The invention relates to a
millimeter wave
active antenna unit and an inter-PCB (
Printed Circuit Board)
interconnection structure. The inter-PCB
interconnection structure comprises a main board and anAIP (Antenna in
package) antenna module. The main board is a first multilayer PCB and provided with a
signal transmission line and a first pad electrically connected with the
signal transmission line. The AIP antenna module is a second multilayer PCB and provided with a second pad, an
impedance matching transmission
branch, an impedance line and a
signal processing circuit. The main board and theAIP antenna module adopts a mode of direct
welding interconnection between the multilayer PCBs, thereby saving an expensive
millimeter wave interconnection
assembly on the one hand, and thus being very low in cost; On the other hand, the mode of direct
welding between the boards improves the reliability of the product, the interconnection design between the multilayer PCBs can be realized, and the integration between the multilayer PCBs is greatly improved, thereby being conducive to the
miniaturization design of
millimeter wave equipment. In addition, the second pad and the signal processingcircuit are provided with the
impedance matching transformation
branch and the impedance line therebetween, thereby being suitable for a wider frequency range and a wider lamination number range.