Adhesive and preparation method thereof as well as preparation technology of halogen-free aluminium base copper-clad plate based on adhesive

An aluminum-based copper clad laminate and adhesive technology, applied in the directions of adhesives, adhesive types, chemical instruments and methods, etc., can solve the problems of poor insulation layer reliability, poor heat resistance, and difficulty in increasing the amount of filler added to achieve insulation. Excellent reliability, broad market prospects, and the effect of increasing the addition rate

Active Publication Date: 2014-05-07
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

At present, the main factors that restrict my country's aluminum substrates from going international are the low thermal conductivity of the insulating layer and the poor reliability of the insulating layer.
[0003] At present, the high thermal conductivity aluminum substrate in the domestic market, the insulating layer adopts glass fiber and inorganic filler reinforced epoxy resin adhesive system or inorganic filler reinforced epoxy resin adhesive system, the amount of filler added in the former adhesive is difficult to increase, and the thermal conductivity is generally ≤ 1.0w/m.k, and there is a bad bond bet...

Method used

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  • Adhesive and preparation method thereof as well as preparation technology of halogen-free aluminium base copper-clad plate based on adhesive
  • Adhesive and preparation method thereof as well as preparation technology of halogen-free aluminium base copper-clad plate based on adhesive

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preparation example Construction

[0023] The present invention also proposes a kind of preparation method of adhesive, comprises the following steps:

[0024] 1) Proportion and pretreatment of inorganic fillers

[0025] Compound one or more inorganic fillers among alumina, aluminum nitride, and boron nitride, and select spherical fillers and irregular fillers to cooperate with each other. The large particle size, medium particle size and small particle size are combined with each other. The D50 with a diameter of 9-15 microns is used for fillers, the D50 with a medium particle size is 4-6 microns, and the D50 with a small particle size is 0.5-2 microns. The weight percentage of large, medium and small fillers in the glue system is 75-81%, add a mixed solution of KH560 and propylene glycol methyl ether with a weight ratio of 1-2% of the glue system to the above filler, and treat it in a ball mill for 2-4 hours. Mix well and mix well.

[0026] 2) Add rubber-modified epoxy resin to improve the toughness of the ...

Embodiment 1

[0034] The composition and mass percentage of the insulating layer of the aluminum-based copper-clad laminate in this example: phosphorus-containing epoxy resin, rubber-toughened epoxy resin are 7-10%, 4-10%, novolac resin 2-4%, and propylene glycol methyl Dissolve 0.01-0.03% of diphenylimidazole or diethylimidazole in ether, use a ball mill to process the mixture of D504-6 micron 75% spherical AlN and 0.5-1% KH560 and propylene glycol methyl ether for 2-4h, and the rest is solvent; The two materials are mixed together and stirred by vacuum heating to make epoxy resin adhesive.

[0035] The manufacturing process of aluminum-based copper clad laminates, the steps are:

[0036] a. Dry non-woven grinding on the aluminum plate, the surface roughness of the polished aluminum plate is controlled at Ra0.5-1.0, Rz3.0-5.0;

[0037] b. Coat the adhesive on the surface of the aluminum plate by screen printing, and pre-cure the insulating coating by infrared heating. The oven temperature...

Embodiment 2

[0040] The composition and mass percentage of the insulating layer of the aluminum-based copper-clad laminate in this example: phosphorus-containing epoxy resin, rubber-toughened epoxy resin are 7-10%, 4-10%, novolac resin 2-4%, and propylene glycol methyl Ether dissolve diphenylimidazole or diethylimidazole 0.01-0.03%, use ball mill to process D509-15 micron 60% irregular Al 2 o 3 , D504-6 micron spherical mixture of 21% AlN and 0.5-1% KH560 and propylene glycol methyl ether for 2-4h, and the rest is a solvent; mix various materials together and stir them by vacuum heating to make epoxy resin adhesive.

[0041] The manufacturing process of aluminum-based copper clad laminates, the steps are:

[0042] a. Degrease, polish and anodize the aluminum plate;

[0043] b. Coat the adhesive on the surface of the aluminum plate by screen printing, and pre-cure the insulating coating by infrared heating. The oven temperature is set in sections: 120-140°C; 140-160°C; 160-180°C ; 140-150 ...

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Abstract

The invention discloses adhesive and a preparation method thereof as well as a preparation technology of a halogen-free aluminium base copper-clad plate based on the adhesive. The adhesive comprises an inorganic filler, KH560 and propylene glycol monomethyl ether, wherein the weight of the KH560 accounts for 0.5%-1% of the total weight of the inorganic filler, and the KH560 and the propylene glycol monomethyl ether are mixed according to a mass ratio being 1: 1; and the inorganic filler is one or combination of several of aluminium oxide, aluminium nitride and boron nitride which are different in grain diameters and are spherical or irregular. The preparation method and the preparation technology have the advantages that the interfacial problem between expoxy resin and the inorganic filler is solved by pretreating the filler, so that the addition rate of the filler in an adhesive system is increased, the heat conductivity of an insulating layer is also obviously improved, and a technology of using silk-screen printing for coating an aluminium plate solves the problem that a thick copper foil aluminium substrate obtained by using a conventional technology is difficult to glue.

Description

technical field [0001] The invention belongs to the technical field of electronic component material preparation, and relates to the preparation of aluminum-based copper-clad laminates, in particular to an adhesive and a preparation process for a halogen-free aluminum-based copper-clad laminate based on the same. Background technique [0002] With the development of the electronic industry, electronic components require higher power and higher density. The use of aluminum-based copper clad laminates can solve the heat dissipation and life problems caused by the above requirements. At present, the main factor that restricts my country's aluminum substrates from going international is that the thermal conductivity of the insulating layer is not high, and the reliability of the insulating layer is not good. [0003] At present, the high thermal conductivity aluminum substrate in the domestic market, the insulating layer adopts glass fiber and inorganic filler reinforced epoxy ...

Claims

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Application Information

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IPC IPC(8): C09J11/04C09J163/00C09J161/06B32B37/12B32B7/12B32B15/20
Inventor 吴雅惠曾耀德武伟
Owner SHAANXI SHENGYI TECH
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