Laser polishing device and laser polishing method

A laser polishing and laser galvanometer technology, applied in the field of laser polishing, can solve the problems of low density, low precision and sensitivity, and inability to multi-axis linkage, and achieve the effect of improving polishing efficiency and quality, and high precision and sensitivity

Pending Publication Date: 2021-05-07
SHENZHEN INSTITUTE OF INFORMATION TECHNOLOGY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Titanium alloy has high strength and low density, good mechanical properties, good toughness and corrosion resistance. It is mainly used in aerospace and other fields. It is one of the most important alloy materials in the 21st century. Laser polishing currently on the market cannot be

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  • Laser polishing device and laser polishing method
  • Laser polishing device and laser polishing method
  • Laser polishing device and laser polishing method

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Embodiment Construction

[0034] It should be understood that the terminology used and specific structural and functional details disclosed herein are merely representative for describing specific embodiments, but the invention may be embodied in many alternative forms and should not be construed as merely Be limited by the examples set forth herein.

[0035] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating relative importance, or implicitly indicating the quantity of indicated technical features. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of these features; "plurality" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, possible presence or addition of one or more other features, integers, steps, operations, units, components and / or combinations thereof.

[0036]...

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Abstract

The invention discloses a laser polishing device and a laser polishing method. The laser polishing device comprises a main machine box, a rotary clamping mechanism, a laser system, a first control system and a second control system; the rotary clamping mechanism is arranged in the main machine box and used for clamping a metal piece to be polished; the laser system is arranged in the main machine box, the laser system comprises a laser transmitter and a laser galvanometer assembly, and the laser transmitter is connected with the laser galvanometer assembly; the first control system is electrically connected with the laser transmitter and is used for controlling the laser transmitter to carry out laser polishing on the metal piece according to preset laser parameters and a preset polishing range; and the second control system is electrically connected with the laser galvanometer assembly and the rotary clamping mechanism and used for driving the laser galvanometer assembly to move and driving the rotary clamping mechanism to rotate, and multi-axis linkage is achieved.

Description

technical field [0001] The invention relates to the technical field of laser polishing, in particular to a laser polishing device and a laser polishing method. Background technique [0002] As a new laser processing application technology, laser polishing technology uses a focused laser beam spot to act on the rough original metal surface, causing the melting and evaporation of a raised thin layer on the surface of the metal material, and the molten material is on the surface of the material itself It flows under the action of tension and gravity, fills the depressions on the metal surface and solidifies, and finally obtains the ideal surface of the polished material. [0003] Titanium alloy has high strength and low density, good mechanical properties, good toughness and corrosion resistance. It is mainly used in aerospace and other fields. It is one of the most important alloy materials in the 21st century. Laser polishing currently on the market cannot be multi-axis Link...

Claims

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Application Information

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IPC IPC(8): B23K26/352B23K26/70
CPCB23K26/3576B23K26/703
Inventor 赵振宇周浩肖永山帅词俊周后明李凯尹杰李佳霓
Owner SHENZHEN INSTITUTE OF INFORMATION TECHNOLOGY
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