Printed circuit board and method for fabricating the same, and apparatus for fabricating printed circuit board

A technology of printed circuit boards and manufacturing methods, which is applied in the direction of printed circuit manufacturing, stacked printed circuit boards, printed circuits, etc., can solve the problems of pollution, cost, and precision that cannot meet the development and application requirements of printed circuit boards, and achieve reduction Contamination, thickness reduction, process improvement and cost-effective effects

Inactive Publication Date: 2016-02-10
蔡莳铨 +1
View PDF6 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional screen printing and flat printing cannot meet the development and application requirements of printed circuit boards due to precision problems.
Moreover, the traditional way of manufacturing printed circuit boards still has serious pollution problems, and the disposal of waste solutions also costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board and method for fabricating the same, and apparatus for fabricating printed circuit board
  • Printed circuit board and method for fabricating the same, and apparatus for fabricating printed circuit board
  • Printed circuit board and method for fabricating the same, and apparatus for fabricating printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The following will clearly illustrate the spirit of the present invention with the accompanying drawings and detailed descriptions. Any person with common knowledge in the technical field can change and modify the technology taught by the present invention after understanding the preferred embodiments of the present invention. without departing from the spirit and scope of the present invention. And for the sake of clarity, many specific details will be described together in the following description. However, those skilled in the art will appreciate that in some embodiments of the present invention, these specific details are not necessary and should not be used to limit the present invention. In addition, for the sake of simplification of the drawings, some conventional structures and elements will be shown in a simple and schematic manner in the drawings.

[0030] see Figures 1A to 1F , Figures 1A to 1F It is a plan view and a schematic cross-sectional view of a m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention discloses a printed circuit board and a method for fabricating the same, and an apparatus for fabricating printed circuit board. The printed circuit board includes a substrate having an upper surface; a first trench recessed from the upper surface of the substrate; a first via formed in the first trench and penetrating through the substrate; and a first conductive layer disposed in the first trench and the first via, the first trench being electrically connected to the first via. A method for fabricating the printed circuit board and an apparatus for fabricating the printed circuit board are also disclosed. The method and device utilize an ink-jet printing technology to fabricate the printed circuit board, can substantially simplify a technological process of the printed circuit board, and compared with a traditional technological process, can save many complex processes, improve the technological process and cost effectiveness, and reduce the pollution problem in a fabricating process.

Description

technical field [0001] The invention relates to a printed circuit board and its manufacturing method, as well as a printed circuit board manufacturing device, and in particular to a printed circuit board manufactured by inkjet, its manufacturing method and the printed circuit board manufacturing device. Background technique [0002] Printed circuit boards are an indispensable component of electronic products. Electronic components can be connected together through circuits on the printed circuit board, and the overall function can be exerted. The traditional method of manufacturing printed circuit boards includes forming an insulating layer on the printed electroplating board substrate; then forming a metal layer on the insulating layer, such as copper foil or aluminum foil; then partially shielding according to the circuit design and etching the unshielded part to form a wire ; If the printed circuit board is a multi-layer circuit board, the next step is to start lamination...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/14H05K3/12H05K3/46
CPCH05K1/116H05K1/144H05K3/125H05K3/4644H05K2201/041H05K2201/096H05K2203/013H05K3/1258H05K3/4069H05K3/4617H05K3/462H05K3/465H05K3/4664H05K2201/09845H05K2203/1572
Inventor 蔡莳铨杨庆昌
Owner 蔡莳铨
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap