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69results about How to "High energy laser" patented technology

Fast and efficient semiconductor laser cladding device with wide light beam and adjustable powder feeding angle

ActiveCN110144583AIncrease single pass cladding areaReduce the burden of rotationMetallic material coating processesLaser lightSurface modification
The invention belongs to the technical field of laser surface modification, and discloses a fast and efficient semiconductor laser cladding device with a wide light beam and an adjustable powder feeding angle. The fast and efficient semiconductor laser cladding device with the wide light beam and the adjustable powder feeding angle comprises a semiconductor laser (1), a light beam shaping and Fresnel focusing system (2), an adjustable wide light band powder feeding head (3), a powder feeder (6), a high-speed machine tool (5), a six-axis linkage robot (4) and a central control system (9), wherein the light beam shaping and Fresnel focusing system (2) is used for shaping a laser light and focusing to form a wide-light-band laser light; the adjustable wide light band powder feeding head (3) is used for conveying powder and the wide-light-band laser light on the surface of a large-scale shaft type workpiece to be processed; and the diameter of a workpiece is larger than 1000mm, and the length of the workpiece is not lower than 10m. According to the fast and efficient semiconductor laser cladding device with the wide light beam and the adjustable powder feeding angle provided by the invention, through improving structures and arrangement manners of key components, outer surface strengthening and surface repairing can be carried out aiming at the large-scale shaft type workpieces such as petroleum pipelines, ocean facilities, natural gas conveying, mining and tunnel piercing, so that the wear resistance and the corrosion resistance of the surface are improved, and the service life is greatly prolonged.
Owner:HUAZHONG UNIV OF SCI & TECH

Great-core-diameter optical fiber coupler and manufacturing method of great-core-diameter optical fiber coupler

ActiveCN104345388AHigh energy laserReduce the risk of distortionCoupling light guidesLight spotTransmittance
The invention discloses a great-core-diameter optical fiber coupler, which comprises an input optical fiber and n output optical fibers, wherein the n is greater than or equal to 1 but smaller than or equal to 6, the core diameter of the input optical fiber is 200 to 600mum, the core-to-sheath ratio range of the input optical fiber is 1:1.04 to 1:1.25, the core diameter of each output optical fiber is 200 to 400mum, the core-to-sheath ratio of the output optical fiber is identical to that of the input optical fiber, the input optical fiber and the output optical fibers are fixed and twisted in a coupling region, one end, in the coupling region, of the input optical fiber is the output end of the input optical fiber, the other end of the input optical fiber is the input end of the input optical fiber, one end, in the coupling region, of each output optical fiber is the input end of each output optical fiber, and the other end of each output optical fiber is the output end of the output optical fiber. The great-core-diameter optical fiber coupler has the advantages that the optical fiber coupling difficulty is low, the light splitting ratio of the coupler is uniform, the optical fiber uncoaxiality caused by optical fiber accumulation in the coupling region is reduced, the light spot divergence angle is smaller than 30 degrees, the transmittance is greater than 70 percent, any light splitting ratio can be realized, and the light splitting ratio deviation is +/-7 percent.
Owner:NANJING CHUNHUI SCI & TECH IND

Semiconductor laser therapeutic instrument

The invention relates to a semiconductor laser therapeutic instrument. The semiconductor laser therapeutic instrument comprises a control host and therapeutic heads; the control host comprises a frame, a power source device, a power source stabilizer, a processor, a laser driver, a frequency modulator and a cooling device; and the therapeutic heads comprise a first therapeutic head and a second therapeutic head. According to the semiconductor laser therapeutic instrument of the invention, a whole therapeutic process is a physical therapeutic process, a patient will feel painless, the semiconductor laser therapeutic instrument is non-toxic and side effect-free; weak laser of which the wavelength is 650nm has a biological stimulation effect, and can promote bio-chemical reaction, increase the permeability of cell membranes and the activity of some enzymes, and strengthen metabolism, and therefore, the ribonucleic acid in cells can be synthetized, activity can be strengthened, protein synthesis can be strengthened, and the content of glycogen of an irradiated portion can be increased, and an ATP function can be enhanced, and thus, local blood circulation can be improved, absorption and dissipation of inflammation can be promoted. The semiconductor laser therapeutic instrument of the invention is non-invasive, side effect-free, safe and reliable, and has an obvious therapeutic effect.
Owner:福建省民众医疗科技集团有限公司

Small-taper high-quality efficient machining device and method for via holes in surface of packaging substrate

The invention discloses a small-taper high-quality efficient machining device and method for via holes in the surface of a packaging substrate. According to the method, firstly, an ultrasonic vibration auxiliary laser machining system is built, then the packaging substrate is cleaned and clamped on a clamp for laser drilling, and a precise movement workbench is controlled to focus laser on the upper surface of the packaging substrate; then, the coupling vibration frequency of the packaging substrate is searched through an ultrasonic vibration auxiliary device, and ultrasonic vibration parameters are set; laser processing parameters are set through a computer, a laser scanning track is drawn, and scanning track parameters are set; then, a computer controls a short pulse laser to output laser, an ultrasonic vibration device is started at the same time, and a scanning galvanometer is used for controlling the laser to conduct via hole machining on the packaging substrate along a set path; and after the via holes are machined, the packaging substrate is cleaned to obtain a finished product. According to the method, laser processing is assisted by ultrasonic vibration, and material removal is carried out by adopting a laser multi-ring cutting processing track, so that the taper of the via holes is reduced, and the machining efficiency is greatly improved.
Owner:XI AN JIAOTONG UNIV
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