Laser polishing device and method

A laser polishing and laser technology, which is applied in the polishing field, can solve the problems of reducing the efficiency of laser polishing and other problems, and achieve the effect of avoiding cracks.

Inactive Publication Date: 2018-11-20
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0003] In the existing technology, this problem can be solved to a certain extent by preheating technology and annealing technology, but new processing equipment needs to be added, and multiple processing procedures are required, which reduces the efficiency advantage of laser polishing

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  • Laser polishing device and method

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Embodiment Construction

[0044] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. The components of the embodiments of the application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0045] Accordingly, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art w...

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Abstract

The embodiment of the invention provides a laser polishing device and method, and relates to the technical field of polishing. According to the laser polishing device, an initial light beam emitted bya laser is split into a first light beam, a second light beam and a third light beam by a beam splitter, then the first light beam, the second light beam and the third light beam are received througha scanner and projected to a to-be-machined component, and a preheating light spot corresponding to the first light beam, a polishing light spot corresponding to the second light beam and an annealing light spot corresponding to the third light beam are formed on the to-be-machined component, so that the to-be-machined component is preheated and annealed while polishing treatment is conducted, and the situation that in the polishing process of brittle materials such as glass, thermal stress is generated due to the large temperature gradient, and consequently, cracks are generated on the machined component is avoided.

Description

technical field [0001] The present application relates to the technical field of polishing, in particular, to a laser polishing device and a polishing method. Background technique [0002] In the process of polishing brittle materials such as glass by laser, due to the large temperature gradient distribution, the thermal stress generated may cause cracks in the processing components. [0003] In the prior art, this problem can be solved to a certain extent through preheating technology and annealing technology, but new processing equipment needs to be added, and multiple processing procedures are required, which reduces the efficiency advantage of laser polishing. [0004] Therefore, for those skilled in the art, it is of great significance to study a laser polishing device integrating preheating and annealing functions. Contents of the invention [0005] In order to solve the above problems, the present application provides a laser polishing device and a polishing method...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/067B23K26/402C03B25/00
CPCB23K26/067B23K26/36B23K26/402C03B25/00
Inventor 许乔王度李亚国袁志刚金会良耿锋刘志超欧阳升刘朋朋王健张清华
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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