Fast and efficient semiconductor laser cladding device with wide light beam and adjustable powder feeding angle
A laser cladding and semiconductor technology, which is applied to the surface treatment of semiconductor lasers. , In the field of fast and efficient semiconductor laser cladding devices, it can solve the problems of small increase in cladding area, high risk, and heavy burden on lathes, and achieve the effect of increasing single-pass cladding area, increasing cladding layer width, and reducing rotation burden
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[0036] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0037] The purpose of the special device designed by the present invention is very clear, which is to solve the laser surface treatment device and process problem of the surface modification efficiency of the super large shaft workpiece, and can be applied to the surface of the large shaft workpiece with a diameter greater than 1000mm and a length of not less than 10m. Perform laser cladding treatment....
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