at least two posts having different widths. In an embodiment, a system can include a first substrate having a first layer comprising a first post having a first width and a second layer coupled to the first layer and comprising an external surface of the first substrate and a second post having a second width connected to the first post. The first width can be less than the second width. The system can further include a solder connected to the second post and configured to connect the second post to a first connector on a second substrate.