Method for preparing location hole of flexible circuit board

A flexible circuit board and manufacturing method technology, which is applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of inaccurate positioning holes, low efficiency, easy occurrence of waste products, etc., and achieve the effect of accurate position

Inactive Publication Date: 2008-10-08
华德环科暖通工程(泰州)有限公司
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  • Summary
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method of making positioning holes requires precise positioning of the semi-finished product because of the special setting of the positioning hole process, which often takes a long time and has low efficiency; due to the inev

Method used

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  • Method for preparing location hole of flexible circuit board

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Effect test

Embodiment Construction

[0020] see figure 1 , a method for manufacturing a positioning hole of a flexible circuit board of the present invention, the steps comprising:

[0021] ① Bottom hole and top hole opening: Bottom hole 30 corresponding to the position of the positioning hole 20 to be opened on the copper foil 2 is set on the bottom cover film 3, and the diameter of the bottom hole 30 is equal to the positioning hole 20 on the copper foil 2 The aperture plus the position error between the negative circle image on the negative film and the bottom hole 20 during exposure, for example, the aperture of the positioning hole 20 on the copper foil 2 is 2.0mm, and the negative circle image on the negative film during exposure The position error between the sexual circle image and the bottom hole 20 is 0.4mm, then the aperture of the bottom hole 30 is equal to 2.8mm;

[0022] On the top cover film 1, a top hole 10 corresponding to the position of the positioning hole 20 to be opened on the copper foil 2...

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Abstract

The invention is a manufacture method of a locating hole of a flexible breadboard, the steps of which include: (1) a bottom and a top covering films are provided with corresponding bottom holes and top holes at the position of the locating hole; (2) the bottom covering film is pressed on the back face of clutch gold; (3) a layer of sensitive dry film is respectively stuck on the positive face of the clutch gold and the bottom covering film; (4) the dry film on the positive face of the clutch gold is exposed by a negative with line images and negative round images corresponding to the locating hole so that the dry film of the bottom covering film has a throughout exposure; (5) the line images and the negative round images corresponding to the locating hole are represented on the positive face of the clutch gold so that the clutch gold without line part and locating hole part is exposed; (6) the exposed clutch gold is eliminated by etching liquid; (7) the remanent dry film is shucked off by pattern spray; (8) the top covering film is pressed on the positive face of the clutch gold so that the top hole is corresponding to the locating hole etched on the clutch gold. The application of the method enables the line and the locating hole to be formed simultaneously and guarantees the accuracy of locating hole position.

Description

technical field [0001] The invention relates to a method for manufacturing a flexible circuit board, in particular to a method for manufacturing a positioning hole of a flexible circuit board. Background technique [0002] Flexible circuit board (FPC) has the characteristics of light, thin, short and small, and is widely used in the fields of computers, communications, consumer electronics, automobiles, military and aerospace, medical and other electronic equipment, such as cameras, mobile phones, CD players, Notebook computer, high-speed inkjet printer magnetic head, etc. With the development of the flexible circuit board market becoming more and more mature, the market's requirements for the production speed and precision of flexible circuit boards continue to increase. Positioning holes to ensure the accuracy of punching and forming. At present, the production steps of positioning holes are as follows: ①Paste dry film: paste a layer of photosensitive dry film on the fro...

Claims

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Application Information

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IPC IPC(8): H05K3/02
Inventor 梅晓波
Owner 华德环科暖通工程(泰州)有限公司
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